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Vishay Intertechnology, Inc. is pleased to announce the launch of its new CHA Series of film resistors on August 2, 2024, which have been certified to AEC-Q200 standards. These high-performance resistors are designed to deliver exceptional high-frequency performance up to 70 GHz for applications in automotive, aerospace, avionics, and telecommunications.

The Okinawa Institute of Science and Technology (OIST) has announced a revolutionary Extreme Ultraviolet (EUV) lithography technology that transcends the standard limits of semiconductor manufacturing. This cutting-edge design allows for the use of significantly smaller EUV light sources, with power consumption reduced to less than one-tenth of traditional EUV lithography machines. This advancement not only lowers costs but also greatly enhances the reliability and lifespan of the equipment.

As automotive technology continues to advance, the role of automotive relays in vehicle electrical systems has become increasingly crucial. Automotive relays are electromagnetic switches that control various electrical devices in vehicles by switching circuits on and off. Serving as "switches" within electrical systems, relays can handle high currents and voltages, enabling automatic and remote control functions. Therefore, selecting the appropriate automotive relay is essential for the proper functioning of a vehicle.

According to a report by Taiwanese media outlet DIGITIMES, TSMC is set to introduce High NA EUV lithography technology in its A14P process, with a potential launch as early as 2028. Currently, TSMC's most advanced process is the A16, which supports backside power delivery network (BSPDN) and is scheduled for mass production in the second half of 2026. The A16 will still use the traditional Low NA (0.33NA) EUV lithography machines.

The Quantum Nano Science Center (QNS) at the Institute for Basic Science (IBS) in South Korea, in collaboration with the Forschungszentrum Jülich in Germany, has developed the world’s first atomic-scale quantum sensor capable of detecting minute magnetic fields at the atomic level. The groundbreaking research was published on the 25th in Nature Nanotechnology. This achievement marks a significant milestone in quantum technology and is expected to have profound implications across multiple scientific fields.

On the 25th, the Institute of Chemistry at the Chinese Academy of Sciences announced a significant advancement in the field of high-performance polymer thermoelectric materials. Researchers from the Institute and collaborating institutions have developed a novel high-performance polymer thermoelectric material—PMHJ film. Compared to conventional polymer films, the PMHJ film is expected to greatly enhance the thermoelectric performance of the material, providing a new approach for high-performance plastic-based thermoelectric materials.

July 23, 2024 — On Semiconductor announced yesterday that it has been selected as a primary supplier for the main traction inverters of Volkswagen's Scalable Systems Platform (SSP). On Semiconductor will provide a comprehensive power module solution based on its advanced SiC (silicon carbide) technology for this platform. The SSP, Volkswagen's unified electric vehicle platform designed for 80% of its next-generation vehicles, is slated for release in 2026.

In a bid to reduce reliance on Asia and enhance chip packaging capabilities within the Americas, the U.S. government has launched an initiative aimed at strengthening Latin American chip packaging capacities. Notably, Intel already operates an assembly, testing, and packaging plant in San Jose, Costa Rica. However, it remains unclear if Intel will benefit from the new initiative.

July 17, 2024 – According to a blog post by Korean media outlet Bloter on July 15, Samsung plans to incorporate silicon capacitors in its upcoming Exynos 2500 chip. Silicon capacitors, typically constructed with a three-layer structure (Metal/Insulator/Metal, MIM), are ultra-thin and exhibit characteristics similar to semiconductors. This enables them to maintain stable voltages and better manage current fluctuations, making them highly suitable for integrated circuits.

July 12, 2024 - Riverside, California - Bourns, a leading global supplier of electronic components for power, protection, and sensing solutions, proudly announces the launch of its SSD Digital Series current sensors.