Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 28POS TIN
|
pacchetto: - |
Azione3.780 |
|
28 (2 x 14) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 18POS TIN
|
pacchetto: - |
Azione2.196 |
|
18 (2 x 9) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 8POS TIN
|
pacchetto: - |
Azione7.632 |
|
8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
SIP IC SKT 5 SSR SN/AU FLH ROHS
|
pacchetto: - |
Azione2.268 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 6POS TIN
|
pacchetto: - |
Azione6.390 |
|
6 (2 x 3) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
808-11P1= INSUL.(RYNITE,BLK.)W
|
pacchetto: - |
Azione4.032 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-5 8POS GOLD
|
pacchetto: - |
Azione3.492 |
|
8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 16POS GOLD
|
pacchetto: - |
Azione8.010 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | Brass | - | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 24POS TIN
|
pacchetto: - |
Azione8.964 |
|
24 (2 x 12) | 0.100" (2.54mm) | Tin | 60µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 60µin (1.52µm) | Phosphor Bronze | - | -40°C ~ 105°C |
||
TE Connectivity AMP Connectors |
LGA3647-1 SOCKET-P1 KIT FOR ODM
|
pacchetto: - |
Azione4.716 |
|
3647 | - | Gold | 30µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Liquid Crystal Polymer (LCP) | - |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-5 8POS GOLD
|
pacchetto: - |
Azione4.302 |
|
8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 28POS GOLD
|
pacchetto: - |
Azione6.144 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 32POS GOLD
|
pacchetto: - |
Azione8.148 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 20µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 20µin (0.51µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 24POS GOLD
|
pacchetto: - |
Azione6.300 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 6POS GOLD
|
pacchetto: - |
Azione16.212 |
|
6 (2 x 3) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
LGA3647-0 SOCKET P0 KIT FOR ODM
|
pacchetto: - |
Azione6.822 |
|
3647 | - | Gold | 30µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Liquid Crystal Polymer (LCP) | - |
||
TE Connectivity AMP Connectors |
SOCKET ASSY LGA2011-1 0.38AU
|
pacchetto: - |
Azione7.872 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
SOCKET ASSY LGA2011-3 0.76UM AU
|
pacchetto: - |
Azione8.550 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-5 8POS GOLD
|
pacchetto: - |
Azione6.504 |
|
8 (Round) | - | Gold | - | Beryllium Copper | Panel Mount | - | Solder Cup | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-5 3POS GOLD
|
pacchetto: - |
Azione8.832 |
|
3 (Round) | - | Gold | - | Copper Alloy | Through Hole | - | Solder | - | Gold | - | Copper Alloy | Polyamide (PA), Nylon | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-5 8POS GOLD
|
pacchetto: - |
Azione8.838 |
|
8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 48POS GOLD
|
pacchetto: - |
Azione7.740 |
|
48 (2 x 24) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | Copper Alloy | Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 36POS GOLD
|
pacchetto: - |
Azione13.944 |
|
36 (2 x 18) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
SOCKET ASSY LGA1150
|
pacchetto: - |
Azione7.860 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
SOCKET ASSY LGA1151, 0.38AU
|
pacchetto: - |
Azione7.344 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-3 4POS GOLD
|
pacchetto: - |
Azione22.008 |
|
4 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Tin-Lead | - | Beryllium Copper | Fluoropolymer (FP) | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-5 3POS GOLD
|
pacchetto: - |
Azione8.262 |
|
3 (Round) | - | Gold | - | Copper Alloy | Through Hole | - | Solder | - | Gold | - | Copper Alloy | Polyamide (PA), Nylon | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 22POS GOLD
|
pacchetto: - |
Azione6.984 |
|
22 (2 x 11) | 0.100" (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Copper Alloy | - | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 20POS GOLD
|
pacchetto: - |
Azione12.618 |
|
20 (1 x 20) | 0.100" (2.54mm) | Gold | 20µin (0.51µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 20µin (0.51µm) | Copper | Thermoplastic, Polyester | - |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 22POS GOLD
|
pacchetto: - |
Azione10.956 |
|
22 (2 x 11) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |