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Prodotti Microsemi Corporation - Integrato - System On Chip (SoC)

Record 761
Pagina  8/28
Immagine
Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
Core Processor
Flash Size
RAM Size
Peripherals
Connectivity
Speed
Primary Attributes
Operating Temperature
Package / Case
Supplier Device Package
M2S025-1FCS325I
Microsemi Corporation

IC FPGA SOC 25K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 25K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 325-TFBGA
  • Supplier Device Package: 325-BGA (11x11)
pacchetto: 325-TFBGA
Azione7.728
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 25K Logic Modules
-40°C ~ 100°C (TJ)
325-TFBGA
325-BGA (11x11)
M2S025-FG484
Microsemi Corporation

IC FPGA SOC 25K LUTS 484FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 25K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FPBGA (23x23)
pacchetto: 484-BGA
Azione6.448
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 25K Logic Modules
0°C ~ 85°C (TJ)
484-BGA
484-FPBGA (23x23)
A2F500M3G-1PQ208I
Microsemi Corporation

IC FPGA 500K GATES 512KB 208QFP

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: Ethernet, I2C, SPI, UART/USART
  • Speed: 100MHz
  • Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
pacchetto: 208-BFQFP
Azione3.728
ARM? Cortex?-M3
512KB
64KB
DMA, POR, WDT
Ethernet, I2C, SPI, UART/USART
100MHz
ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
-40°C ~ 100°C (TJ)
208-BFQFP
208-PQFP (28x28)
M2S010TS-1FG484I
Microsemi Corporation

IC FPGA SOC 10K LUTS 484FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 10K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FPBGA (23x23)
pacchetto: 484-BGA
Azione4.016
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 10K Logic Modules
-40°C ~ 100°C (TJ)
484-BGA
484-FPBGA (23x23)
M2S010TS-1FGG484I
Microsemi Corporation

IC FPGA SOC 10K LUTS 484FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 10K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FPBGA (23x23)
pacchetto: 484-BGA
Azione4.384
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 10K Logic Modules
-40°C ~ 100°C (TJ)
484-BGA
484-FPBGA (23x23)
M2S010TS-1VFG400T2
Microsemi Corporation

IC FPGA SOC

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 10K Logic Modules
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 400-LFBGA
  • Supplier Device Package: 400-VFBGA (17x17)
pacchetto: 400-LFBGA
Azione5.568
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 10K Logic Modules
-40°C ~ 125°C (TJ)
400-LFBGA
400-VFBGA (17x17)
M2S025TS-FCSG325
Microsemi Corporation

IC FPGA SOC 25K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 25K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 325-TFBGA
  • Supplier Device Package: 325-BGA (11x11)
pacchetto: 325-TFBGA
Azione6.480
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 25K Logic Modules
0°C ~ 85°C (TJ)
325-TFBGA
325-BGA (11x11)
M2S025TS-FCS325
Microsemi Corporation

IC FPGA SOC 25K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 25K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 325-TFBGA
  • Supplier Device Package: 325-BGA (11x11)
pacchetto: 325-TFBGA
Azione6.592
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 25K Logic Modules
0°C ~ 85°C (TJ)
325-TFBGA
325-BGA (11x11)
M2S025T-FCSG325I
Microsemi Corporation

IC FPGA SOC 25K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 25K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 325-TFBGA
  • Supplier Device Package: 325-BGA (11x11)
pacchetto: 325-TFBGA
Azione6.512
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 25K Logic Modules
-40°C ~ 100°C (TJ)
325-TFBGA
325-BGA (11x11)
M2S025T-FCS325I
Microsemi Corporation

IC FPGA SOC 25K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 25K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 325-TFBGA
  • Supplier Device Package: 325-BGA (11x11)
pacchetto: 325-TFBGA
Azione3.376
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 25K Logic Modules
-40°C ~ 100°C (TJ)
325-TFBGA
325-BGA (11x11)
M2S025T-1FCSG325
Microsemi Corporation

IC FPGA SOC 25K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 25K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 325-TFBGA
  • Supplier Device Package: 325-BGA (11x11)
pacchetto: 325-TFBGA
Azione5.520
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 25K Logic Modules
0°C ~ 85°C (TJ)
325-TFBGA
325-BGA (11x11)
M2S025T-1FCS325
Microsemi Corporation

IC FPGA SOC 25K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 25K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 325-TFBGA
  • Supplier Device Package: 325-BGA (11x11)
pacchetto: 325-TFBGA
Azione6.352
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 25K Logic Modules
0°C ~ 85°C (TJ)
325-TFBGA
325-BGA (11x11)
A2F500M3G-FG484
Microsemi Corporation

IC FPGA 500K GATES 512KB 484-BGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FPBGA (23x23)
pacchetto: 484-BGA
Azione6.544
ARM? Cortex?-M3
512KB
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
0°C ~ 85°C (TJ)
484-BGA
484-FPBGA (23x23)
M2S025-FCSG325I
Microsemi Corporation

