Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
IC CONFIG DEVICE
|
pacchetto: - |
Azione6.416 |
|
1Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | - | - |
||
Xilinx Inc. |
IC PROM SERIAL 3.3V 300K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.496 |
|
300kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SERIAL 65K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.552 |
|
65kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 2M 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione6.992 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC FPGA 512K CONFIG MEM 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.640 |
|
512kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC FPGA 1M CONFIG MEM 10MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.192 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH CONFIG 8M 44TQFP
|
pacchetto: 44-TQFP |
Azione2.000 |
|
8Mb | 2.97 V ~ 3.63 V | 0°C ~ 70°C | 44-TQFP | 44-TQFP (10x10) |
||
Microchip Technology |
IC SRL CONFG EEPROM 256K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione4.144 |
|
256Kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 512K 8-LAP
|
pacchetto: 8-TDFN |
Azione2.784 |
|
512kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC CONFIG SEEPROM 1M 3.3V 32TQFP
|
pacchetto: 32-TQFP |
Azione3.088 |
|
1Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 32-TQFP | 32-TQFP (7x7) |
||
Xilinx Inc. |
IC PROM PROG C-TEMP 5V 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione8.304 |
|
400kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER 200K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.392 |
|
200kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER 5000 C-TEMP 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione12.144 |
|
150kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER 150000 C-TEMP 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione7.040 |
|
1.5Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC 3V PROM PROG 50K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.408 |
|
50kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER C-TEMP 512K 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione7.328 |
|
512kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SER I-TEMP 128K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione18.684 |
|
128kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM FPGA 256KB 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.864 |
|
256Kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM FPGA 128KB 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.136 |
|
128kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SERIAL CONFIG PROM 2M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione4.800 |
|
2Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC CONFIG DEVICE 4MBIT 100QFP
|
pacchetto: 100-BQFP |
Azione48.948 |
|
4MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (14x20) |
||
Altera |
IC CONFIG DEVICE 16MBIT 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione1.597.836 |
|
16Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH CONFIG 4M 8LAP
|
pacchetto: 8-TDFN |
Azione6.096 |
|
4Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Intel |
IC CONFIG DEVICE
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.000 |
|
1Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Intel |
IC CONFIG DEVICE 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione11.424 |
|
65kb | 4.5 V ~ 5.5 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Intel |
IC CONFIG DEVICE 4MBIT 100QFP
|
pacchetto: 100-BQFP |
Azione5.264 |
|
4MB | 3 V ~ 3.6 V | -40°C ~ 85°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 4MBIT 100QFP
|
pacchetto: 100-BQFP |
Azione3.952 |
|
4MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC QUAD-SERIAL LOW VOLTAGE CONFI
|
pacchetto: 24-LBGA |
Azione5.424 |
|
1GB | 1.7 V ~ 2 V | -40°C ~ 85°C | 24-LBGA | 24-FBGA (6x8) |
||
Intel |
IC CONFIG DEVICE 128MBIT 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione14.940 |
|
128Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Intel |
IC CONFIG DEVICE 32MBIT 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione22.296 |
|
32Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |