Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Input Type | Output Type | Interface | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC SWITCH PROX INDCT PDSO-16
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione3.984 |
|
Analog | Analog | - | 550µA | -40°C ~ 110°C | - | 16-SOIC (0.154", 3.90mm Width) | PG-DSO-16-1 |
||
Maxim Integrated |
IC TXRX RS485/422 ESD 16-SSOP
|
pacchetto: 16-SSOP (0.209", 5.30mm Width) |
Azione2.192 |
|
- | - | - | - | - | Surface Mount | 16-SSOP (0.209", 5.30mm Width) | 16-SSOP |
||
Microchip Technology |
IC SMOKE DETECT PHOTO MEM 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione3.344 |
|
Photoelectric | Voltage | - | 6µA | -25°C ~ 75°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
ON Semiconductor |
IC TEMP MONITOR 8-MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione4.112 |
|
Logic | Logic | 2-Wire SMBus | 4mA | -40°C ~ 120°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Micro8? |
||
ON Semiconductor |
IC TACH/SPEEDO DRIVER 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.480 |
|
Voltage | Differential | - | 125mA | -40°C ~ 105°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
STMicroelectronics |
IC PROXIMITY DETECTOR 8 MINIDIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.920 |
|
- | - | - | 12mA | 150°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
NXP |
IC DSI SLAVE FOR R-SENSE 16-SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione18.672 |
|
Logic | Logic | Parallel | - | -40°C ~ 150°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
NXP |
IC DSI 2-CHAN INTERFACE 16-SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione24.792 |
|
Logic | Logic | SPI | 1mA | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Maxim Integrated |
TIME-TO-DIGITAL CONVERTER WITH G
|
pacchetto: 40-WFQFN Exposed Pad |
Azione3.840 |
|
CMOS | CMOS | 4-Wire SPI Serial | 62µA | -40°C ~ 85°C | Surface Mount | 40-WFQFN Exposed Pad | 40-TQFN (5x5) |
||
Maxim Integrated |
IC CONV THRMCPLE-DIG J TYPE TDFN
|
pacchetto: 10-WFDFN Exposed Pad |
Azione6.336 |
|
Thermocouple (Multiple) | Digital | 1-Wire? | 900µA | -40°C ~ 125°C | Surface Mount | 10-WFDFN Exposed Pad | 10-TDFN-EP (3x4) |
||
ams |
IC AFE CAPACTIVE SENSOR 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.304 |
|
- | - | - | 4.5mA | -45°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SMOKE DETECTOR CMOS 16DIP
|
pacchetto: 16-DIP (0.300", 7.62mm) |
Azione5.600 |
|
Ionization | Voltage | - | 9µA | -10°C ~ 60°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
||
Texas Instruments |
12-BIT CAPACITANCE-TO-DIGITAL CO
|
pacchetto: 12-WFDFN Exposed Pad |
Azione3.920 |
|
Capacitive | I2C | I2C | 2.1mA | -40°C ~ 125°C | Surface Mount | 12-WFDFN Exposed Pad | 12-WSON (4x4) |
||
Maxim Integrated |
IC SENSOR SIGNAL COND 24TQFN
|
pacchetto: 24-WFQFN Exposed Pad |
Azione8.280 |
|
Analog | Analog | Serial | 2.5mA | -40°C ~ 125°C | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN (4x4) |
||
Microchip Technology |
CO COMP, LOW CURRENT
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione22.992 |
|
- | - | - | - | - | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Renesas Electronics Corporation |
IC SENSOR SIGNAL CONDITIONER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
WAFER (SAWN) - FRAME
|
pacchetto: - |
Request a Quote |
|
Analog | 1-Wire®, I2C, SPI | - | 2.8 mA | -40°C ~ 125°C (TA) | Surface Mount | Die | Die |
||
Renesas Electronics Corporation |
IC SENSOR SIGNAL COND 24VFQFPN
|
pacchetto: - |
Request a Quote |
|
Analog | 1-Wire®, I2C, SPI | - | 2.8 mA | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 24-VFQFN Exposed Pad | 24-VFQFPN (4x4) |
||
Renesas Electronics Corporation |
WAFER (SAWN) - FRAME
|
pacchetto: - |
Request a Quote |
|
Analog | 1-Wire®, I2C, SPI | - | 2.8 mA | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
IC SENSOR SIGNAL CONDITIONER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Azoteq (Pty) Ltd |
3 CH, GPIO-SWIPE AND TAP ONLY
|
pacchetto: - |
Request a Quote |
|
- | Analog, Digital | - | 10 mA | -20°C ~ 85°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Analog Devices Inc. |
MULTI-MODAL OPTICAL AFE, SPI
|
pacchetto: - |
Azione4.317 |
|
Analog, Digital | I2C, SPI | - | 10 µA | -40°C ~ 85°C (TA) | Surface Mount | 35-UFBGA, WLCSP | 35-WLCSP (3.11x2.14) |
||
Renesas Electronics Corporation |
AUTOMOTIVE SENSOR SIGNAL CONDITI
|
pacchetto: - |
Azione15.000 |
|
- | 1-Wire®, I2C | - | - | -40°C ~ 150°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Analog Devices Inc. |
20 MSPS CCD SIGNAL PROCESSOR
|
pacchetto: - |
Request a Quote |
|
Logic | Logic | - | - | -20°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - WAFFLE PACK
|
pacchetto: - |
Request a Quote |
|
Differential | 1-Wire®, I2C | - | - | -40°C ~ 150°C | Surface Mount | Die | Die |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |