Embedded - Microcontroller, microprocessori, moduli FPGA | Circuiti integrati (CI)

Numero di parte	Produttore	Descrizione	pacchetto	Azione	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-9P-V524-CC-1	Digi International	CONNECTCORE 9P Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9215 Co-Processor: - Speed: 150MHz Flash Size: 16MB RAM Size: 32MB Connector Type: - Size / Dimension: - Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione6.064	ARM926EJ-S, NS9215	-	150MHz	16MB	32MB	-	-	-40°C ~ 85°C
CC-W9M-NA37-XE-B	Digi International	MOD WI-9M 64MB SDRAM 128MB FLASH Module/Board Type: MPU Core Core Processor: ARM920T, SC2443 Co-Processor: - Speed: 533MHz Flash Size: 128MB RAM Size: 64MB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 3.62" x 1.73" (92mm x 44 mm) Operating Temperature: -40°C ~ 65°C	pacchetto: -	Azione3.120	ARM920T, SC2443	-	533MHz	128MB	64MB	Board-to-Board (BTB) Socket - 240	3.62" x 1.73" (92mm x 44 mm)	-40°C ~ 65°C
M5475BFE	NXP	MODULE FIRE ENGINE Module/Board Type: MPU Core Core Processor: ColdFire V4e, MCF5475 Co-Processor: - Speed: 266MHz Flash Size: 16MB RAM Size: 64MB Connector Type: - Size / Dimension: 3.7" x 4.5" (93.4mm x 114.3mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione2.848	ColdFire V4e, MCF5475	-	266MHz	16MB	64MB	-	3.7" x 4.5" (93.4mm x 114.3mm)	0°C ~ 70°C
CENGLH7A404-11-503HCR-A	Logic	CARD ENGINE 64MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A404 Co-Processor: - Speed: 200MHz Flash Size: 16MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione6.064	ARM922T, LH7A404	-	200MHz	16MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
5CSX-H5-4YA-RI	Critical Link LLC	MITYSOM-5CSX W/ ALTERA CYCLONE V Module/Board Type: MPU, FPGA Core Core Processor: ARM? Cortex?-A9, Cyclone V SX/SE Co-Processor: NEON SIMD Speed: 800MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Edge Connector Size / Dimension: 3.2" x 1.5" (82mm x 39mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione2.432	ARM? Cortex?-A9, Cyclone V SX/SE	NEON SIMD	800MHz	32MB	1GB	Edge Connector	3.2" x 1.5" (82mm x 39mm)	-40°C ~ 85°C
DC-SP-01-JT	Digi International	MODULE SP ADPT CUSTOMIZABLE JTAG Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 16MB Connector Type: RJ45 Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione4.592	ARM7TDMI, NS7520	-	55MHz	4MB	16MB	RJ45	3.88" x 1.68" (98.5mm x 42.7mm)	-40°C ~ 85°C
TE0600-03B	Trenz Electronic GmbH	SOM GIGABEE 2X128MB REV. 3 Module/Board Type: FPGA Core Processor: Spartan-6 LX-100 Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 256MB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione5.440	Spartan-6 LX-100	-	125MHz	16MB	256MB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
MOD5234-200IR	NetBurner Inc.	MOD5234 10/100 ETHERNET MODULE Module/Board Type: MCU, Ethernet Core Core Processor: ColdFire 5234 Co-Processor: - Speed: 147.5MHz Flash Size: 2MB RAM Size: 8MB Connector Type: 10-Pin Header, 2x50 Header Size / Dimension: 2.95" x 2" (74.9mm x 50.8mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione6.288	ColdFire 5234	-	147.5MHz	2MB	8MB	10-Pin Header, 2x50 Header	2.95" x 2" (74.9mm x 50.8mm)	-40°C ~ 85°C
EDM1-IMX6U-MSD-BW	Wandboard.Org	EDM1-IMX6U-MSD-BW SOM 10PK Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione5.776	-	-	-	-	-	-	-	-
3354-IX-X3A-RI	Critical Link LLC	MITYSOM-3354 W/ AM3354 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3354 Co-Processor: NEON SIMD Speed: 1GHz Flash Size: 512MB RAM Size: 1GB Connector Type: SO-DIMM-204 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione5.104	ARM? Cortex?-A8, AM3354	NEON SIMD	1GHz	512MB	1GB	SO-DIMM-204	2.66" x 1.5" (67.6mm x 38.1mm)	-40°C ~ 85°C
TE0711-01-100-2C	Trenz Electronic GmbH	SOM ARTIX-7 HIGH IO 100T USB 2C Module/Board Type: FPGA Core Processor: Artix-7 A100T Co-Processor: - Speed: 100MHz Flash Size: 32MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione3.568	Artix-7 A100T	-	100MHz	32MB	-	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
20-101-0562	Digi International	MODULE RABBITCORE RCM3410 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 29.4MHz Flash Size: 256KB RAM Size: 256KB Connector Type: 2 IDC Headers 2x17 Size / Dimension: 1.16" x 1.38" (29.5mm x 34.9mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione5.312	Rabbit 3000	-	29.4MHz	256KB	256KB	2 IDC Headers 2x17	1.16" x 1.38" (29.5mm x 34.9mm)	-40°C ~ 85°C
TE0745-02-30-2IA	Trenz Electronic GmbH	SOM DDR3 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione7.456	-	-	-	-	-	-	-	-
TE0808-04-09EG-2IE	Trenz Electronic GmbH	ULTRASOM+ MPSOC-MODUL MIT ZYNQ U Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU9EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione4.928	Zynq UltraScale+ XCZU9EG-1FFVC900E	-	-	128MB	4GB	B2B	2.05" x 2.99" (52mm x 76mm)	-40°C ~ 85°C
SOMOMAPL138-10-1503QHCR	Logic	OMAPL138 SOM-M1 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione4.992	-	-	-	-	-	-	-	-
TE0803-03-2AE11-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Azione7.968	Zynq UltraScale+ XCZU2CG-1SFVC784E	-	-	128MB	2GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
TE0600-04-52I11-M	Trenz Electronic GmbH	IC MODULE GIGABEE Module/Board Type: FPGA Core Processor: Xilinx Spartan™ 6 XC6SLX45-2FGG484I Co-Processor: - Speed: 100MHz Flash Size: 16MB RAM Size: 128MB Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	Xilinx Spartan™ 6 XC6SLX45-2FGG484I	-	100MHz	16MB	128MB	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0782-02-045-2IC	Trenz Electronic GmbH	IC MODULE CORTEX Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7045)	-	32MB	1GB	Board-to-Board (BTB) Socket - 480	3.350" L x 3.350" W (85.00mm x 85.00mm)	-40°C ~ 85°C
TE0720-03-61Q42NA	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 32GB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -	pacchetto: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	32GB	-	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-
ME-XU9-7EV-2I-D12E-L11-R2-1	Enclustra FPGA Solutions	SOM ZYNQ US+ ZU7EV 4GB+2GB PL Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	533MHz, 1.333GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TE0720-03-62I33GA	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0821-01-3BI21MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU3EG-1SFVC784I Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: 2 x 160 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	Zynq™ UltraScale+™ XCZU3EG-1SFVC784I	ARM® Cortex®-A53, ARM® Cortex®-R5	-	128MB	2GB	2 x 160 Pin	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0808-05-6BE21-A	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ ZU6EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: 4 x 160 Pin Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Request a Quote	Zynq™ UltraScale+™ ZU6EG-1FFVC900E	-	-	128MB	4GB	4 x 160 Pin	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
DG8065101533700	Intel	INTEL ATOM PROCESSOR Z2520 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Request a Quote	-	-	-	-	-	-	-	-
TE0630-02-52C12-A	Trenz Electronic GmbH	FPGA MODULE SPARTAN-6 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Request a Quote	-	-	-	-	-	-	-	-
ME-XU1-6CG-1E-D11E-R5-0	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU6CG Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU6CG-1FFVC900E Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 2GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU6CG-1FFVC900E	600MHz, 1.5GHz	16GB	2GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	0°C ~ 85°C
MYC-Y7Z020-V2-4E512D-766-I	MYIR Tech Limited	System-On-Module, Zynq-7020 Module/Board Type: MPU, FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: 667MHz Flash Size: 4GB RAM Size: 512MB Connector Type: Pin(s) Size / Dimension: 2.950" L x 1.970" W (75.00mm x 50.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM® Cortex®-A9	Zynq-7000 (Z-7020)	667MHz	4GB	512MB	Pin(s)	2.950" L x 1.970" W (75.00mm x 50.00mm)	-40°C ~ 85°C
TE0745-03-71I31-A	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 2.047" L x 2.992" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM® Cortex®-A9	Zynq-7000 (Z-7030)	-	64MB	1GB	Board-to-Board (BTB) Socket	2.047" L x 2.992" W (52.00mm x 76.00mm)	-40°C ~ 85°C

