Zoccoli per C.I., transistor - adattatori | Connettori, interconnessioni

Numero di parte	Produttore	Descrizione	pacchetto	Azione	Convert To (Adapter End)	Number of Pins	Pitch - Mating	Contact Finish - Mating	Mounting Type	Termination	Pitch - Post	Contact Finish - Post	Housing Material	Board Material
96-080M80	Aries Electronics	SOCKET ADAPTER QFP TO 80PGA Convert From (Adapter End): QFP Convert To (Adapter End): PGA Number of Pins: 80 Pitch - Mating: 0.031" (0.80mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	pacchetto: -	Azione3.490	PGA	80	0.031" (0.80mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
290-1294-09-0602J	3M	RECEPTACLE DIP SOCKET 90POS .9" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	pacchetto: -	Azione3.454	-	-	-	-	-	-	-	-	-	-
97-56001-P	Aries Electronics	SOCKET ADAPTER QFP TO 169PGA Convert From (Adapter End): QFP Convert To (Adapter End): PGA Number of Pins: 169 Pitch - Mating: 0.025" (0.64mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	pacchetto: -	Azione3.744	PGA	169	0.025" (0.64mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
84-505-110	Aries Electronics	SOCKET ADAPTER PLCC TO 84PGA Convert From (Adapter End): PLCC Convert To (Adapter End): PGA Number of Pins: 84 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	pacchetto: -	Azione7.398	PGA	84	0.050" (1.27mm)	-	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
28-555000-00	Aries Electronics	SOCKET ADAPTER SSOP TO 28SOWIC Convert From (Adapter End): SSOP Convert To (Adapter End): SOWIC Number of Pins: 28 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	pacchetto: -	Azione6.858	SOWIC	28	0.026" (0.65mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
16-354000-21-RC	Aries Electronics	SOCKET ADAPTER DIP TO 16SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 16 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	pacchetto: -	Azione7.524	SOIC	16	0.100" (2.54mm)	Gold	Surface Mount	Solder	0.050" (1.27mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
24-354W00-20	Aries Electronics	DIP-TO-SOWIC ADAPTER Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOWIC Number of Pins: 24 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	pacchetto: -	Azione8.946	SOWIC	24	0.100" (2.54mm)	Gold	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	Polyamide (PA46), Nylon 4/6, Glass Filled	-
24-35W000-11-RC	Aries Electronics	SOCKET ADAPT SOIC-W TO 24DIP 0.3 Convert From (Adapter End): SOIC-W Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 24 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	pacchetto: -	Azione3.654	DIP, 0.3" (7.62mm) Row Spacing	24	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
16-307349-11-RC	Aries Electronics	SOCKET ADAPTER PLCC TO 16DIP 0.3 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 16 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	pacchetto: -	Azione7.596	DIP, 0.3" (7.62mm) Row Spacing	16	0.050" (1.27mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
1107254-36	Aries Electronics	SOCKET ADAPTER DIP TO 36DIP 0.3 Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 36 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	pacchetto: -	Azione8.442	DIP, 0.3" (7.62mm) Row Spacing	36	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-
26-665000-00	Aries Electronics	SCK ADAPT 26P SOIC-W TO SOIC 0.6 Convert From (Adapter End): SOIC-W Convert To (Adapter End): SOIC Number of Pins: 26 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	pacchetto: -	Azione4.158	SOIC	26	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
24-665000-00	Aries Electronics	SCK ADAPT 24P SOIC-W TO SOIC 0.6 Convert From (Adapter End): SOIC-W Convert To (Adapter End): SOIC Number of Pins: 24 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	pacchetto: -	Azione3.204	SOIC	24	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
7131-108-18	Aries Electronics	SOCKET ADAPT HB2E RELAY TO 8DIP Convert From (Adapter End): HB2E Relay Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 8 Pitch - Mating: - Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: - Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	pacchetto: -	Azione7.398	DIP, 0.3" (7.62mm) Row Spacing	8	-	-	Through Hole	Solder	-	Tin-Lead	-	FR4 Epoxy Glass
14-666000-00	Aries Electronics	SOCKET ADAPTER SOIC TO 14SOWIC Convert From (Adapter End): SOIC Convert To (Adapter End): SOWIC Number of Pins: 14 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	pacchetto: -	Azione6.822	SOWIC	14	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
28-505-111P	Aries Electronics	SOCKET ADAPTER PLCC TO 28PGA Convert From (Adapter End): PLCC Convert To (Adapter End): PGA Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	pacchetto: -	Azione7.902	PGA	28	0.050" (1.27mm)	-	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
232-1285-09-0602J	3M	RECEPTACLE DIP SOCKET 32POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	pacchetto: -	Azione4.014	-	-	-	-	-	-	-	-	-	-
PA-SSD3SM18-24	Logical Systems Inc.	SOCKET ADAPTER SSOP TO 24DIP Convert From (Adapter End): SSOP Convert To (Adapter End): DIP Number of Pins: 24 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	pacchetto: -	Azione4.338	DIP	24	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
LCQT-QFP0.8-64	Aries Electronics	SOCKET ADAPTER MULT PKG TO 64QFP Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Number of Pins: 64 Pitch - Mating: 0.031" (0.80mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	pacchetto: -	Azione4.374	QFP	64	0.031" (0.80mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
224-5248-19-0602J	3M	RECEPTACLE DIP SOCKET 24POS .3" Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 24 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	pacchetto: -	Azione7.092	DIP, 0.3" (7.62mm) Row Spacing	24	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
216-3340-19-0602J	3M	RECEPTACLE DIP SOCKET 16POS .3" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	pacchetto: -	Azione5.040	-	-	-	-	-	-	-	-	-	-
PA44QL8-1D	Logical Systems Inc.	ADAPTER 44QFP TO 44DIP Convert From (Adapter End): QFP Convert To (Adapter End): DIP Number of Pins: 44 Pitch - Mating: - Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	pacchetto: -	Azione7.542	DIP	44	-	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
220-3342-09-0602J	3M	SOCKET ADAPTER 20DIP TO 20DIP Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 20 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	pacchetto: -	Azione6.048	DIP, 0.3" (7.62mm) Row Spacing	20	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
1110748	Aries Electronics	SOCKET ADAPTER SOT25 TO 6DIP 0.3 Convert From (Adapter End): SOT-25 Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 6 Pitch - Mating: 0.037" (0.95mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: - Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	pacchetto: -	Azione4.680	DIP, 0.3" (7.62mm) Row Spacing	6	0.037" (0.95mm)	-	Through Hole	Solder	-	Tin-Lead	-	FR4 Epoxy Glass
LCQT-SOIC20W	Aries Electronics	SOCKET ADAPTER SOIC-W TO 20DIP Convert From (Adapter End): SOIC-W Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 20 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	pacchetto: -	Azione5.760	DIP, 0.6" (15.24mm) Row Spacing	20	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
14-350000-10	Aries Electronics	SOCKET ADAPTER SOIC TO 14DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 14 Pitch - Mating: - Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	pacchetto: -	Azione13.884	DIP, 0.3" (7.62mm) Row Spacing	14	-	Tin	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	Polyimide (PI)
LCQT-SOIC28	Aries Electronics	SOCKET ADAPTER SOIC TO 28DIP Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	pacchetto: -	Azione21.228	DIP, 0.6" (15.24mm) Row Spacing	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
PA-MSD3SM18-08	Logical Systems Inc.	SOCKET ADAPTER MSOP TO 8DIP Convert From (Adapter End): MSOP Convert To (Adapter End): DIP Number of Pins: 8 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	pacchetto: -	Azione6.288	DIP	8	0.020" (0.50mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
LCQT-SOT23-6	Aries Electronics	SOCKET ADAPTER SOT-23 TO 6DIP Convert From (Adapter End): SOT-23 Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 6 Pitch - Mating: 0.037" (0.95mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	pacchetto: -	Azione16.086	DIP, 0.6" (15.24mm) Row Spacing	6	0.037" (0.95mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass

96-080M80

Aries Electronics

SOCKET ADAPTER QFP TO 80PGA

Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Number of Pins: 80
Pitch - Mating: 0.031" (0.80mm)
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

pacchetto: -

Azione3.490

PGA

80

0.031" (0.80mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

290-1294-09-0602J

3M

RECEPTACLE DIP SOCKET 90POS .9"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

pacchetto: -

Azione3.454

-

97-56001-P

Aries Electronics

SOCKET ADAPTER QFP TO 169PGA

Convert From (Adapter End): QFP
Convert To (Adapter End): PGA
Number of Pins: 169
Pitch - Mating: 0.025" (0.64mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

pacchetto: -

Azione3.744

PGA

169

0.025" (0.64mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

84-505-110

Aries Electronics

SOCKET ADAPTER PLCC TO 84PGA

Convert From (Adapter End): PLCC
Convert To (Adapter End): PGA
Number of Pins: 84
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

pacchetto: -

Azione7.398

PGA

84

0.050" (1.27mm)

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

28-555000-00

Aries Electronics

SOCKET ADAPTER SSOP TO 28SOWIC

Convert From (Adapter End): SSOP
Convert To (Adapter End): SOWIC
Number of Pins: 28
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: -
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

pacchetto: -

Azione6.858

SOWIC

28

0.026" (0.65mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

16-354000-21-RC

Aries Electronics

SOCKET ADAPTER DIP TO 16SOIC

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOIC
Number of Pins: 16
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

pacchetto: -

Azione7.524

SOIC

16

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

24-354W00-20

Aries Electronics

DIP-TO-SOWIC ADAPTER

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): SOWIC
Number of Pins: 24
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

pacchetto: -

Azione8.946

SOWIC

24

0.100" (2.54mm)

Gold

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

Polyamide (PA46), Nylon 4/6, Glass Filled

-

24-35W000-11-RC

Aries Electronics

SOCKET ADAPT SOIC-W TO 24DIP 0.3

Convert From (Adapter End): SOIC-W
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 24
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: FR4 Epoxy Glass

pacchetto: -

Azione3.654

DIP, 0.3" (7.62mm) Row Spacing

24

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

16-307349-11-RC

Aries Electronics

SOCKET ADAPTER PLCC TO 16DIP 0.3

Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 16
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: FR4 Epoxy Glass

pacchetto: -

Azione7.596

DIP, 0.3" (7.62mm) Row Spacing

16

0.050" (1.27mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

1107254-36

Aries Electronics

SOCKET ADAPTER DIP TO 36DIP 0.3

Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 36
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material: -

pacchetto: -

Azione8.442

DIP, 0.3" (7.62mm) Row Spacing

36

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

26-665000-00

Aries Electronics

SCK ADAPT 26P SOIC-W TO SOIC 0.6

Convert From (Adapter End): SOIC-W
Convert To (Adapter End): SOIC
Number of Pins: 26
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

pacchetto: -

Azione4.158

SOIC

26

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

24-665000-00

Aries Electronics

SCK ADAPT 24P SOIC-W TO SOIC 0.6

Convert From (Adapter End): SOIC-W
Convert To (Adapter End): SOIC
Number of Pins: 24
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

pacchetto: -

Azione3.204

SOIC

24

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

7131-108-18

Aries Electronics

SOCKET ADAPT HB2E RELAY TO 8DIP

Convert From (Adapter End): HB2E Relay
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 8
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

pacchetto: -

Azione7.398

DIP, 0.3" (7.62mm) Row Spacing

8

-

Through Hole

Solder

-

Tin-Lead

-

FR4 Epoxy Glass

14-666000-00

Aries Electronics

SOCKET ADAPTER SOIC TO 14SOWIC

Convert From (Adapter End): SOIC
Convert To (Adapter End): SOWIC
Number of Pins: 14
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

pacchetto: -

Azione6.822

SOWIC

14

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

28-505-111P

Aries Electronics

SOCKET ADAPTER PLCC TO 28PGA

Convert From (Adapter End): PLCC
Convert To (Adapter End): PGA
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

pacchetto: -

Azione7.902

PGA

28

0.050" (1.27mm)

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

232-1285-09-0602J

3M

RECEPTACLE DIP SOCKET 32POS .6"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

pacchetto: -

Azione4.014

-

PA-SSD3SM18-24

Logical Systems Inc.

