Pagina 8 - Embedded - Microcontroller, microprocessori, moduli FPGA | Circuiti integrati (CI)

Numero di parte	Produttore	Descrizione	pacchetto	Azione	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
TE0741-02-070-2IF	Trenz Electronic GmbH	SOM KINTEX-7 70T 32MB FLASH AES Module/Board Type: FPGA Core Processor: Kintex-7 70T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione7.424	Kintex-7 70T	-	200MHz	32MB	-	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
CC-9M-NA37-Z1	Digi International	MOD 9M 64MB SDRAM 128MB FLASH Module/Board Type: MPU Core Core Processor: ARM920T, SC2443 Co-Processor: - Speed: 533MHz Flash Size: 128MB RAM Size: 64MB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.36" x 1.73" (60mm x 44mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione6.000	ARM920T, SC2443	-	533MHz	128MB	64MB	Board-to-Board (BTB) Socket - 240	2.36" x 1.73" (60mm x 44mm)	-40°C ~ 85°C
M5475DFE	NXP	MODULE FIRE ENGINE Module/Board Type: MPU Core Core Processor: ColdFire V4e, MCF5475 Co-Processor: - Speed: 266MHz Flash Size: 2MB (Boot) RAM Size: 64MB Connector Type: - Size / Dimension: 3.7" x 4.5" (93.4mm x 114.3mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione7.984	ColdFire V4e, MCF5475	-	266MHz	2MB (Boot)	64MB	-	3.7" x 4.5" (93.4mm x 114.3mm)	0°C ~ 70°C
DC-ME-Y413-LX-B	Digi International	ME 9210 16MB SDRAM 8MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 8MB RAM Size: 16MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 80°C	pacchetto: -	Azione5.408	ARM926EJ-S, NS9210	-	75MHz	8MB	16MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 80°C
TE0712-02-35-2I	Trenz Electronic GmbH	SOM ARTIX-7 XC7A35T-2I 1GB DDR3 Module/Board Type: FPGA Core Processor: Artix-7 A35T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione5.536	Artix-7 A35T	-	200MHz	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
SOMDIMM-RX63N	Future Designs Inc.	DIMM 16MB 10/100 RX63N REV2 Module/Board Type: MCU Core Core Processor: RX600, RX63N Co-Processor: - Speed: 100MHz Flash Size: 2MB RAM Size: 128KB Connector Type: SO-DIMM-200 Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione3.856	RX600, RX63N	-	100MHz	2MB	128KB	SO-DIMM-200	-	-
DC-ME4-01T-C-50	Digi International	ME 8MB SDRAM 4MB FLASH 50 PAK Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione4.480	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
20-101-1093	Digi International	RCM4110 RABBITCORE Module/Board Type: MPU Core Core Processor: Rabbit 4000 Co-Processor: - Speed: 29.49MHz Flash Size: 512KB RAM Size: 256KB Connector Type: IDC Header 2x25, 2x5 Size / Dimension: 1.41" x 1.88" (36mm x 48mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione12.564	Rabbit 4000	-	29.49MHz	512KB	256KB	IDC Header 2x25, 2x5	1.41" x 1.88" (36mm x 48mm)	0°C ~ 70°C
TE0820-02-02EG-1EA	Trenz Electronic GmbH	SOM USCALE+ XCZU2EG-1S 1GB DDR4 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione5.712	-	-	-	-	-	-	-	-
DC-ME-01T-TYS	Digi International	MODULE DIGI CONNECT ME Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione4.688	-	-	-	-	-	-	-	-
TE0803-02-04CG-1EB	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 256MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 256MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Azione6.512	Zynq UltraScale+ XCZU4CG-1SFVC784E	-	-	256MB	2GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
TE0823-01-3PIU1F	Trenz Electronic GmbH	ICOBOARD Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I Speed: - Flash Size: 128MB RAM Size: 1GB Connector Type: USB Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM Cortex-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I	-	128MB	1GB	USB	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
MYC-C7Z020-V2-4E1D-766-C	MYIR Tech Limited	System-On-Module, Zynq-7020 Module/Board Type: MPU, FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: 866MHz Flash Size: 4GB eMMC, 32MB QSPI RAM Size: 1GB Connector Type: Pin(s) Size / Dimension: 2.953" L x 2.165" W (75.00mm x 55.00mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Request a Quote	ARM® Cortex®-A9	Zynq-7000 (Z-7020)	866MHz	4GB eMMC, 32MB QSPI	1GB	Pin(s)	2.953" L x 2.165" W (75.00mm x 55.00mm)	0°C ~ 70°C
TE0782-02-A2I33FA	Trenz Electronic GmbH	IC MODULE CORTEX Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7100) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7100)	-	32MB	1GB	Board-to-Board (BTB) Socket - 480	3.350" L x 3.350" W (85.00mm x 85.00mm)	-40°C ~ 85°C
TE0808-05-9GI21-A	Trenz Electronic GmbH	USOM+ MPSOC ZYNQ USCALE FPGA Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU9EG-2FFVC900I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	Zynq UltraScale+ XCZU9EG-2FFVC900I	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0820-03-2BE21FA	Trenz Electronic GmbH	MOD MPSOC Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Request a Quote	-	-	-	-	-	-	-	-
DC-ME4-01T-CLI-1	Digi	MODULE ME Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Request a Quote	-	-	-	-	-	-	-	-
TE0720-04-61C33MA	Trenz Electronic GmbH	SOC MODULE WITH XILINX ZYNQ 7020 Module/Board Type: MPU Core Core Processor: Zynq™ XC7Z020-1CLG484C Co-Processor: ARM Cortex-A9 Speed: - Flash Size: 32MB RAM Size: 8GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Request a Quote	Zynq™ XC7Z020-1CLG484C	ARM Cortex-A9	-	32MB	8GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
TE0741-04-G2I-1-A	Trenz Electronic GmbH	MODULE FPGA KINTEX Module/Board Type: FPGA Core Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676I Co-Processor: - Speed: - Flash Size: 32MB RAM Size: - Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	Xilinx Kintex-7 FPGA XC7K410T-2FBG676I	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0745-02-91C31-A	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7045)	-	64MB	1GB	Board-to-Board (BTB) Socket - 480	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0745-03-72I31-A	Trenz Electronic GmbH	SOM WITH AMD ZYNQ 7030-2I, 1 GBY Module/Board Type: MPU Core Core Processor: ARM Cortex-A9 Co-Processor: Xilinx Zynq 7030 SoC XC7Z030-2FBG676I Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Samtec ST5 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Request a Quote	ARM Cortex-A9	Xilinx Zynq 7030 SoC XC7Z030-2FBG676I	-	64MB	1GB	Samtec ST5	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C
G650-05369-01	OKdo	CORAL 2GB SOM Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Azione15	-	-	-	-	-	-	-	-
5728-PJ-4AA-RI	Critical Link LLC	TEXAS INSTRUMENTS AM5728 SOM WIT Module/Board Type: MPU, FPGA Core Core Processor: ARM Cortex-A15 Co-Processor: Artix-7 Speed: 1.5GHz Flash Size: 32MB RAM Size: 1GB Connector Type: Edge Connector - 310, Board-to-Board (BTB) - 100 Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Azione9	ARM Cortex-A15	Artix-7	1.5GHz	32MB	1GB	Edge Connector - 310, Board-to-Board (BTB) - 100	3.460" L x 2.730" W (87.88mm x 69.34mm)	0°C ~ 70°C
TE0713-03-82C46-A	Trenz Electronic GmbH	IC SOM ARTIX-7 FPGA DDR3 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Request a Quote	-	-	-	-	-	-	-	-
TE0712-02-72C36-A	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: Artix-7 A100T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	pacchetto: -	Request a Quote	Artix-7 A100T	-	200MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
ME-ZX1-35-1I-D10-R3	Enclustra FPGA Solutions	SOM ZYNQ 7Z035 1GB+0.25GB PL Module/Board Type: FPGA Core Core Processor: ARM® Dual-Core Cortex-A9 Co-Processor: Kintex-7 Speed: 800MHz Flash Size: 512MB RAM Size: 256MB, 1GB Connector Type: 168 Pin Size / Dimension: 2.520" L x 2.130" W (64.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	pacchetto: -	Azione60	ARM® Dual-Core Cortex-A9	Kintex-7	800MHz	512MB	256MB, 1GB	168 Pin	2.520" L x 2.130" W (64.00mm x 54.00mm)	-40°C ~ 85°C
TE0726-04-41I94-A	Trenz Electronic GmbH	IC MODULE ZYNQBERRY Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	pacchetto: -	Request a Quote	-	-	-	-	-	-	-	-
SPIDERSOM-S	ARIES Embedded	SoM MAX10 FPGA Module/Board Type: FPGA Core Core Processor: Max10 Co-Processor: - Speed: - Flash Size: 4MB RAM Size: 8MB Connector Type: Pin(s) Size / Dimension: 2.760" L x 1.380" W (70.00mm x 35.00mm) Operating Temperature: 0°C ~ 70°C	pacchetto: -	Request a Quote	Max10	-	-	4MB	8MB	Pin(s)	2.760" L x 1.380" W (70.00mm x 35.00mm)	0°C ~ 70°C