IC FPGA SOC 25K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 25K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 325-TFBGA
  • Supplier Device Package: 325-BGA (11x11)
pacchetto: 325-TFBGA
Azione4.784
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 25K Logic Modules
-40°C ~ 100°C (TJ)
325-TFBGA
325-BGA (11x11)
M2S025-FCS325I
Microsemi Corporation

IC FPGA SOC 25K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 25K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 325-TFBGA
  • Supplier Device Package: 325-BGA (11x11)
pacchetto: 325-TFBGA
Azione5.088
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 25K Logic Modules
-40°C ~ 100°C (TJ)
325-TFBGA
325-BGA (11x11)
M2S025-1FCSG325
Microsemi Corporation

IC FPGA SOC 25K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 25K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 325-TFBGA
  • Supplier Device Package: 325-BGA (11x11)
pacchetto: 325-TFBGA
Azione6.896
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 25K Logic Modules
0°C ~ 85°C (TJ)
325-TFBGA
325-BGA (11x11)
M2S025-1FCS325
Microsemi Corporation

IC FPGA SOC 25K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 25K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 325-TFBGA
  • Supplier Device Package: 325-BGA (11x11)
pacchetto: 325-TFBGA
Azione2.320
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 25K Logic Modules
0°C ~ 85°C (TJ)
325-TFBGA
325-BGA (11x11)
A2F500M3G-PQ208I
Microsemi Corporation

IC FPGA 500K GATES 512KB 208QFP

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: Ethernet, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
pacchetto: 208-BFQFP
Azione4.144
ARM? Cortex?-M3
512KB
64KB
DMA, POR, WDT
Ethernet, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
-40°C ~ 100°C (TJ)
208-BFQFP
208-PQFP (28x28)
M2S025-VF400
Microsemi Corporation

IC FPGA SOC 25K LUTS 400VFBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 25K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 400-LFBGA
  • Supplier Device Package: 400-VFBGA (17x17)
pacchetto: 400-LFBGA
Azione2.912
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 25K Logic Modules
0°C ~ 85°C (TJ)
400-LFBGA
400-VFBGA (17x17)
M2S025-VFG256
Microsemi Corporation

IC FPGA SOC 25K LUTS 256VFG

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 25K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FPBGA (17x17)
pacchetto: 256-LBGA
Azione5.520
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 25K Logic Modules
0°C ~ 85°C (TJ)
256-LBGA
256-FPBGA (17x17)
M2S025-VF256
Microsemi Corporation

IC FPGA SOC 25K LUTS 256VF

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 25K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-VFBGA
  • Supplier Device Package: 256-BGA (17x17)
pacchetto: 256-VFBGA
Azione7.552
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 25K Logic Modules
0°C ~ 85°C (TJ)
256-VFBGA
256-BGA (17x17)
A2F500M3G-1PQ208
Microsemi Corporation

IC FPGA 500K GATES 512KB 208QFP

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: Ethernet, I2C, SPI, UART/USART
  • Speed: 100MHz
  • Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
pacchetto: 208-BFQFP
Azione6.064
ARM? Cortex?-M3
512KB
64KB
DMA, POR, WDT
Ethernet, I2C, SPI, UART/USART
100MHz
ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
0°C ~ 85°C (TJ)
208-BFQFP
208-PQFP (28x28)
M2S010TS-FGG484I
Microsemi Corporation

IC FPGA SOC 10K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 10K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FPBGA (23x23)
pacchetto: 484-BGA
Azione3.040
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 10K Logic Modules
-40°C ~ 100°C (TJ)
484-BGA
484-FPBGA (23x23)
M2S010TS-FG484I
Microsemi Corporation

IC FPGA SOC 10K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 10K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FPBGA (23x23)
pacchetto: 484-BGA
Azione6.848
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 10K Logic Modules
-40°C ~ 100°C (TJ)
484-BGA
484-FPBGA (23x23)
M2S010TS-1FGG484
Microsemi Corporation

IC FPGA SOC 10K LUTS 484FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 10K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FPBGA (23x23)
pacchetto: 484-BGA
Azione3.488
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 10K Logic Modules
0°C ~ 85°C (TJ)
484-BGA
484-FPBGA (23x23)
M2S010TS-1FG484
Microsemi Corporation

IC FPGA SOC 10K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 10K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FPBGA (23x23)
pacchetto: 484-BGA
Azione4.032
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 10K Logic Modules
0°C ~ 85°C (TJ)
484-BGA
484-FPBGA (23x23)
M2S025T-FCSG325
Microsemi Corporation

IC FPGA SOC 25K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 25K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 325-TFBGA
  • Supplier Device Package: 325-BGA (11x11)
pacchetto: 325-TFBGA
Azione7.280
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 25K Logic Modules
0°C ~ 85°C (TJ)
325-TFBGA
325-BGA (11x11)
M2S025T-FCS325
Microsemi Corporation

IC FPGA SOC 25K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 25K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 325-TFBGA
  • Supplier Device Package: 325-BGA (11x11)
pacchetto: 325-TFBGA
Azione5.040
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 25K Logic Modules
0°C ~ 85°C (TJ)
325-TFBGA
325-BGA (11x11)