Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Applications | Number of Channels | Interface | Voltage - Supply | Operating Temperature | Specifications | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC VOICE PROCESSOR CODEC 56QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione12.000 |
|
Communication Systems | 2 | I2S, SPI, UART | 1.2V | -40°C ~ 85°C (TA) | 163.84Mbps | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
Microsemi Corporation |
IC AUDIO PROC IP PHONE ADV 64QFN
|
pacchetto: 64-VFQFN Exposed Pad |
Azione6.976 |
|
Consumer Audio | 2 | SPI | - | - | 48kHz | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Microsemi Corporation |
IC AUDIO PROC AUTO HANDSFR 64QFN
|
pacchetto: 64-VFQFN Exposed Pad |
Azione3.472 |
|
Automotive Audio | 2 | SPI | - | - | 48kHz | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Microsemi Corporation |
IC AUDIO PROC CONN HOME 64QFN
|
pacchetto: 64-VFQFN Exposed Pad |
Azione6.128 |
|
Consumer Audio | 2 | SPI | - | - | 48kHz | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Microsemi Corporation |
IC AUDIO PROC AUTO HANDSFR 64QFN
|
pacchetto: 64-VFQFN Exposed Pad |
Azione7.264 |
|
Automotive Audio | 2 | SPI | - | - | 48kHz | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Microsemi Corporation |
IC AUDIO PROC SECURITY CAM 64QFN
|
pacchetto: 64-VFQFN Exposed Pad |
Azione5.120 |
|
Consumer Audio | 1 | SPI | - | - | 48kHz | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Microsemi Corporation |
IC AUDIO PROC SEC CAM 56WLCSP
|
pacchetto: - |
Azione4.544 |
|
10 Base-T | 1 | SPI | - | - | 48kHz | - | 56-WLCSP (3.05x3.05) |
||
Microsemi Corporation |
IC AUDIO PROC SECURITY CAM 64QFN
|
pacchetto: 64-VFQFN Exposed Pad |
Azione6.768 |
|
Consumer Audio | 2 | - | - | - | - | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Microsemi Corporation |
IC VOICE PROCESSOR 100LQFP
|
pacchetto: 100-LQFP |
Azione16.272 |
|
Communication Systems | 2 | I2S, SPI, UART | 1.2V | -40°C ~ 85°C (TA) | 163.84Mbps | 100-LQFP | 100-LQFP (14x14) |
||
Microsemi Corporation |
IC VOICE PROCESSOR CODEC 56QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione10.104 |
|
Communication Systems | 2 | I2S, SPI, UART | 1.2V | -40°C ~ 85°C (TA) | 163.84Mbps | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
Microsemi Corporation |
IC VOICE PROCESSOR
|
pacchetto: - |
Azione21.372 |
|
- | - | - | - | - | - | - | - |
||
Microsemi Corporation |
IC AUDIO PROC SEC CAM 56WLCSP
|
pacchetto: - |
Azione24.720 |
|
Consumer Audio | 1 | I2C, SPI, UART | - | - | - | - | 64-QFN |
||
Microsemi Corporation |
IC AUDIO PROC SECURITY CAM 64QFN
|
pacchetto: 64-VFQFN Exposed Pad |
Azione13.404 |
|
Consumer Audio | 1 | SPI | - | - | 48kHz | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Microsemi Corporation |
IC AUDIO PROC IP PHONE ADV 64QFN
|
pacchetto: 64-VFQFN |
Azione15.822 |
|
Consumer Audio | 2 | SPI | - | - | 48kHz | 64-VFQFN | 64-QFN (9x9) |
||
Microsemi Corporation |
IC AUDIO PROC CONN HOME 64QFN
|
pacchetto: 64-VFQFN Exposed Pad |
Azione19.464 |
|
Consumer Audio | 2 | SPI | - | - | 48kHz | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Microsemi Corporation |
OCTAL NGCC SLAC WITH 196 PIN BGA
|
pacchetto: 196-BGA |
Azione5.360 |
|
- | - | - | - | - | - | 196-BGA | 196-BGA |
||
Microsemi Corporation |
VCPNG, 72CH, LBGA144, ROHS6
|
pacchetto: 144-BGA |
Azione4.720 |
|
- | - | - | - | - | - | 144-BGA | 144-BGA |
||
Microsemi Corporation |
VOICE CONTROLLED TV ASR
|
pacchetto: 64-VFQFN Exposed Pad |
Azione7.808 |
|
Audio Systems | 4 | I²C, SPI | - | - | - | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Microsemi Corporation |
VOICE CONTROLLED TV ASR, T&R
|
pacchetto: 64-VFQFN Exposed Pad |
Azione2.720 |
|
Audio Systems | 4 | I²C, SPI | - | - | - | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Microsemi Corporation |
VOICE CONTROLLED TV ASR
|
pacchetto: 56-BGA, WLCSP |
Azione2.720 |
|
Audio Systems | 4 | I²C, SPI | - | - | - | 56-BGA, WLCSP | 56-WLCSP (3.05x3.05) |
||
Microsemi Corporation |
CONNECTED HOME ASR LITE
|
pacchetto: 64-VFQFN Exposed Pad |
Azione7.088 |
|
Communication Systems | 4 | I²C, SPI | - | - | - | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Microsemi Corporation |
CONNECTED HOME ASR LITE, T&R
|
pacchetto: 64-VFQFN Exposed Pad |
Azione2.528 |
|
Communication Systems | 4 | I²C, SPI | - | - | - | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Microsemi Corporation |
ZL38067U CSP SENSORY ASR LITE B0
|
pacchetto: 56-UFBGA, WLCSP |
Azione4.224 |
|
Communication Systems | 4 | I²C, SPI | - | - | - | 56-UFBGA, WLCSP | 56-WLCSP (3.05x3.05) |
||
Microsemi Corporation |
ADV CAMERA AEC W SOUND CLASSIFIE
|
pacchetto: 64-VFQFN Exposed Pad |
Azione5.040 |
|
Communication Systems | 4 | I²C, SPI | - | - | - | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Microsemi Corporation |
ADV CAMERA AEC W SOUND CLASSIFIE
|
pacchetto: 56-UFBGA, WLCSP |
Azione3.456 |
|
Communication Systems | 4 | I²C, SPI | - | - | - | 56-UFBGA, WLCSP | 56-WLCSP (3.05x3.05) |
||
Microsemi Corporation |
USB 4 CH AUDIO AEC, TRAY
|
pacchetto: 64-VFQFN Exposed Pad |
Azione6.864 |
|
Communication Systems | 4 | I²C, SPI | - | - | - | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Microsemi Corporation |
USB 2 CH AUDIO AEC
|
pacchetto: 56-UFBGA, WLCSP |
Azione7.408 |
|
Communication Systems | 4 | I²C, SPI | 1.14 V ~ 3.465 V | -40°C ~ 85°C (TA) | - | 56-UFBGA, WLCSP | 56-WLCSP (3.05x3.05) |
||
Microsemi Corporation |
USB 4 CH AUDIO AE
|
pacchetto: 64-VFQFN Exposed Pad |
Azione23.538 |
|
Communication Systems | 4 | - | - | - | - | 64-VFQFN Exposed Pad | 64-QFN (9x9) |