Prodotti Omron Electronics Inc-EMC Div - Connettori rettangolari - Basette, pin specializzati | Heisener Electronics
Contattaci
SalesDept@heisener.com 86-755-83210559-827
Language Translation

* Please refer to the English Version as our Official Version.

Prodotti Omron Electronics Inc-EMC Div - Connettori rettangolari - Basette, pin specializzati

Record 3
Pagina  1/1
Immagine
Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
Contact Type
Number of Positions
Pitch
Number of Rows
Row Spacing
Mounting Type
Termination
Features
Contact Finish
Contact Finish Thickness
Color
XR2P-1541
Omron Electronics Inc-EMC Div

SOCKET IC 15POS SINGLE ROW DIP

  • Connector Type: Header
  • Contact Type: Post
  • Number of Positions: 15
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 1
  • Row Spacing: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Color: Black
pacchetto: -
Azione8.478
Post
15
0.100" (2.54mm)
1
-
Through Hole
Solder
-
Gold
10µin (0.25µm)
Black
XR2P-1641
Omron Electronics Inc-EMC Div

SOCKET IC 16POS SINGLE ROW DIP

  • Connector Type: Header
  • Contact Type: Post
  • Number of Positions: 16
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 1
  • Row Spacing: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Color: Black
pacchetto: -
Azione5.706
Post
16
0.100" (2.54mm)
1
-
Through Hole
Solder
-
Gold
10µin (0.25µm)
Black
XR2P-3241
Omron Electronics Inc-EMC Div

CONN SOCKET IC 32POS SNGL DIP

  • Connector Type: Header
  • Contact Type: Post
  • Number of Positions: 32
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 1
  • Row Spacing: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Color: Black
pacchetto: -
Azione6.672
Post
32
0.100" (2.54mm)
1
-
Through Hole
Solder
-
Gold
10µin (0.25µm)
Black