CC-9P-V524-CC-1

Digi International

CONNECTCORE 9P

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9215
Co-Processor: -
Speed: 150MHz
Flash Size: 16MB
RAM Size: 32MB
Connector Type: -
Size / Dimension: -
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione6.064

ARM926EJ-S, NS9215

-

150MHz

16MB

32MB

-

-40°C ~ 85°C

CC-W9M-NA37-XE-B

Digi International

MOD WI-9M 64MB SDRAM 128MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM920T, SC2443
Co-Processor: -
Speed: 533MHz
Flash Size: 128MB
RAM Size: 64MB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 3.62" x 1.73" (92mm x 44 mm)
Operating Temperature: -40°C ~ 65°C

pacchetto: -

Azione3.120

ARM920T, SC2443

-

533MHz

128MB

64MB

Board-to-Board (BTB) Socket - 240

3.62" x 1.73" (92mm x 44 mm)

-40°C ~ 65°C

M5475BFE

NXP

MODULE FIRE ENGINE

Module/Board Type: MPU Core
Core Processor: ColdFire V4e, MCF5475
Co-Processor: -
Speed: 266MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: -
Size / Dimension: 3.7" x 4.5" (93.4mm x 114.3mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione2.848

ColdFire V4e, MCF5475

-

266MHz

16MB

64MB

-

3.7" x 4.5" (93.4mm x 114.3mm)

0°C ~ 70°C

CENGLH7A404-11-503HCR-A

Logic

CARD ENGINE 64MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A404
Co-Processor: -
Speed: 200MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione6.064

ARM922T, LH7A404

-

200MHz

16MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

5CSX-H5-4YA-RI

Critical Link LLC

MITYSOM-5CSX W/ ALTERA CYCLONE V

Module/Board Type: MPU, FPGA Core
Core Processor: ARM? Cortex?-A9, Cyclone V SX/SE
Co-Processor: NEON SIMD
Speed: 800MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Edge Connector
Size / Dimension: 3.2" x 1.5" (82mm x 39mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione2.432

ARM? Cortex?-A9, Cyclone V SX/SE

NEON SIMD

800MHz

32MB

1GB

Edge Connector

3.2" x 1.5" (82mm x 39mm)

-40°C ~ 85°C

DC-SP-01-JT

Digi International

MODULE SP ADPT CUSTOMIZABLE JTAG

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 16MB
Connector Type: RJ45
Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione4.592

ARM7TDMI, NS7520

-

55MHz

4MB

16MB

RJ45

3.88" x 1.68" (98.5mm x 42.7mm)

-40°C ~ 85°C

TE0600-03B

Trenz Electronic GmbH

SOM GIGABEE 2X128MB REV. 3

Module/Board Type: FPGA
Core Processor: Spartan-6 LX-100
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 256MB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione5.440

Spartan-6 LX-100

-

125MHz

16MB

256MB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

MOD5234-200IR

NetBurner Inc.

MOD5234 10/100 ETHERNET MODULE

Module/Board Type: MCU, Ethernet Core
Core Processor: ColdFire 5234
Co-Processor: -
Speed: 147.5MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: 10-Pin Header, 2x50 Header
Size / Dimension: 2.95" x 2" (74.9mm x 50.8mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione6.288

ColdFire 5234

-

147.5MHz

2MB

8MB

10-Pin Header, 2x50 Header

2.95" x 2" (74.9mm x 50.8mm)

-40°C ~ 85°C

EDM1-IMX6U-MSD-BW

Wandboard.Org

EDM1-IMX6U-MSD-BW SOM 10PK

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione5.776

-

3354-IX-X3A-RI

Critical Link LLC

MITYSOM-3354 W/ AM3354

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3354
Co-Processor: NEON SIMD
Speed: 1GHz
Flash Size: 512MB
RAM Size: 1GB
Connector Type: SO-DIMM-204
Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione5.104

ARM? Cortex?-A8, AM3354

NEON SIMD

1GHz

512MB

1GB

SO-DIMM-204

2.66" x 1.5" (67.6mm x 38.1mm)

-40°C ~ 85°C

TE0711-01-100-2C

Trenz Electronic GmbH

SOM ARTIX-7 HIGH IO 100T USB 2C

Module/Board Type: FPGA
Core Processor: Artix-7 A100T
Co-Processor: -
Speed: 100MHz
Flash Size: 32MB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione3.568