TE0741-02-070-2IF

Trenz Electronic GmbH

SOM KINTEX-7 70T 32MB FLASH AES

Module/Board Type: FPGA
Core Processor: Kintex-7 70T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione7.424

Kintex-7 70T

-

200MHz

32MB

-

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

CC-9M-NA37-Z1

Digi International

MOD 9M 64MB SDRAM 128MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM920T, SC2443
Co-Processor: -
Speed: 533MHz
Flash Size: 128MB
RAM Size: 64MB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.36" x 1.73" (60mm x 44mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione6.000

ARM920T, SC2443

-

533MHz

128MB

64MB

Board-to-Board (BTB) Socket - 240

2.36" x 1.73" (60mm x 44mm)

-40°C ~ 85°C

M5475DFE

NXP

MODULE FIRE ENGINE

Module/Board Type: MPU Core
Core Processor: ColdFire V4e, MCF5475
Co-Processor: -
Speed: 266MHz
Flash Size: 2MB (Boot)
RAM Size: 64MB
Connector Type: -
Size / Dimension: 3.7" x 4.5" (93.4mm x 114.3mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione7.984

ColdFire V4e, MCF5475

-

266MHz

2MB (Boot)

64MB

-

3.7" x 4.5" (93.4mm x 114.3mm)

0°C ~ 70°C

DC-ME-Y413-LX-B

Digi International

ME 9210 16MB SDRAM 8MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9210
Co-Processor: -
Speed: 75MHz
Flash Size: 8MB
RAM Size: 16MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 80°C

pacchetto: -

Azione5.408

ARM926EJ-S, NS9210

-

75MHz

8MB

16MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 80°C

TE0712-02-35-2I

Trenz Electronic GmbH

SOM ARTIX-7 XC7A35T-2I 1GB DDR3

Module/Board Type: FPGA
Core Processor: Artix-7 A35T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione5.536

Artix-7 A35T

-

200MHz

32MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

SOMDIMM-RX63N

Future Designs Inc.

DIMM 16MB 10/100 RX63N REV2

Module/Board Type: MCU Core
Core Processor: RX600, RX63N
Co-Processor: -
Speed: 100MHz
Flash Size: 2MB
RAM Size: 128KB
Connector Type: SO-DIMM-200
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione3.856

RX600, RX63N

-

100MHz

2MB

128KB

SO-DIMM-200

-

DC-ME4-01T-C-50

Digi International

ME 8MB SDRAM 4MB FLASH 50 PAK

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione4.480

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

20-101-1093

Digi International

RCM4110 RABBITCORE

Module/Board Type: MPU Core
Core Processor: Rabbit 4000
Co-Processor: -
Speed: 29.49MHz
Flash Size: 512KB
RAM Size: 256KB
Connector Type: IDC Header 2x25, 2x5
Size / Dimension: 1.41" x 1.88" (36mm x 48mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione12.564