SOCKET ADAPTER SSOP TO 24DIP

Convert From (Adapter End): SSOP
Convert To (Adapter End): DIP
Number of Pins: 24
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Housing Material: -
Board Material: -

pacchetto: -

Azione4.338

DIP

24

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

LCQT-QFP0.8-64

Aries Electronics

SOCKET ADAPTER MULT PKG TO 64QFP

Convert From (Adapter End): Multiple Packages
Convert To (Adapter End): QFP
Number of Pins: 64
Pitch - Mating: 0.031" (0.80mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

pacchetto: -

Azione4.374

QFP

64

0.031" (0.80mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

224-5248-19-0602J

3M

RECEPTACLE DIP SOCKET 24POS .3"

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 24
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polysulfone (PSU), Glass Filled
Board Material: -

pacchetto: -

Azione7.092

DIP, 0.3" (7.62mm) Row Spacing

24

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

216-3340-19-0602J

3M

RECEPTACLE DIP SOCKET 16POS .3"

Convert From (Adapter End): -
Convert To (Adapter End): -
Number of Pins: -
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Housing Material: -
Board Material: -

pacchetto: -

Azione5.040

-

PA44QL8-1D

Logical Systems Inc.

ADAPTER 44QFP TO 44DIP

Convert From (Adapter End): QFP
Convert To (Adapter End): DIP
Number of Pins: 44
Pitch - Mating: -
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Housing Material: -
Board Material: -

pacchetto: -

Azione7.542

DIP

44

-

Through Hole

Solder

0.100" (2.54mm)

-

220-3342-09-0602J

3M

SOCKET ADAPTER 20DIP TO 20DIP

Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 20
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polysulfone (PSU), Glass Filled
Board Material: -

pacchetto: -

Azione6.048

DIP, 0.3" (7.62mm) Row Spacing

20

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

1110748

Aries Electronics

SOCKET ADAPTER SOT25 TO 6DIP 0.3

Convert From (Adapter End): SOT-25
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 6
Pitch - Mating: 0.037" (0.95mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

pacchetto: -

Azione4.680

DIP, 0.3" (7.62mm) Row Spacing

6

0.037" (0.95mm)

-

Through Hole

Solder

-

Tin-Lead

-

FR4 Epoxy Glass

LCQT-SOIC20W

Aries Electronics

SOCKET ADAPTER SOIC-W TO 20DIP

Convert From (Adapter End): SOIC-W
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 20
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

pacchetto: -

Azione5.760

DIP, 0.6" (15.24mm) Row Spacing

20

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

14-350000-10

Aries Electronics

SOCKET ADAPTER SOIC TO 14DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 14
Pitch - Mating: -
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

pacchetto: -

Azione13.884

DIP, 0.3" (7.62mm) Row Spacing

14

-

Tin

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

Polyimide (PI)

LCQT-SOIC28

Aries Electronics

SOCKET ADAPTER SOIC TO 28DIP

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

pacchetto: -

Azione21.228

DIP, 0.6" (15.24mm) Row Spacing

28

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

PA-MSD3SM18-08

Logical Systems Inc.

SOCKET ADAPTER MSOP TO 8DIP

Convert From (Adapter End): MSOP
Convert To (Adapter End): DIP
Number of Pins: 8
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Housing Material: -
Board Material: -

pacchetto: -

Azione6.288

DIP

8

0.020" (0.50mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

LCQT-SOT23-6

Aries Electronics

SOCKET ADAPTER SOT-23 TO 6DIP

Convert From (Adapter End): SOT-23
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 6
Pitch - Mating: 0.037" (0.95mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: Polyester
Board Material: FR4 Epoxy Glass

pacchetto: -

Azione16.086

DIP, 0.6" (15.24mm) Row Spacing

6

0.037" (0.95mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass