Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC WIRELESS TRANSMITTER 48TQFN
|
pacchetto: - |
Azione2.720 |
|
- | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC WIRELESS PWR RECEIVER
|
pacchetto: - |
Azione3.984 |
|
- | - | - | - | - | - |
||
Texas Instruments |
IC PMU CHRGR 1.2A OVP 49SMDXT
|
pacchetto: 49-WFBGA, DSBGA |
Azione4.240 |
|
- | 2.5 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 49-WFBGA, DSBGA | 49-DSBGA |
||
Intersil |
IC CTRLR PWM DUAL 1.4MHZ 28-QFN
|
pacchetto: 28-VFQFN Exposed Pad |
Azione131.892 |
|
2mA | 5.6 V ~ 24 V | -40°C ~ 85°C | Surface Mount | 28-VFQFN Exposed Pad | 28-QFN (5x5) |
||
Texas Instruments |
IC DGTL PWR CTRLR 80TQFP
|
pacchetto: 80-TQFP |
Azione7.216 |
|
60mA | 3 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 80-TQFP | 80-TQFP (12x12) |
||
STMicroelectronics |
IC REG CTAVR C-TERM MULTIWATT8
|
pacchetto: - |
Azione7.872 |
|
- | 6 V ~ 18 V | -40°C ~ 150°C | - | - | - |
||
NXP |
IC SBC HIGH SPD CAN 3.3V 32SOIC
|
pacchetto: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
Azione5.248 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
||
Texas Instruments |
IC LOAD SHARE CTRLR ADV 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.392 |
|
2.5mA | 4.375 V ~ 14.25 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Diodes Incorporated |
HEATER CONTROLLER SO-8
|
pacchetto: - |
Azione4.192 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
HEATER CONTROLLER SO-8
|
pacchetto: - |
Azione6.608 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
HEATER CONTROLLER SO-8
|
pacchetto: - |
Azione7.824 |
|
- | - | - | - | - | - |
||
ON Semiconductor |
IC OVP FRONT END CTLR 100V 12CSP
|
pacchetto: 12-UFBGA, WLCSP |
Azione2.928 |
|
58µA | 2.8 V ~ 28 V | -40°C ~ 85°C | Surface Mount | 12-UFBGA, WLCSP | 12-WLCSP (1.3x2) |
||
ON Semiconductor |
IC OVP VOLTAGE CTLR 28V 2A 6CSP
|
pacchetto: 6-UFBGA, WLCSP |
Azione130.836 |
|
- | 1.2 V ~ 28 V | -40°C ~ 85°C | Surface Mount | 6-UFBGA, WLCSP | 6-WLCSP (1.3x1) |
||
ams |
IC PMU 24WLCSP
|
pacchetto: 24-UFBGA, WLCSP |
Azione17.952 |
|
- | 4.5 V ~ 14 V | -40°C ~ 85°C | Surface Mount | 24-UFBGA, WLCSP | 24-WLCSP (2.37x1.57) |
||
Texas Instruments |
IC PMU W/DCDC CTRLR 80HTQFP
|
pacchetto: 80-TQFP Exposed Pad |
Azione7.104 |
|
- | 2.7 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 80-TQFP Exposed Pad | 80-HTQFP (12x12) |
||
Texas Instruments |
IC DGTL PWR CTRLR 48VQFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione12.564 |
|
60mA | 3 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 48-VFQFN Exposed Pad | 48-VQFN (7x7) |
||
Linear Technology |
IC USB POWER MANAGER 20-QFN
|
pacchetto: 20-WFQFN Exposed Pad |
Azione4.528 |
|
10µA | 2.7 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-WFQFN Exposed Pad | 20-QFN (3x3) |
||
Texas Instruments |
IC PWR MGMT 6CH W/4 LDO 32VQFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione16.212 |
|
1.25mA | 1.5 V ~ 6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VQFN (4x4) |
||
Microchip Technology |
IC USB PORT POWER CTRLR 20QFN
|
pacchetto: 20-VFQFN Exposed Pad |
Azione17.232 |
|
650µA | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 20-VFQFN Exposed Pad | 20-QFN (4x4) |
||
Maxim Integrated |
IC DRVR TRANSF ISO 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione139.944 |
|
1.1mA | 2.5 V ~ 6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC EARTH LEAKAGE DETECTOR 8-SOP
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.752 |
|
400µA | 12 V ~ 20 V | -25°C ~ 80°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
pacchetto: 48-LQFP Exposed Pad |
Azione5.504 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
pacchetto: 48-VFQFN Exposed Pad |
Azione6.784 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
NXP |
PF1550
|
pacchetto: 40-VFQFN Exposed Pad |
Azione2.992 |
|
- | 3.8 V ~ 7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
||
NXP |
POWER MANAGEMENT IC: 3 BUCK REGS
|
pacchetto: 40-VFQFN Exposed Pad |
Azione2.880 |
|
- | 3.8 V ~ 7 V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
||
Analog Devices Inc. |
IC ACTIVE BIAS CONTROLLER 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione4.800 |
|
20mA | 5 V ~ 16.5 V | -55°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Renesas Electronics America |
IC REG/CTLR ACPI DUAL DDR 28QFN
|
pacchetto: 28-VQFN Exposed Pad |
Azione102.000 |
|
7mA | - | 0°C ~ 70°C | Surface Mount | 28-VQFN Exposed Pad | 28-QFN (6x6) |
||
Maxim Integrated |
INTEGRATED CIRCUIT
|
pacchetto: - |
Azione4.688 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
HEATER CONTROLLER DIP-8
|
pacchetto: - |
Azione5.440 |
|
- | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC WIRELESS RECEIVER 32VFQFPN
|
pacchetto: 32-WFQFN Exposed Pad |
Azione3.568 |
|
16mA | - | 0°C ~ 85°C | Surface Mount | 32-WFQFN Exposed Pad | 32-VFQFPN (5x5) |