Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Applications | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
IC LIMITING AMP GPON OLT 24TQFN
|
pacchetto: 24-WFQFN Exposed Pad |
Azione2.992 |
|
GPON, OLT Receivers | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN (4x4) |
||
Semtech Corporation |
IC AMP TIA 2.5GB OC-48 DIE RING
|
pacchetto: - |
Azione5.968 |
|
Audio | - | - | - |
||
Semtech Corporation |
IC AMP TIA 2.5GB DIE WAFER
|
pacchetto: - |
Azione6.912 |
|
Audio | - | - | - |
||
Semtech Corporation |
IC AMP TIA 2.5GB 8" DIE WAFER
|
pacchetto: - |
Azione6.304 |
|
Audio | - | - | - |
||
Maxim Integrated |
IC OP AMP/COMP/REF SS LP 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.504 |
|
Smart Card | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Maxim Integrated |
IC OP AMP LP HI SPEED 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.984 |
|
Smart Card | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Maxim Integrated |
IC OP AMP LP HI SPEED 14-SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione6.416 |
|
Smart Card | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Maxim Integrated |
IC AMP LIMITING 2.5GBPS 16-TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) Exposed Pad |
Azione4.896 |
|
Optical Networks | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) Exposed Pad | 16-TSSOP-EP |
||
Microchip Technology |
IC POST AMP CML LP LIMIT 16-MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione5.760 |
|
Optical Networks | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC POST AMP CML LP LIMIT 10-MSOP
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad |
Azione4.272 |
|
Optical Networks | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad | 10-MSOP-EP |
||
Microchip Technology |
IC POST AMP CML LP LIMIT 16-MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione39.240 |
|
Optical Networks | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Maxim Integrated |
IC POST AMP 2.7GBPS W/AGC 24TQFN
|
pacchetto: 24-WFQFN Exposed Pad |
Azione4.608 |
|
Optical Networks | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN (4x4) |
||
Maxim Integrated |
IC AMP/COMP/REF +20V/V 8-UMAX
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione21.936 |
|
Current Sensing, Power Management | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-uMAX |
||
Analog Devices Inc. |
IC LOG AMP DEMODULATING 16-TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione73.164 |
|
Receiver Signal Strength Indication (RSSI) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Linear Technology |
IC ADC DRIVER DIFF 16-QFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione3.904 |
|
Data Acquisition | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN-EP (3x3) |
||
Texas Instruments |
IC OUT COMPRTR OPAMP COMB 14SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione4.720 |
|
Filter | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Linear Technology |
IC AMP CURRENT SENSE 10MSOP
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione7.072 |
|
Current Sensing, Power Management | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP |
||
Semtech Corporation |
IC AMP TIA BARE DIE
|
pacchetto: - |
Azione6.560 |
|
- | - | - | - |
||
Texas Instruments |
IC OPAMP/COMP/REFERENCE 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione450.600 |
|
Power Management | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
STMicroelectronics |
IC CONTROLLER VOLT & CUR 16 SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione450.600 |
|
Power Management | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SO |
||
Analog Devices Inc. |
IC LOGARITHM AMP 100DB 16-TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione145.776 |
|
Receiver Signal Strength Indication (RSSI) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Maxim Integrated |
IC AMP LIMITING 20-TQFN
|
pacchetto: 20-WFQFN Exposed Pad |
Azione7.696 |
|
Optical Networks | Surface Mount | 20-WFQFN Exposed Pad | 20-TQFN (4x4) |
||
Maxim Integrated |
IC OP AMP LP HI SPEED 10-UMAX
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione6.752 |
|
Smart Card | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-uMAX |
||
Analog Devices Inc. |
IC AMP VGA LOW NOISE 8-LFCSP
|
pacchetto: 8-VFDFN Exposed Pad, CSP |
Azione6.288 |
|
Signal Processing | Surface Mount | 8-VFDFN Exposed Pad, CSP | 8-LFCSP (3x3) |
||
Microchip Technology |
IC POST AMP PECL LIMIT 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione7.408 |
|
Ethernet | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Linear Technology |
IC ADC DRIVER DIFF 16-QFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione6.336 |
|
Data Acquisition | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN-EP (3x3) |
||
Linear Technology |
IC AMP CURRENT SENSE 10-MSOP
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione12.288 |
|
Current Sensing, Power Management | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP |
||
Maxim Integrated |
INTEGRATED CIRCUIT
|
pacchetto: - |
Azione4.016 |
|
- | - | - | - |
||
Linear Technology |
IC OP AMP R-R
|
pacchetto: 8-WFDFN Exposed Pad |
Azione3.696 |
|
Current Sensing, Power Management | Surface Mount | 8-WFDFN Exposed Pad | 8-DFN (2x3) |
||
Maxim Integrated |
IC AMP 100MA LIDAR 8TDFN
|
pacchetto: 8-WDFN Exposed Pad |
Azione3.440 |
|
LIDAR, Industrial Imaging | Surface Mount | 8-WDFN Exposed Pad | 8-TDFN-EP (3x3) |