Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Voltages Monitored | Output | Reset | Reset Timeout | Voltage - Threshold | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC RESET GEN 2.63V VTH SOT23-3
|
pacchetto: TO-236-3, SC-59, SOT-23-3 |
Azione2.576 |
|
1 | Push-Pull, Totem Pole | Active High | 140 ms Minimum | 2.63V | -40°C ~ 85°C (TA) | Surface Mount | TO-236-3, SC-59, SOT-23-3 | SOT-23-3 |
||
Microchip Technology |
IC RESET GEN 4.63V VTH SOT23-3
|
pacchetto: TO-236-3, SC-59, SOT-23-3 |
Azione5.616 |
|
1 | Push-Pull, Totem Pole | Active High | 140 ms Minimum | 4.38V | -40°C ~ 85°C (TA) | Surface Mount | TO-236-3, SC-59, SOT-23-3 | SOT-23-3 |
||
Microchip Technology |
IC RESET GEN 4.63V VTH SC70
|
pacchetto: SC-70, SOT-323 |
Azione2.480 |
|
1 | Push-Pull, Totem Pole | Active High | 140 ms Minimum | 4.38V | -40°C ~ 85°C (TA) | Surface Mount | SC-70, SOT-323 | SC-70-3 |
||
Microchip Technology |
IC RESET GEN 4.63V VTH SOT23-3
|
pacchetto: TO-236-3, SC-59, SOT-23-3 |
Azione7.792 |
|
1 | Push-Pull, Totem Pole | Active High | 140 ms Minimum | 4.63V | -40°C ~ 85°C (TA) | Surface Mount | TO-236-3, SC-59, SOT-23-3 | SOT-23-3 |
||
Microchip Technology |
IC RESET GEN 4.63V VTH SC70
|
pacchetto: SC-70, SOT-323 |
Azione7.776 |
|
1 | Push-Pull, Totem Pole | Active High | 140 ms Minimum | 4.63V | -40°C ~ 85°C (TA) | Surface Mount | SC-70, SOT-323 | SC-70-3 |
||
Microchip Technology |
IC RESET GEN 4.63V VTH SC70
|
pacchetto: SC-70, SOT-323 |
Azione14.004 |
|
1 | Push-Pull, Totem Pole | Active High | 140 ms Minimum | 4V | -40°C ~ 85°C (TA) | Surface Mount | SC-70, SOT-323 | SC-70-3 |
||
Microchip Technology |
IC RESET GEN 4.63V VTH SOT23-3
|
pacchetto: TO-236-3, SC-59, SOT-23-3 |
Azione3.744 |
|
1 | Push-Pull, Totem Pole | Active High | 140 ms Minimum | 4V | -40°C ~ 85°C (TA) | Surface Mount | TO-236-3, SC-59, SOT-23-3 | SOT-23-3 |
||
Microchip Technology |
IC RESET GEN 3.08V VTH SC70
|
pacchetto: SC-70, SOT-323 |
Azione332.436 |
|
1 | Push-Pull, Totem Pole | Active Low | 140 ms Minimum | 3.08V | -40°C ~ 85°C (TA) | Surface Mount | SC-70, SOT-323 | SC-70-3 |
||
Microchip Technology |
IC RESET GEN 3.08V VTH SOT23-3
|
pacchetto: TO-236-3, SC-59, SOT-23-3 |
Azione7.696 |
|
1 | Push-Pull, Totem Pole | Active Low | 140 ms Minimum | 3.08V | -40°C ~ 85°C (TA) | Surface Mount | TO-236-3, SC-59, SOT-23-3 | SOT-23-3 |
||
Microchip Technology |
IC RESET GEN 2.93V VTH SC70
|
pacchetto: SC-70, SOT-323 |
Azione4.208 |
|
1 | Push-Pull, Totem Pole | Active Low | 140 ms Minimum | 2.93V | -40°C ~ 85°C (TA) | Surface Mount | SC-70, SOT-323 | SC-70-3 |
||
Microchip Technology |
IC RESET GEN 2.93V VTH SOT23-3
|
pacchetto: TO-236-3, SC-59, SOT-23-3 |
Azione33.588 |
|
1 | Push-Pull, Totem Pole | Active Low | 140 ms Minimum | 2.93V | -40°C ~ 85°C (TA) | Surface Mount | TO-236-3, SC-59, SOT-23-3 | SOT-23-3 |
||
Microchip Technology |
IC RESET GEN 2.63V VTH SC70
|
pacchetto: SC-70, SOT-323 |
Azione15.276 |
|
1 | Push-Pull, Totem Pole | Active Low | 140 ms Minimum | 2.63V | -40°C ~ 85°C (TA) | Surface Mount | SC-70, SOT-323 | SC-70-3 |
||
Microchip Technology |
IC RESET GEN 4.38V VTH SC70
|
pacchetto: SC-70, SOT-323 |
Azione6.432 |
|
1 | Push-Pull, Totem Pole | Active Low | 140 ms Minimum | 4.38V | -40°C ~ 85°C (TA) | Surface Mount | SC-70, SOT-323 | SC-70-3 |
||
Microchip Technology |
IC RESET GEN 4.38V VTH SOT23-3
|
pacchetto: TO-236-3, SC-59, SOT-23-3 |
Azione2.800 |
|
1 | Push-Pull, Totem Pole | Active Low | 140 ms Minimum | 4.38V | -40°C ~ 85°C (TA) | Surface Mount | TO-236-3, SC-59, SOT-23-3 | SOT-23-3 |
||
Microchip Technology |
IC RESET GEN 4.63V VTH SC70
|
pacchetto: SC-70, SOT-323 |
Azione10.656 |
|
1 | Push-Pull, Totem Pole | Active Low | 140 ms Minimum | 4.63V | -40°C ~ 85°C (TA) | Surface Mount | SC-70, SOT-323 | SC-70-3 |
||
Microchip Technology |
IC RESET GEN 4.63V VTH SOT23-3
|
pacchetto: TO-236-3, SC-59, SOT-23-3 |
Azione7.696 |
|
1 | Push-Pull, Totem Pole | Active Low | 140 ms Minimum | 4.63V | -40°C ~ 85°C (TA) | Surface Mount | TO-236-3, SC-59, SOT-23-3 | SOT-23-3 |
||
Microchip Technology |
IC RESET GEN 4.00V VTH SC70
|
pacchetto: SC-70, SOT-323 |
Azione16.920 |
|
1 | Push-Pull, Totem Pole | Active Low | 140 ms Minimum | 4V | -40°C ~ 85°C (TA) | Surface Mount | SC-70, SOT-323 | SC-70-3 |
||
Microchip Technology |
IC RESET GEN 4.00V VTH SOT23-3
|
pacchetto: TO-236-3, SC-59, SOT-23-3 |
Azione180.000 |
|
1 | Push-Pull, Totem Pole | Active Low | 140 ms Minimum | 4V | -40°C ~ 85°C (TA) | Surface Mount | TO-236-3, SC-59, SOT-23-3 | SOT-23-3 |
||
Microchip Technology |
IC SUPERVISOR 2.93V VTH SC70
|
pacchetto: SC-70, SOT-323 |
Azione224.400 |
|
1 | Push-Pull, Totem Pole | Active Low | 140 ms Minimum | 2.93V | -40°C ~ 85°C (TA) | Surface Mount | SC-70, SOT-323 | SC-70-3 |
||
Microchip Technology |
IC SUPERVISOR 2.93V VTH SOT23-3
|
pacchetto: TO-236-3, SC-59, SOT-23-3 |
Azione3.296 |
|
1 | Push-Pull, Totem Pole | Active Low | 140 ms Minimum | 2.93V | -40°C ~ 85°C (TA) | Surface Mount | TO-236-3, SC-59, SOT-23-3 | SOT-23-3 |
||
Microchip Technology |
IC SUPERVISOR 3.08V VTH 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione2.736 |
|
1 | Complementary | Active High/Active Low | 140 ms Minimum | 3.08V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SUPERVISOR 3.08V VTH 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione459.300 |
|
1 | Complementary | Active High/Active Low | 140 ms Minimum | 3.08V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SUPERVISOR 2.93V VTH 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.824 |
|
1 | Complementary | Active High/Active Low | 140 ms Minimum | 2.93V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SUPERVISOR 2.93V VTH 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.384 |
|
1 | Complementary | Active High/Active Low | 140 ms Minimum | 2.93V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SUPERVISOR 2.93V VTH 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione607.920 |
|
1 | Complementary | Active High/Active Low | 140 ms Minimum | 2.93V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SUPERVISOR 2.63V VTH 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.272 |
|
1 | Complementary | Active High/Active Low | 140 ms Minimum | 2.63V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SUPERVISOR 2.63V VTH 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.096 |
|
1 | Complementary | Active High/Active Low | 140 ms Minimum | 2.63V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SUPERVISOR 2.63V VTH 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione545.352 |
|
1 | Complementary | Active High/Active Low | 140 ms Minimum | 2.63V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SUPERVISOR 4.4V VTH 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione2.384 |
|
1 | Complementary | Active High/Active Low | 140 ms Minimum | 4.4V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SUPERVISOR 4.4V VTH 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.488 |
|
1 | Complementary | Active High/Active Low | 140 ms Minimum | 4.4V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |