Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Circuit | Independent Circuits | Current - Output High, Low | Voltage Supply Source | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC MUX DUAL 2:1 DFF LVPECL 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione6.160 |
|
1 x 2:1 | 2 | - | Single Supply | 2.375 V ~ 2.625 V, 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC MUX DUAL 2:1 DIFF CML 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione3.440 |
|
1 x 2:1 | 2 | - | Single Supply | 2.375 V ~ 2.625 V, 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CROSSPOINT SWITCH DUAL 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione5.248 |
|
2 x 2:2 | 2 | - | Single Supply | 2.375 V ~ 2.625 V, 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CROSSPOINT SWITCH 2X2 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione17.436 |
|
1 x 2:2 | 1 | - | Single Supply | 2.375 V ~ 2.625 V, 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CROSSPOINT SWITCH DUAL 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione11.700 |
|
2 x 2:2 | 2 | - | Single Supply | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CROSSPOINT SWITCH DUAL 32TQFP
|
pacchetto: 32-TQFP Exposed Pad |
Azione17.928 |
|
2 x 2:2 | 2 | - | Single Supply | 2.3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-TQFP Exposed Pad | 32-TQFP-EP (7x7) |
||
Microchip Technology |
IC MUZ DUAL 2:1 PECL/ECL 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione11.244 |
|
2 x 2:1 | 1 | - | Dual Supply | ±3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC MULTIPLXR 4:1/2:1 DIFF 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione18.852 |
|
4 x 2:1 | 1 | - | Dual Supply | -4.2 V ~ -5.5 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC MULTIPLXR 4:1/2:1 DIFF 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione6.312 |
|
4 x 2:1 | 1 | - | Dual Supply | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC MUX 2:1 DUAL 3.3V/5V 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione53.160 |
|
2 x 2:1 | 1 | - | Dual Supply | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC CROSSPOINT SWITCH DUAL 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione6.256 |
|
2 x 2:2 | 2 | - | Single Supply | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CROSSPOINT SWITCH 4X4 44MLF
|
pacchetto: 44-VFQFN Exposed Pad, 44-MLF? |
Azione6.960 |
|
1 x 4:4 | 1 | - | Single Supply | 2.375 V ~ 2.625 V, 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF? | 44-MLF? (7x7) |
||
Microchip Technology |
IC CROSSPOINT SWITCH DUAL 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione7.104 |
|
2 x 2:2 | 2 | - | Single Supply | 2.375 V ~ 2.625 V, 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC MUX 8:1 PREC 1:2 LVPECL 44MLF
|
pacchetto: 44-VFQFN Exposed Pad, 44-MLF? |
Azione5.232 |
|
1 x 8:1 | 1 | - | Single Supply | 2.375 V ~ 2.625 V, 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF? | 44-MLF? (7x7) |
||
Microchip Technology |
IC XPOINT SW 4X4 PREC 44MLF
|
pacchetto: 44-VFQFN Exposed Pad, 44-MLF? |
Azione3.104 |
|
1 x 4:4 | 1 | - | Single Supply | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF? | 44-MLF? (7x7) |
||
Microchip Technology |
IC CROSSPOINT SWITCH DUAL 32TQFP
|
pacchetto: 32-TQFP Exposed Pad |
Azione3.104 |
|
2 x 2:2 | 2 | - | Single Supply | 2.3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-TQFP Exposed Pad | 32-TQFP-EP (7x7) |
||
Microchip Technology |
IC CROSSPOINT SWITCH 2x2 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione4.336 |
|
1 x 2:2 | 1 | - | Single Supply | 2.375 V ~ 2.625 V, 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC MUX DIFF LVPECL 4:1 32-MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione5.168 |
|
1 x 4:1 | 1 | - | Single Supply | 2.375 V ~ 2.625 V, 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC MUX DIFF CML 4:1 PREC 32-MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione2.880 |
|
1 x 4:1 | 1 | - | Single Supply | 2.375 V ~ 2.625 V, 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC MUX DUAL 2:1 LVPECL 32-MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione4.384 |
|
1 x 2:1 | 2 | - | Single Supply | 2.375 V ~ 2.625 V, 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC MUX LVPECL 2:1 5BGPS 16-MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione15.060 |
|
1 x 2:1 | 1 | - | Single Supply | 2.375 V ~ 2.625 V, 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC MUX LVPECL 2:1 10.7BGPS 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione2.768 |
|
1 x 2:1 | 1 | - | Single Supply | 2.375 V ~ 2.625 V, 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC MUX 2:1 DIFF PREC HS 16-MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione3.552 |
|
1 x 2:1 | 1 | - | Single Supply | 2.375 V ~ 2.625 V, 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC MUX LVPECL 2:1 10.7BGPS 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione11.988 |
|
1 x 2:1 | 1 | - | Single Supply | 2.375 V ~ 2.625 V, 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC MUX 2:1 DUAL 3.3/5V 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione171.156 |
|
2 x 2:1 | 1 | - | Dual Supply | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC MUX DIFF 4:1 3.3V/5V 20-TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione3.104 |
|
1 x 4:1 | 1 | - | Dual Supply | ±3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC MUX 4:1 LVDS DIFF 3.3V 32-MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione4.480 |
|
1 x 4:1 | 1 | - | Single Supply | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC MUX DUAL DIFF 3.3V/5V 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione4.848 |
|
2 x 2:1 | 1 | - | Dual Supply | ±3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |