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Prodotti NXP - PMIC - Gestione potenza - Specializzata

Record 587
Pagina  3/20
Immagine
Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
Current - Supply
Voltage - Supply
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
MC33FS6502LAE
NXP

SYSTEM BASIS CHIP DCDC 0.8A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
pacchetto: 48-LQFP Exposed Pad
Azione7.616
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC35FS6500CAE
NXP

SYSTEM BASIS CHIP DCDC 0.8A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
pacchetto: 48-LQFP Exposed Pad
Azione8.676
-
-1.0 V ~ 40 V
-40°C ~ 150°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33FS4502LAE
NXP

SYSTEM BASIS CHIP LINEAR 0.5A V

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
pacchetto: 48-LQFP Exposed Pad
Azione6.324
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33FS6502CAE
NXP

SYSTEM BASIS CHIP DCDC 0.8A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
pacchetto: 48-LQFP Exposed Pad
Azione7.936
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC34VR500V6ES
NXP

REGULATOR BUCK QUAD WITH UP TO

  • Applications: QorlQ LS1/T1 Communications Processors
  • Current - Supply: 250µA
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
pacchetto: 56-VFQFN Exposed Pad
Azione6.996
250µA
2.8 V ~ 4.5 V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC34VR500V8ES
NXP

REGULATOR BUCK QUAD WITH UP TO

  • Applications: QorlQ LS1/T1 Communications Processors
  • Current - Supply: 250µA
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
pacchetto: 56-VFQFN Exposed Pad
Azione7.032
250µA
2.8 V ~ 4.5 V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC34VR500V5ES
NXP

REGULATOR BUCK QUAD WITH UP TO

  • Applications: QorlQ LS1/T1 Communications Processors
  • Current - Supply: 250µA
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
pacchetto: 56-VFQFN Exposed Pad
Azione7.952
250µA
2.8 V ~ 4.5 V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC34VR500V7ES
NXP

REGULATOR BUCK QUAD WITH UP TO

  • Applications: QorlQ LS1/T1 Communications Processors
  • Current - Supply: 250µA
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
pacchetto: 56-VFQFN Exposed Pad
Azione6.144
250µA
2.8 V ~ 4.5 V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC33FS6521NAE
NXP

SYSTEM BASIS CHIP DCDC 2.2A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
pacchetto: 48-LQFP Exposed Pad
Azione8.760
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC35FS6500NAE
NXP

FS6500

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
pacchetto: 48-LQFP Exposed Pad
Azione7.680
-
-1.0 V ~ 40 V
-40°C ~ 150°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33FS6520CAE
NXP

SYSTEM BASIS CHIP DCDC 2.2A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
pacchetto: 48-LQFP Exposed Pad
Azione7.952
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33FS6510CAE
NXP

SYSTEM BASIS CHIP DCDC 1.5A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
pacchetto: 48-LQFP Exposed Pad
Azione7.152
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33FS6500LAE
NXP

SYSTEM BASIS CHIP DCDC 0.8A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
pacchetto: 48-LQFP Exposed Pad
Azione7.860
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33FS6500CAE
NXP

SYSTEM BASIS CHIP DCDC 0.8A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
pacchetto: 48-LQFP Exposed Pad
Azione7.176
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33FS4500CAE
NXP

SYSTEM BASIS CHIP LINEAR 0.5A V

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
pacchetto: 48-LQFP Exposed Pad
Azione7.440
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33FS6520NAE
NXP

SYSTEM BASIS CHIP DCDC 2.2A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
pacchetto: 48-LQFP Exposed Pad
Azione8.064
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC34PF4210A1ESR2
NXP

PF4210

  • Applications: Audio, Video
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
pacchetto: 56-VFQFN Exposed Pad
Azione2.896
-
2.8 V ~ 4.5 V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
hot MC33664ATL1EG
NXP

TRANSFORMER PHYSICAL LAYER

  • Applications: Isolated Communications Interface
  • Current - Supply: 40mA
  • Voltage - Supply: 4.5 V ~ 7 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SOIC
pacchetto: 16-SOIC (0.154", 3.90mm Width)
Azione9.012
40mA
4.5 V ~ 7 V
-40°C ~ 125°C (TA)
Surface Mount
16-SOIC (0.154", 3.90mm Width)
16-SOIC
MC33FS6510NAE
NXP

SYSTEM BASIS CHIP DCDC 1.5A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
pacchetto: 48-LQFP Exposed Pad
Azione8.568
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC34PF4210A1ES
NXP

PF4210

  • Applications: Audio, Video
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
pacchetto: 56-VFQFN Exposed Pad
Azione5.424
-
2.8 V ~ 4.5 V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC34PF4210A0ES
NXP

PF4210

  • Applications: Audio, Video
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
pacchetto: 56-VFQFN Exposed Pad
Azione7.440
-
2.8 V ~ 4.5 V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC32PF4210A1ESR2
NXP

PF4210

  • Applications: Audio, Video
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: 0°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
pacchetto: 56-VFQFN Exposed Pad
Azione2.272
-
2.8 V ~ 4.5 V
0°C ~ 85°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC32PF4210A1ES
NXP

PF4210

  • Applications: Audio, Video
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: 0°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
pacchetto: 56-VFQFN Exposed Pad
Azione6.372
-
2.8 V ~ 4.5 V
0°C ~ 85°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC32PF4210A0ES
NXP

PF4210

  • Applications: Audio, Video
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: 0°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
pacchetto: 56-VFQFN Exposed Pad
Azione7.392
-
2.8 V ~ 4.5 V
0°C ~ 85°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC33PF3000A7ES
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: i.MX Processors
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 105°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
pacchetto: 48-VFQFN Exposed Pad
Azione8.928
-
2.8 V ~ 5.5 V
-40°C ~ 105°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MC32PF3000A5EP
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: i.MX Processors
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
pacchetto: 48-VFQFN Exposed Pad
Azione7.728
-
2.8 V ~ 5.5 V
-40°C ~ 85°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MC32PF3000A4EP
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: i.MX Processors
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
pacchetto: 48-VFQFN Exposed Pad
Azione6.684
-
2.8 V ~ 5.5 V
-40°C ~ 85°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MC32PF3000A3EP
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: i.MX Processors
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
pacchetto: 48-VFQFN Exposed Pad
Azione8.172
-
2.8 V ~ 5.5 V
-40°C ~ 85°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MC32PF3000A2EP
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: i.MX Processors
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
pacchetto: 48-VFQFN Exposed Pad
Azione6.108
-
2.8 V ~ 5.5 V
-40°C ~ 85°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MC32PF3000A7EP
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: i.MX Processors
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
pacchetto: 48-VFQFN Exposed Pad
Azione12.240
-
2.8 V ~ 5.5 V
-40°C ~ 85°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)