Prodotti Sullins Connector Solutions - Zoccoli per C.I., transistor

Numero di parte	Produttore	Descrizione	pacchetto	Azione	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
ASU02DXTB	Sullins Connector Solutions	CONN SOCKET AXIAL 2POS GOLD Type: Axial Number of Positions or Pins (Grid): 2 (Rectangular) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: - Mounting Type: Through Hole Features: Board Guide Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: - Housing Material: - Operating Temperature: -	pacchetto: -	Azione6.066	2 (Rectangular)	-	Gold	10µin (0.25µm)	-	Through Hole	Board Guide	Solder	-	Gold	10µin (0.25µm)	-	-	-
TMJ03DKSD-S1512	Sullins Connector Solutions	CONN TRANSIST TO-254 3POS GOLD Type: Transistor, TO-254 Number of Positions or Pins (Grid): 3 (Rectangular) Pitch - Mating: 0.150" (3.81mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Flange Termination: Solder Pitch - Post: 0.150" (3.81mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -50°C ~ 175°C	pacchetto: -	Azione8.424	3 (Rectangular)	0.150" (3.81mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Flange	Solder	0.150" (3.81mm)	Gold	30µin (0.76µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-50°C ~ 175°C
TDU03DTON	Sullins Connector Solutions	CONN SOCKET TRANSIST 3POS GOLD Type: Transistor Number of Positions or Pins (Grid): 3 (Rectangular) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Board Guide Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -55°C ~ 175°C	pacchetto: -	Azione7.884	3 (Rectangular)	-	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Board Guide	Solder	-	Gold	30µin (0.76µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-55°C ~ 175°C
FMC05DRTN-S1682	Sullins Connector Solutions	CONN TRANSIST TO-220/TO-247 5POS Type: Transistor, TO-220 and TO-247 Number of Positions or Pins (Grid): 5 (Rectangular) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Nickel Boron Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Nickel Boron Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -65°C ~ 200°C	pacchetto: -	Azione5.004	5 (Rectangular)	-	Gold	30µin (0.76µm)	Nickel Boron	Through Hole	-	Solder	-	Gold	30µin (0.76µm)	Nickel Boron	Polyphenylene Sulfide (PPS)	-65°C ~ 200°C
TCC03DKSN-S1713	Sullins Connector Solutions	CONN TRANSIST TO-262 3POS GOLD Type: Transistor, TO-262 Number of Positions or Pins (Grid): 3 (Rectangular) Pitch - Mating: 0.150" (3.81mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: 0.150" (3.81mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -50°C ~ 175°C	pacchetto: -	Azione6.480	3 (Rectangular)	0.150" (3.81mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.150" (3.81mm)	Gold	30µin (0.76µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-50°C ~ 175°C
MPP-1100-05-DS-4GR(S1402)	Sullins Connector Solutions	CONN TRANSIST TO-220/TO-247 5POS Type: Transistor, TO-220 and TO-247 Number of Positions or Pins (Grid): 5 (Rectangular) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Nickel Boron Mounting Type: Through Hole, Right Angle Features: - Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Nickel Boron Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -65°C ~ 200°C	pacchetto: -	Azione6.624	5 (Rectangular)	-	Gold	30µin (0.76µm)	Nickel Boron	Through Hole, Right Angle	-	Solder	-	Gold	30µin (0.76µm)	Nickel Boron	Polyphenylene Sulfide (PPS)	-65°C ~ 200°C
TCC05DCSN-S1403	Sullins Connector Solutions	CONN TRANSIST TO-220/TO-247 5POS Type: Transistor, TO-220 and TO-247 Number of Positions or Pins (Grid): 5 (Rectangular) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -65°C ~ 175°C	pacchetto: -	Azione8.334	5 (Rectangular)	-	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	-	Gold	30µin (0.76µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 175°C
TDU03DTOD	Sullins Connector Solutions	CONN SOCKET TRANSIST 3POS GOLD Type: Transistor Number of Positions or Pins (Grid): 3 (Rectangular) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Board Guide, Flange Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -55°C ~ 175°C	pacchetto: -	Azione6.240	3 (Rectangular)	-	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Board Guide, Flange	Solder	-	Gold	30µin (0.76µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-55°C ~ 175°C