Artix-7 A100T

-

100MHz

32MB

-

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

20-101-0562

Digi International

MODULE RABBITCORE RCM3410

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 29.4MHz
Flash Size: 256KB
RAM Size: 256KB
Connector Type: 2 IDC Headers 2x17
Size / Dimension: 1.16" x 1.38" (29.5mm x 34.9mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione5.312

Rabbit 3000

-

29.4MHz

256KB

2 IDC Headers 2x17

1.16" x 1.38" (29.5mm x 34.9mm)

-40°C ~ 85°C

TE0745-02-30-2IA

Trenz Electronic GmbH

SOM DDR3

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione7.456

-

TE0808-04-09EG-2IE

Trenz Electronic GmbH

ULTRASOM+ MPSOC-MODUL MIT ZYNQ U

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU9EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione4.928

Zynq UltraScale+ XCZU9EG-1FFVC900E

-

128MB

4GB

B2B

2.05" x 2.99" (52mm x 76mm)

-40°C ~ 85°C

SOMOMAPL138-10-1503QHCR

Logic

OMAPL138 SOM-M1

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione4.992

-

TE0803-03-2AE11-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

Azione7.968

Zynq UltraScale+ XCZU2CG-1SFVC784E

-

128MB

2GB

B2B

2.05" x 2.99" (52mm x 76mm)

0°C ~ 85°C

TE0600-04-52I11-M

Trenz Electronic GmbH

IC MODULE GIGABEE

Module/Board Type: FPGA
Core Processor: Xilinx Spartan™ 6 XC6SLX45-2FGG484I
Co-Processor: -
Speed: 100MHz
Flash Size: 16MB
RAM Size: 128MB
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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Xilinx Spartan™ 6 XC6SLX45-2FGG484I

-

100MHz

16MB

128MB

B2B

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0782-02-045-2IC

Trenz Electronic GmbH

IC MODULE CORTEX

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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ARM Cortex-A9

Zynq-7000 (Z-7045)

-

32MB

1GB

Board-to-Board (BTB) Socket - 480

3.350" L x 3.350" W (85.00mm x 85.00mm)

-40°C ~ 85°C

TE0720-03-61Q42NA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 32GB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -

pacchetto: -

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ARM Cortex-A9

Zynq-7000 (Z-7020)

-

32GB

-

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-

ME-XU9-7EV-2I-D12E-L11-R2-1

Enclustra FPGA Solutions

SOM ZYNQ US+ ZU7EV 4GB+2GB PL

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 533MHz, 1.333GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

533MHz, 1.333GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

TE0720-03-62I33GA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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ARM Cortex-A9

Zynq-7000 (Z-7020)

125MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0821-01-3BI21MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU3EG-1SFVC784I
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: 2 x 160 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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Zynq™ UltraScale+™ XCZU3EG-1SFVC784I

ARM® Cortex®-A53, ARM® Cortex®-R5

-

128MB

2GB

2 x 160 Pin

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0808-05-6BE21-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ ZU6EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: 4 x 160 Pin
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

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Zynq™ UltraScale+™ ZU6EG-1FFVC900E

-

128MB

4GB

4 x 160 Pin

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

DG8065101533700

Intel

INTEL ATOM PROCESSOR Z2520

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

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-

TE0630-02-52C12-A

Trenz Electronic GmbH

FPGA MODULE SPARTAN-6

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

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-

ME-XU1-6CG-1E-D11E-R5-0

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU6CG

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU6CG-1FFVC900E
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 2GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU6CG-1FFVC900E

600MHz, 1.5GHz

16GB

2GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

0°C ~ 85°C

MYC-Y7Z020-V2-4E512D-766-I

MYIR Tech Limited

System-On-Module, Zynq-7020

Module/Board Type: MPU, FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: 667MHz
Flash Size: 4GB
RAM Size: 512MB
Connector Type: Pin(s)
Size / Dimension: 2.950" L x 1.970" W (75.00mm x 50.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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ARM® Cortex®-A9

Zynq-7000 (Z-7020)

667MHz

4GB

512MB

Pin(s)

2.950" L x 1.970" W (75.00mm x 50.00mm)

-40°C ~ 85°C

TE0745-03-71I31-A

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

Module/Board Type: FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.047" L x 2.992" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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ARM® Cortex®-A9

Zynq-7000 (Z-7030)

-

64MB

1GB

Board-to-Board (BTB) Socket

2.047" L x 2.992" W (52.00mm x 76.00mm)

-40°C ~ 85°C