Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
IC CONFIG DEVICE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.312 |
|
4MB | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC PROM SERIAL 128K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.096 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Microchip Technology |
IC FPGA EEPROM 2M ALTERA 8LAP
|
pacchetto: 8-TDFN |
Azione3.824 |
|
2Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC EEPROM FLASH 32MBIT 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione6.880 |
|
32Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC FLASH CONFIG 16M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione6.384 |
|
16Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC FLASH CONFIG 8M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione6.992 |
|
8Mb | 2.97 V ~ 3.63 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFG EEPROM 256K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione3.728 |
|
256Kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 32TQFP
|
pacchetto: 32-TQFP |
Azione3.664 |
|
1Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 32-TQFP | 32-TQFP (7x7) |
||
Xilinx Inc. |
IC 1 MB 3.3V SER CONF PROM 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione67.644 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM PROG C-TEMP 3.3V 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione11.724 |
|
200kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER 150000 I-TEMP 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.888 |
|
1.5Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER 150000 C-TEMP 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.840 |
|
1.5Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM PROG 50K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.600 |
|
50kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.016 |
|
65kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 36K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.096 |
|
36kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC PROM SER I-TEMP 256K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione5.008 |
|
256Kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC EEPROM FPGA 128KB 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.776 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC SERIAL CONFIG PROM 64K 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione149.136 |
|
64kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SER CONFIG PROM 128K 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione4.448 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SRL/PAR 1.8V 32M 48CSBGA
|
pacchetto: 48-TFBGA, CSPBGA |
Azione40.644 |
|
32Mb | 1.65 V ~ 2 V | -40°C ~ 85°C | 48-TFBGA, CSPBGA | 48-CSP (8x9) |
||
Xilinx Inc. |
RE-PROGRAMMABLE 1MB PROM
|
pacchetto: 20-LCC (J-Lead) |
Azione5.328 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 44TQFP
|
pacchetto: 44-TQFP |
Azione5.344 |
|
2Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 44-TQFP | 44-TQFP (10x10) |
||
Altera |
IC CONFIG DEVICE 64MBIT 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione20.664 |
|
64Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Altera |
IC CONFIG DEVICE 1.6MBIT 32TQFP
|
pacchetto: 32-TQFP |
Azione14.844 |
|
1.6Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 32-TQFP | 32-TQFP (7x7) |
||
Intel |
IC CONFIG DEVICE
|
pacchetto: 100-BQFP |
Azione2.784 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 32TQFP
|
pacchetto: 32-TQFP |
Azione2.100 |
|
440kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | -40°C ~ 85°C | 32-TQFP | 32-TQFP (7x7) |
||
Intel |
IC CONFIG DEVICE 32TQFP
|
pacchetto: 32-TQFP |
Azione5.856 |
|
440kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | -40°C ~ 85°C | 32-TQFP | 32-TQFP (7x7) |
||
Intel |
IC CONFIG DEVICE 16MBIT 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione191.292 |
|
16Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Intel |
IC CONFIG DEVICE 4MBIT 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.304 |
|
4MB | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC PROM IN SYST PRG 3.3V 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione15.804 |
|
2Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |