Prodotti Epson Electronics America Inc-Semiconductor Div

S1F81100F5R2000

Epson Electronics America Inc-Semiconductor Div

IC REG CTRLR 48QFP

• Output Type: -
• Function: -
• Output Configuration: -
• Topology: -
• Number of Outputs: 4
• Output Phases: -
• Voltage - Supply (Vcc/Vdd): 2.8 V ~ 5.5 V
• Frequency - Switching: -
• Duty Cycle (Max): -
• Synchronous Rectifier: -
• Clock Sync: -
• Serial Interfaces: -
• Control Features: -
• Operating Temperature: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-QFP (7x7)

pacchetto: 48-LQFP

S1F78520M0A0100

Epson Electronics America Inc-Semiconductor Div

IC REG CHRG PUMP STEP-DN 24-SSOP

• Applications: -
• Current - Supply: 100µA
• Voltage - Supply: 3.6 V ~ 5.5 V
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 24-LSSOP (0.220", 5.60mm Width)
• Supplier Device Package: 24-SSOP

pacchetto: 24-LSSOP (0.220", 5.60mm Width)

S1D13515F00A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 256LBGA

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 256-LQFP
• Supplier Device Package: 256-QFP (28x28)

pacchetto: 256-LQFP

S1D15712D01B000

Epson Electronics America Inc-Semiconductor Div

IC DRIVER LCD

• Type: Display Driver
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Chip

pacchetto: Die

S1D13743F00A200

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 144QFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-QFP (20x20)

pacchetto: 144-LQFP

S1D13L04F00A100

Epson Electronics America Inc-Semiconductor Div

IC LCD CONTROLLER 208-QFP

• Type: Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 208-LQFP
• Supplier Device Package: 208-QFP (28x28)

pacchetto: 208-LQFP

S1D13L01F00A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 128QFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 128-LQFP
• Supplier Device Package: 128-QFP (14x14)

pacchetto: 128-LQFP

S1D13A04F00A

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 128TQFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 128-TQFP
• Supplier Device Package: 128-TQFP (14x14)

pacchetto: 128-TQFP

S1R720G0F00A000

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 2.0 64-QFP

• Protocol: -
• Function: -
• Interface: -
• Standards: -
• Voltage - Supply: 3.3V
• Current - Supply: -
• Operating Temperature: -
• Package / Case: 64-QFP
• Supplier Device Package: -

pacchetto: 64-QFP

S1R72901F00A

Epson Electronics America Inc-Semiconductor Div

IC LINK CTRLR/PHY 1394 100-QFP

• Protocol: -
• Function: -
• Interface: -
• Standards: -
• Voltage - Supply: 3.3V
• Current - Supply: -
• Operating Temperature: -
• Package / Case: 100-QFP
• Supplier Device Package: -

pacchetto: 100-QFP

S1R72C05F15E100

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 128QFP

• Protocol: USB
• Function: Host Controller
• Interface: USB
• Standards: USB 2.0
• Voltage - Supply: 1.8V, 3.3V
• Current - Supply: 75mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 128-LQFP
• Supplier Device Package: 128-LQFP (14x14)

pacchetto: 128-LQFP

S1R72V17F00C200

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 80QFP

• Protocol: USB
• Function: Host Controller
• Interface: USB
• Standards: USB 2.0
• Voltage - Supply: 1.8V, 3.3V
• Current - Supply: 39.3mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-LQFP
• Supplier Device Package: 80-QFP (12x12)

pacchetto: 80-LQFP

S1R72V17B00A200

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 60BGA

• Protocol: USB
• Function: Host Controller
• Interface: USB
• Standards: USB 2.0
• Voltage - Supply: 1.8V, 3.3V
• Current - Supply: 39.3mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 60-TFBGA
• Supplier Device Package: 60-FBGA (5x5)

pacchetto: 60-TFBGA

S1C17704B402100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 161VFBGA

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 8.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: LCD, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 161-VFBGA
• Supplier Device Package: 161-VFBGA (7x7)

pacchetto: 161-VFBGA

S1C17W22F101100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 128TQFP

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 4.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: LCD, PWM, RFC, WDT
• Number of I/O: 41
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.2 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 128-TQFP
• Supplier Device Package: 128-TQFP (14x14)

pacchetto: 128-TQFP

S1C17F57D402000

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH DIE

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 4.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: PWM, WDT
• Number of I/O: 29
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: Die
• Supplier Device Package: -

pacchetto: Die

S1C17F57D00E200

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH DIE

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 4.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: PWM, WDT
• Number of I/O: 29
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: Die
• Supplier Device Package: -

pacchetto: Die

S1C17W22D101100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH DIE

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 4.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: LCD, PWM, RFC, WDT
• Number of I/O: 41
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.2 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: Die
• Supplier Device Package: Die

pacchetto: Die

S1C17M13F101100

Epson Electronics America Inc-Semiconductor Div

16-BIT SNGL CHIP MICROCONTROLLER

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 16.8MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
• Number of I/O: 38
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-TQFP
• Supplier Device Package: 48-TQFP (7x7)

pacchetto: 48-TQFP

S1C17F57F401100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 128QFP

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 4.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: PWM, WDT
• Number of I/O: 29
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 128-LQFP
• Supplier Device Package: -

pacchetto: 128-LQFP

S7U4E0020030000

Epson Electronics America Inc-Semiconductor Div

MICRO GPS EVALUATION MODULE

• Type: GPS Receiver
• Frequency: 1575MHz
• For Use With/Related Products: -
• Supplied Contents: Module

pacchetto: -

S1V30080F0*A*00

Epson Electronics America Inc-Semiconductor Div

MELODY & VOICE IC

• Function: Voice Processor
• Applications: Signal Mixing
• Number of Channels: 1
• Interface: I²C, SPI
• Voltage - Supply: 2.2 V ~ 5.5 V
• Operating Temperature: -
• Specifications: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-QFP12 (7x7)

pacchetto: 48-LQFP

S1C17W36F001100

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 384KB FLASH 16

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

S1C17W15F003100-260

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 64KB FLASH 4KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

S1C17W03F101100-250

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ16KB FLASH 2KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

S1C17W03F102100-490

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ16KB FLASH 2KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

S2D13P04F00A100-90

Epson Electronics America Inc-Semiconductor Div

CAMERA INTERFACE CHIP WITH 4 CHA

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-QFP15 (14x14)

pacchetto: 100-LQFP

S1D13719B00B100-240

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 512KB SR

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 180-TFBGA
• Supplier Device Package: 180-PFBGA (10x10)

pacchetto: 180-TFBGA

S1D13L04F00A100-36

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER UP TO 16MB EXTERN

• Type: Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 208-LQFP
• Supplier Device Package: 208-QFP22 (28x28)

pacchetto: 208-LQFP

S1D13U11F00A100

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER UP TO 16MB EXTERN

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-QFP20 (20x20)

pacchetto: 144-LQFP