0
+86-755-82529637 ext. 811
TOP
Contattaci
SalesDept@heisener.com +86-755-82529637 ext. 811
Language Translation
  • • English
  • • Español
  • • Deutsch
  • • Français
  • • Italiano
  • • Nederlands
  • • Português
  • • русский язык
  • • 日本語
  • • 한국어
  • • 简体中文
  • • 繁體中文

* Please refer to the English Version as our Official Version.

Cambia Paese

Se il vostro paese non è elencato, seleziona International come vostra regione.

  • International
Americhe
  • Argentina
  • Brasile
  • Canada
  • Cile
  • Columbia
  • Costa Rica
  • Repubblica dominicana
  • Equador
  • Guatemala
  • Honduras
  • Messico
  • Perù
  • Porto Rico
  • Stati Uniti d'America
  • Uruguay
  • Venezuela
Asia/Pacifico
  • Australia
  • Cina
  • Hong Kong
  • Indonesia
  • Israele
  • India
  • Giappone
  • Repubblica di Corea
  • Malesia
  • Nuova Zelanda
  • Filippine
  • Singapore
  • Thailandia
  • Taiwan
  • Vietnam
Europa
  • Austria
  • Belgio
  • Bulgaria
  • Svizzera
  • Repubblica Ceca
  • Germania
  • Danimarca
  • Estonia
  • Spagna
  • Finlandia
  • Francia
  • Regno Unito
  • Grecia
  • Croazia
  • Ungheria
  • Irlanda
  • Italia
  • Paesi Bassi
  • Norvegia
  • Polonia
  • Portogallo
  • Romania
  • Federazione russa
  • Svezia
  • Slovacchia
  • Turchia

Surface mounting type MOSFET relays at the forefront of industry

Technology Cover
Data di Pubblicazione: 2019-06-30, Omron Electronics Inc-EMC Div

OMRON's G3VM MOSFET relays are at the forefront of the industry in Solid State Relay technology, employing an input LED, PDA used as photocoupler and MOSFET chip in the load switching current. As well as being maintenance free, the relay offers high-speed operation and compact size, promoting the replacement of mechanical relays even further. The company is expanding its extensive range of products, from what is claimed to be the industry's smallest class new package, to its high current, high dielectric strength and high sensitivity models. Many models of the relays are built with mould resin to achieve high sensitivity. High dielectric strength types adopted a black package (black mould resin), where high dielectric strength was accomplished by the double mould structure.

Typical applications include security equipment; factory automation and industrial equipment; test and measurement equipment; communication equipment; energy related equipment; and amusement and payment equipment.

Prodotti Correlati