Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ON Semiconductor |
IC CLK BUFFER 1:2 1GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione23.196 |
|
1 | 1:2 | Yes/Yes | ECL, PECL | ECL, PECL | 1GHz | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 1:2 3GHZ 8TSSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione19.536 |
|
1 | 1:2 | Yes/Yes | ECL, PECL | ECL, PECL | 3GHz | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP |
||
ON Semiconductor |
IC CLK MULTIPLEXR 4:2 8GHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione7.072 |
|
1 | 4:2 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 8GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
ON Semiconductor |
IC CLK BUFFER 1:4 2GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione10.416 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
ON Semiconductor |
IC CLK BUFFER 1:2 2GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione17.424 |
|
1 | 1:2 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL, LVTTL | LVDS | 2GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
ON Semiconductor |
IC CLK BUFFER 1:2 2GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione4.896 |
|
1 | 1:2 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL, LVTTL | LVDS | 2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
ON Semiconductor |
IC CLK BUFFER 1:4 8.5GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione10.716 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | CML | 8.5GHz | 1.71 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
ON Semiconductor |
IC CLK BUFFER 1:4 2GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione28.446 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
ON Semiconductor |
IC CLK BUFFER 1:2 2GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione27.732 |
|
1 | 1:2 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL, LVTTL | LVDS | 2GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
ON Semiconductor |
IC CLK BUFFER 1:4 180MHZ 8DFN
|
pacchetto: 8-VFDFN Exposed Pad |
Azione64.980 |
|
1 | 1:4 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 180MHz | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x2) |
||
ON Semiconductor |
IC CLK BUFFER 1:4 200MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione109.080 |
|
1 | 1:4 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 200MHz | 2.375 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
FANOUT BUFFER
|
pacchetto: - |
Azione6.992 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
ON Semiconductor |
IC CLK BUFFER 1:4 750MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione2.352 |
|
1 | 1:4 | Yes/Yes | Clock | Clock | 750MHz | 4.2 V ~ 5.7 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 1:4 750MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione6.352 |
|
1 | 1:4 | Yes/Yes | Clock | Clock | 750MHz | 4.2 V ~ 5.7 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 1:2/1:6 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione7.184 |
|
2 | 1:2, 1:6 | No/No | GTLP, TTL | GTLP, TTL | - | 3.15 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:2/1:6 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione6.368 |
|
2 | 1:2, 1:6 | No/No | GTLP, TTL | GTLP, TTL | - | 3.15 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:2/1:6 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione5.040 |
|
2 | 1:2, 1:6 | No/No | GTLP, TTL | GTLP, TTL | - | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:2/1:6 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione3.984 |
|
2 | 1:2, 1:6 | No/No | GTLP, TTL | GTLP, TTL | - | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
ON Semiconductor |
IC CLK BUF 1:2/1:6 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione5.472 |
|
2 | 1:2, 1:6 | No/No | GTLP, LVTTL | GTLP, LVTTL | 175MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
ON Semiconductor |
IC CLK BUF 1:2/1:6 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione6.688 |
|
2 | 1:2, 1:6 | No/No | GTLP, LVTTL | GTLP, LVTTL | 175MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:2 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.016 |
|
1 | 1:2 | Yes/Yes | ECL | ECL | - | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 1:2 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.732 |
|
1 | 1:2 | Yes/Yes | ECL | ECL | - | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 1:2 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.800 |
|
1 | 1:2 | Yes/Yes | ECL | ECL | - | 4.2 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 1:2 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.616 |
|
1 | 1:2 | Yes/Yes | ECL | ECL | - | 4.2 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC CLK FANOUT/BUFFER 1:2 8WDFN
|
pacchetto: - |
Azione4.512 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
ON Semiconductor |
IC CLK FANOUT/BUFFER 1:8 16TSSOP
|
pacchetto: - |
Azione5.904 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
ON Semiconductor |
IC CLK FANOUT/BUFFER 1:4 8WDFN
|
pacchetto: - |
Azione6.144 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
ON Semiconductor |
LVCMOS LVTTL FANOUT
|
pacchetto: - |
Azione5.344 |
|
- | - | - | - | - | - | - | - | - | - | - |