Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Silicon Labs |
IC CLK BUFFER 1:8 200MHZ 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione2.064 |
|
1 | 1:8 | No/No | CMOS, HSTL, LVTTL, SSTL | CMOS | 200MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:15 3GHZ 52PTQFP
|
pacchetto: 52-LQFP Exposed Pad |
Azione6.320 |
|
1 | 2:15 | Yes/Yes | ECL, PECL | LVPECL | 3GHz | 2.375 V ~ 3.465 V | -40°C ~ 110°C | Surface Mount | 52-LQFP Exposed Pad | 52-PTQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:5 166MHZ 20VFQFPN
|
pacchetto: 20-VFQFN Exposed Pad |
Azione6.080 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | 166MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 20-VFQFN Exposed Pad | 20-VFQFPN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:9 1.6GHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione6.400 |
|
1 | 2:9 | Yes/Yes | CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL | ECL, LVPECL | 1.6GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:8 350MHZ 38TSSOP
|
pacchetto: 38-TFSOP (0.173", 4.40mm Width) |
Azione6.064 |
|
1 | 1:8 | Yes/Yes | LVDS, LVPECL, LVTTL | LVPECL | 350MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
NXP |
IC CLK BUFFER 1:10 400MHZ 20SO
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.976 |
|
1 | 1:10 | No/No | LVCMOS, LVTTL | LVTTL | 400MHz | 2.3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SO |
||
ON Semiconductor |
IC CLK BUFFER 2:5 1GHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione7.456 |
|
1 | 2:5 | Yes/Yes | ECL, PECL | ECL, PECL | 1GHz | 4.2 V ~ 5.7 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 1:9 800MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione19.272 |
|
1 | 1:9 | Yes/Yes | ECL, PECL | ECL, PECL | 800MHz | 4.2 V ~ 5.7 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
NXP |
IC CLK BUFFER 2:9 350MHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione5.648 |
|
1 | 2:9 | No/No | LVCMOS | LVCMOS | 350MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
IC CLK BUFFER 2:16 350MHZ 48LQFP
|
pacchetto: 48-LQFP |
Azione8.916 |
|
1 | 2:16 | Yes/No | LVCMOS, LVPECL | LVCMOS | 350MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:12 1.5GHZ 32VFQFPN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione2.080 |
|
1 | 1:12 | Yes/Yes | CML, LVPECL, SSTL | LVPECL | 1.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:24 100MHZ 48TQFP
|
pacchetto: 48-LQFP |
Azione6.160 |
|
1 | 2:24 | Yes/No | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVCMOS, LVTTL | 100MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 3:6 266MHZ 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione7.360 |
|
1 | 3:6 | No/Yes | LVCMOS, LVTTL, Crystal | LVPECL | 266MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
Texas Instruments |
IC CLK BUFFER 2:10 1.1GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione6.336 |
|
1 | 2:10 | Yes/Yes | LVDS | LVDS | 1.1GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
ON Semiconductor |
IC CLK BUFFER 1:4 7GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione2.816 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | CML | 7GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
ON Semiconductor |
IC CLK BUFFER 1:4 3GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione7.744 |
|
1 | 1:4 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL, LVTTL | LVCMOS, LVPECL | 3GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
ON Semiconductor |
IC FANOUT BUFFER 1:8 HCSL 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione3.728 |
|
1 | 1:8 | Yes/Yes | HCSL, LVCMOS, LVDS, LVPECL, LVTTL | HCSL | 350MHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:9 250MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione3.344 |
|
1 | 2:9 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:4 2GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione5.344 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 6:1 250MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione3.040 |
|
1 | 6:1 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC Z-BUFFER 85 OHM ZOUT 48MLF
|
pacchetto: - |
Azione7.120 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Diodes Incorporated |
IC CLOCK BUFF 3:8 200MHZ 32TQFN
|
pacchetto: 32-WFQFN Exposed Pad |
Azione7.136 |
|
1 | 3:8 | Yes/No | LVCMOS, LVTTL, Crystal | CMOS | 200MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-WFQFN Exposed Pad | 32-TQFN (5x5) |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 100MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione5.520 |
|
2 | 1:5 | No/No | CMOS, TTL | CMOS | 100MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microsemi Corporation |
LOW SKEW, LOW ADDITIVE JITTER 3
|
pacchetto: - |
Azione5.424 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 250MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.288 |
|
1 | 1:2 | No/Yes | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:6 800MHZ 28VFQFPN
|
pacchetto: 28-VFQFN Exposed Pad |
Azione6.816 |
|
1 | 2:6 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVPECL, LVTTL | LVDS | 800MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 28-VFQFN Exposed Pad | 28-VFQFPN (6x6) |
||
Microchip Technology |
IC CLK BUFFER 2:8 800MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione7.476 |
|
1 | 2:8 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 800MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Texas Instruments |
IC CLK BUFFER 1:4 250MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione66.900 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 250MHz | 2.3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Diodes Incorporated |
IC CLOCK
|
pacchetto: - |
Azione4.384 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:2 750MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.616 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |