Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx Inc. |
IC PROM SER 200K C-TEMP 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.392 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 36K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione11.892 |
|
36kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH CONFIG 4M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione5.008 |
|
4Mb | 2.97 V ~ 3.63 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC CONFIG SEEPROM 1M 3.3V 32TQFP
|
pacchetto: 32-TQFP |
Azione3.088 |
|
1Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione8.916 |
|
2Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.968 |
|
1Mb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 32TQFP
|
pacchetto: 32-TQFP |
Azione3.760 |
|
2Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 32-TQFP | 32-TQFP (7x7) |
||
Xilinx Inc. |
IC PROM SER 50000 C-TEMP 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione12.840 |
|
500kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM PROG C-TEMP 3.3V 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione15.252 |
|
400kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER 150K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione81.168 |
|
1.5Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER 10K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione60.816 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC 3V PROM PROG 50K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.520 |
|
50kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER C-TEMP 512K 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione7.328 |
|
512kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SER I-TEMP 512K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione5.904 |
|
512kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER C-TEMP 512K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione13.524 |
|
512kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC SERIAL CFG PROM 256K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.008 |
|
256Kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Microchip Technology |
IC EEPROM FPGA 65KB 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.952 |
|
64kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC SERIAL CONFIG PROM 2M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione4.800 |
|
2Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC CONFIG DEVICE 440KBIT 32TQFP
|
pacchetto: 32-TQFP |
Azione14.496 |
|
440kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CONFIG SEEPROM 512K 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione219.564 |
|
512kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC CONFIG DEVICE 256MBIT 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione23.040 |
|
256Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Xilinx Inc. |
IC PROM SRL 128M GATE 64-FTBGA
|
pacchetto: 64-TBGA |
Azione24.768 |
|
128Mb | 1.7 V ~ 2 V | -40°C ~ 85°C | 64-TBGA | 64-FTBGA (10x13) |
||
Xilinx Inc. |
IC PROM SRL FOR 2M GATE 20-TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione211.536 |
|
2Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Intel |
IC CONFIG DEVICE 88UBGA
|
pacchetto: 88-LFBGA |
Azione6.688 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 88-LFBGA | 88-UBGA (11x8) |
||
Intel |
IC CONFIG DEVICE 100QFP
|
pacchetto: 100-BQFP |
Azione3.360 |
|
4MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 4MBIT 100QFP
|
pacchetto: 100-BQFP |
Azione6.960 |
|
4MB | 3 V ~ 3.6 V | -40°C ~ 85°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 1.6MBIT 32TQFP
|
pacchetto: 32-TQFP |
Azione5.888 |
|
1.6Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 32-TQFP | 32-TQFP (7x7) |
||
Intel |
IC CONFIG DEVICE 1.6MBIT 32TQFP
|
pacchetto: 32-TQFP |
Azione6.400 |
|
1.6Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 32-TQFP | 32-TQFP (7x7) |
||
Intel |
IC CONFIG DEVICE 4MBIT 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione11.316 |
|
4MB | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
AMD |
CONFIG MEMORY, 2MX1, SERIAL
|
pacchetto: - |
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