Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLOCK BUFFER 1:1 170MHZ DIE
|
pacchetto: Die |
Azione4.272 |
|
1 | 1:1 | No/Yes | Crystal | LVPECL | 170MHz | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | Die | Die |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:10 650MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione2.576 |
|
1 | 1:10 | No/No | AVCMOS | AVCMOS | 650MHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.520 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:3 2GHZ 16VFQFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione2.144 |
|
1 | 1:3 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 4:1/2:1 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione3.568 |
|
1 | 4:1, 2:1 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 2:1/1:2 16VFQFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione9.552 |
|
2 | 2:1, 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 3.2GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 700MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.352 |
|
1 | 1:2 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVHSTL | 700MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:9 135MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione2.100 |
|
1 | 1:9 | Yes/Yes | PECL | TTL | 135MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:4 160MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione17.712 |
|
1 | 1:4 | Yes/Yes | PECL | TTL | 160MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:8 160MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione2.560 |
|
1 | 2:8 | Yes/Yes | PECL, TTL | TTL | 160MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 2:4 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione6.816 |
|
1 | 2:4 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:2 5GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione2.848 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:8 2GHZ 28VQFN
|
pacchetto: 28-WFQFN Exposed Pad |
Azione4.384 |
|
1 | 2:8 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 28-WFQFN Exposed Pad | 28-VFQFPN (5x5) |
||
Microsemi Corporation |
IC CLK BUFFER 1:8 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.112 |
|
1 | 1:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Diodes Incorporated |
CLOCK SAW OSCILLATOR SEAM3225
|
pacchetto: - |
Azione7.856 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
IC CLK BUFFER 1:4 750MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.360 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 350MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione3.840 |
|
1 | 2:4 | Yes/No | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL | LVCMOS, LVTTL | 350MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Silicon Labs |
IC CLK BUFFER 1:4 220MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.080 |
|
1 | 1:4 | No/No | Clock | LVCMOS | 220MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Silicon Labs |
IC BUFFER 1:8 CMOS 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione7.296 |
|
1 | 2:8 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Silicon Labs |
2:12 CMOS BUFFER (200MHZ), 2:1 L
|
pacchetto: 24-VFQFN Exposed Pad |
Azione2.160 |
|
1 | 2:6 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
ON Semiconductor |
IC CLK BUFFER 1:4 8GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione6.828 |
|
1 | 1:4 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL, LVTTL | CML | 8GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:5 700MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.720 |
|
1 | 2:5 | Yes/Yes | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL | LVPECL | 700MHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 160MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.712 |
|
1 | 1:4 | No/No | CMOS | CMOS | 160MHz | 3 V ~ 5.5 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Texas Instruments |
IC CLK BUFFER 1:2 3.8GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.392 |
|
1 | 1:2 | Yes/Yes | ECL, PECL | ECL, PECL | 3.8GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:10 2.5GHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione10.080 |
|
1 | 2:10 | Yes/Yes | LVDS, LVPECL, SSTL | ECL, PECL | 2.5GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:6 1.2GHZ 20VQFN
|
pacchetto: 20-VFQFN Exposed Pad |
Azione6.784 |
|
1 | 1:6 | Yes/Yes | CML, LVDS | LVDS | 1.2GHz | 1.71 V ~ 1.89 V | -40°C ~ 85°C | Surface Mount | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) |
||
Linear Technology |
IC POWER MANAGEMENT
|
pacchetto: 36-WFQFN Exposed Pad |
Azione4.320 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS, LVPECL | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:4 200MHZ 16TSSOP
|
pacchetto: - |
Request a Quote |
|
1 | 1:4 | No/No | Crystal | LVCMOS | 200 MHz | 1.71V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |