Pagina 4 - Integrato - System On Chip (SoC) | Circuiti integrati (CI) | Heisener Electronics
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Integrato - System On Chip (SoC)

Record 2.668
Pagina  4/89
Immagine
Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
Core Processor
Flash Size
RAM Size
Peripherals
Connectivity
Speed
Primary Attributes
Operating Temperature
Package / Case
Supplier Device Package
10AS032H2F35I1SG
Altera

IC SOC FPGA 384 I/O 1152FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 320K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
pacchetto: 1152-BBGA, FCBGA
Azione2.208
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 320K Logic Elements
-40°C ~ 100°C (TJ)
1152-BBGA, FCBGA
1152-FBGA (35x35)
M2S090-1FG676IX417
Microsemi Corporation

IC FPGA SOC 90K LUTS 676FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 90K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
Azione3.744
ARM? Cortex?-M3
512KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 90K Logic Modules
-40°C ~ 100°C (TJ)
-
-
M2S100-1FC1152I
Microsemi Corporation

IC FPGA SOC 100K LUTS 1152FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 100K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
pacchetto: 1152-BBGA, FCBGA
Azione6.352
ARM? Cortex?-M3
512KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 100K Logic Modules
-40°C ~ 100°C (TJ)
1152-BBGA, FCBGA
1152-FCBGA (35x35)
M2S050T-FGG896ES
Microsemi Corporation

IC SOC ENG SMPL MCU/FPGA 896FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 50K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 896-FBGA
  • Supplier Device Package: 896-FBGA (31x31)
pacchetto: 896-FBGA
Azione7.024
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 50K Logic Modules
0°C ~ 85°C (TJ)
896-FBGA
896-FBGA (31x31)
A2F200M3F-1FGG256I
Microsemi Corporation

IC FPGA 200K GATES 256KB 256-BGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Speed: 100MHz
  • Primary Attributes: ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FBGA (17x17)
pacchetto: 256-LBGA
Azione4.176
ARM? Cortex?-M3
256KB
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, SPI, UART/USART
100MHz
ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops
-40°C ~ 100°C (TJ)
256-LBGA
256-FBGA (17x17)
5ASXMB5E4F31I3N
Altera

IC FPGA 170 I/O 896FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: FPGA - 462K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 896-BBGA, FCBGA
  • Supplier Device Package: 896-FBGA (31x31)
pacchetto: 896-BBGA, FCBGA
Azione5.568
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz
FPGA - 462K Logic Elements
-40°C ~ 100°C (TJ)
896-BBGA, FCBGA
896-FBGA (31x31)
10AS066H4F34I3LG
Altera

IC SOC FPGA 492 I/O 1152FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 660K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
pacchetto: 1152-BBGA, FCBGA
Azione3.008
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 660K Logic Elements
-40°C ~ 100°C (TJ)
1152-BBGA, FCBGA
1152-FCBGA (35x35)
5CSXFC5D6F31I7N
Altera

IC FPGA 288 I/O 896FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: FPGA - 85K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 896-BGA
  • Supplier Device Package: 896-FBGA (31x31)
pacchetto: 896-BGA
Azione7.328
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
64KB
DMA, POR, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz
FPGA - 85K Logic Elements
-40°C ~ 100°C (TJ)
896-BGA
896-FBGA (31x31)
XCZU17EG-2FFVD1760E
Xilinx Inc.

IC FPGA 308 I/O 1760FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
pacchetto: 1760-BBGA, FCBGA
Azione3.968
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.5GHz
Zynq?UltraScale+? FPGA, 926K+ Logic Cells
0°C ~ 100°C (TJ)
1760-BBGA, FCBGA
1760-FCBGA (42.5x42.5)
XCZU9EG-2FFVB1156I
Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
pacchetto: 1156-BBGA, FCBGA
Azione7.696
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.5GHz
Zynq?UltraScale+? FPGA, 599K+ Logic Cells
-40°C ~ 100°C (TJ)
1156-BBGA, FCBGA
1156-FCBGA (35x35)
XCZU6CG-L2FFVB1156E
Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.3GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 469K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
pacchetto: 1156-BBGA, FCBGA
Azione7.248
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq?UltraScale+? FPGA, 469K+ Logic Cells
0°C ~ 100°C (TJ)
1156-BBGA, FCBGA
1156-FCBGA (35x35)
XCZU11EG-1FFVB1517E
Xilinx Inc.

IC FPGA 488 I/O 1517FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
pacchetto: 1517-BBGA, FCBGA
Azione6.400
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.5GHz
Zynq?UltraScale+? FPGA, 653K+ Logic Cells
0°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
XC7Z045-2FF900I
Xilinx Inc.

XC7Z045-2FF900I

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex?-7 FPGA, 350K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
pacchetto: 900-BBGA, FCBGA
Azione4.224
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz
Kintex?-7 FPGA, 350K Logic Cells
-40°C ~ 100°C (TJ)
900-BBGA, FCBGA
900-FCBGA (31x31)
M2S150T-1FCS536I
Microsemi Corporation

IC FPGA SOC 150K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 536-LFBGA
  • Supplier Device Package: 536-BGA (16x16)
pacchetto: 536-LFBGA
Azione4.160
ARM? Cortex?-M3
512KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 150K Logic Modules
-40°C ~ 100°C (TJ)
536-LFBGA
536-BGA (16x16)
M2S150T-FCSG536I
Microsemi Corporation

IC FPGA SOC 150K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 536-LFBGA
  • Supplier Device Package: 536-BGA (16x16)
pacchetto: 536-LFBGA
Azione6.016
ARM? Cortex?-M3
512KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 150K Logic Modules
-40°C ~ 100°C (TJ)
536-LFBGA
536-BGA (16x16)
M2S150-1FCG1152
Microsemi Corporation

IC FPGA SOC 150K LUTS 1152FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
pacchetto: 1152-BBGA, FCBGA
Azione4.928
ARM? Cortex?-M3
512KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 150K Logic Modules
0°C ~ 85°C (TJ)
1152-BBGA, FCBGA
1152-FCBGA (35x35)
M2S150T-FC1152
Microsemi Corporation

IC FPGA SOC 150K LUTS 1152FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
pacchetto: 1152-BBGA, FCBGA
Azione3.984
ARM? Cortex?-M3
512KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 150K Logic Modules
0°C ~ 85°C (TJ)
1152-BBGA, FCBGA
1152-FCBGA (35x35)
XCZU2CG-1SFVC784I
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.3GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
pacchetto: 784-BBGA, FCBGA
Azione3.776
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq?UltraScale+? FPGA, 103K+ Logic Cells
-40°C ~ 100°C (TJ)
784-BBGA, FCBGA
784-FCBGA (23x23)
M2S060T-1VF400I
Microsemi Corporation

IC FPGA SOC 60K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 60K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 400-LFBGA
  • Supplier Device Package: 400-VFBGA (17x17)
pacchetto: 400-LFBGA
Azione6.272
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 60K Logic Modules
-40°C ~ 100°C (TJ)
400-LFBGA
400-VFBGA (17x17)
M2S060-1FG484
Microsemi Corporation

IC FPGA SOC 60K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 60K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FPBGA (23x23)
pacchetto: 484-BGA
Azione3.008
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 60K Logic Modules
0°C ~ 85°C (TJ)
484-BGA
484-FPBGA (23x23)
M2S025TS-FCSG325I
Microsemi Corporation

IC FPGA SOC 25K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 25K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 325-TFBGA
  • Supplier Device Package: 325-BGA (11x11)
pacchetto: 325-TFBGA
Azione6.544
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 25K Logic Modules
-40°C ~ 100°C (TJ)
325-TFBGA
325-BGA (11x11)
10AS066N3F40I2SGES
Intel

IC SOC FPGA 588 I/O 1517FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 660K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
pacchetto: 1517-BBGA, FCBGA
Azione6.576
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 660K Logic Elements
-40°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
1SX280LN3F43I2LG
Intel

1760-PIN FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2800K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
Azione3.264
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 2800K Logic Elements
-40°C ~ 100°C (TJ)
-
-
1SX250LU2F50E2VG
Intel

2397-PIN FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2500K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
Azione4.624
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 2500K Logic Elements
0°C ~ 100°C (TJ)
-
-
5ASXBB5D4F40C4N
Intel

IC FPGA 528 I/O 1517FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 925MHz
  • Primary Attributes: FPGA - 462K Logic Elements
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA
  • Supplier Device Package: 1517-FBGA (40x40)
pacchetto: 1517-BBGA
Azione6.832
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
925MHz
FPGA - 462K Logic Elements
0°C ~ 85°C (TJ)
1517-BBGA
1517-FBGA (40x40)
10AS057H4F34I3LG
Intel

IC SOC FPGA 492 I/O 1152FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 570K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
pacchetto: 1152-BBGA, FCBGA
Azione3.648
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 570K Logic Elements
-40°C ~ 100°C (TJ)
1152-BBGA, FCBGA
1152-FCBGA (35x35)
5ASXBB3D4F31I5N
Intel

IC FPGA 170 I/O 896FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: FPGA - 350K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 896-BBGA, FCBGA
  • Supplier Device Package: 896-FBGA (31x31)
pacchetto: 896-BBGA, FCBGA
Azione5.376
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz
FPGA - 350K Logic Elements
-40°C ~ 100°C (TJ)
896-BBGA, FCBGA
896-FBGA (31x31)
10AS016C3U19E2LG
Intel

IC SOC FPGA 192 I/O 484UBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 160K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 484-BFBGA, FCBGA
  • Supplier Device Package: 484-UBGA (19x19)
pacchetto: 484-BFBGA, FCBGA
Azione3.248
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 160K Logic Elements
0°C ~ 100°C (TJ)
484-BFBGA, FCBGA
484-UBGA (19x19)
5CSEMA2U23C8N
Intel

IC FPGA 188 I/O 672UBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz
  • Primary Attributes: FPGA - 25K Logic Elements
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-FBGA
  • Supplier Device Package: 672-UBGA (23x23)
pacchetto: 672-FBGA
Azione6.304
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
64KB
DMA, POR, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz
FPGA - 25K Logic Elements
0°C ~ 85°C (TJ)
672-FBGA
672-UBGA (23x23)
BCM3384DSA01
Broadcom Limited

24X8 DOCSIS 3.0 MODEM 3384D

  • Architecture: -
  • Core Processor: -
  • Flash Size: -
  • RAM Size: -
  • Peripherals: -
  • Connectivity: -
  • Speed: -
  • Primary Attributes: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
Azione7.712
-
-
-
-
-
-
-
-
-
-