Rabbit 4000

-

29.49MHz

512KB

256KB

IDC Header 2x25, 2x5

1.41" x 1.88" (36mm x 48mm)

0°C ~ 70°C

TE0820-02-02EG-1EA

Trenz Electronic GmbH

SOM USCALE+ XCZU2EG-1S 1GB DDR4

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione5.712

-

DC-ME-01T-TYS

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione4.688

-

TE0803-02-04CG-1EB

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 256MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 256MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

Azione6.512

Zynq UltraScale+ XCZU4CG-1SFVC784E

-

256MB

2GB

B2B

2.05" x 2.99" (52mm x 76mm)

0°C ~ 85°C

TE0823-01-3PIU1F

Trenz Electronic GmbH

ICOBOARD

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
Speed: -
Flash Size: 128MB
RAM Size: 1GB
Connector Type: USB
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Request a Quote

ARM Cortex-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I

-

128MB

1GB

USB

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

MYC-C7Z020-V2-4E1D-766-C

MYIR Tech Limited

System-On-Module, Zynq-7020

Module/Board Type: MPU, FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: 866MHz
Flash Size: 4GB eMMC, 32MB QSPI
RAM Size: 1GB
Connector Type: Pin(s)
Size / Dimension: 2.953" L x 2.165" W (75.00mm x 55.00mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Request a Quote

ARM® Cortex®-A9

Zynq-7000 (Z-7020)

866MHz

4GB eMMC, 32MB QSPI

1GB

Pin(s)

2.953" L x 2.165" W (75.00mm x 55.00mm)

0°C ~ 70°C

TE0782-02-A2I33FA

Trenz Electronic GmbH

IC MODULE CORTEX

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7100)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Request a Quote

ARM Cortex-A9

Zynq-7000 (Z-7100)

-

32MB

1GB

Board-to-Board (BTB) Socket - 480

3.350" L x 3.350" W (85.00mm x 85.00mm)

-40°C ~ 85°C

TE0808-05-9GI21-A

Trenz Electronic GmbH

USOM+ MPSOC ZYNQ USCALE FPGA

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU9EG-2FFVC900I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Request a Quote

Zynq UltraScale+ XCZU9EG-2FFVC900I

-

128MB

4GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

TE0820-03-2BE21FA

Trenz Electronic GmbH

MOD MPSOC

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Request a Quote

-

DC-ME4-01T-CLI-1

Digi

MODULE ME

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Request a Quote

-

TE0720-04-61C33MA

Trenz Electronic GmbH

SOC MODULE WITH XILINX ZYNQ 7020

Module/Board Type: MPU Core
Core Processor: Zynq™ XC7Z020-1CLG484C
Co-Processor: ARM Cortex-A9
Speed: -
Flash Size: 32MB
RAM Size: 8GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

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Zynq™ XC7Z020-1CLG484C

ARM Cortex-A9

-

32MB

8GB

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

TE0741-04-G2I-1-A

Trenz Electronic GmbH

MODULE FPGA KINTEX

Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676I
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: -
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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Xilinx Kintex-7 FPGA XC7K410T-2FBG676I

-

32MB

-

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0745-02-91C31-A

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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ARM Cortex-A9

Zynq-7000 (Z-7045)

-

64MB

1GB

Board-to-Board (BTB) Socket - 480

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

TE0745-03-72I31-A

Trenz Electronic GmbH

SOM WITH AMD ZYNQ 7030-2I, 1 GBY

Module/Board Type: MPU Core
Core Processor: ARM Cortex-A9
Co-Processor: Xilinx Zynq 7030 SoC XC7Z030-2FBG676I
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Samtec ST5
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

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ARM Cortex-A9

Xilinx Zynq 7030 SoC XC7Z030-2FBG676I

-

64MB

1GB

Samtec ST5

2.990" L x 2.050" W (76.00mm x 52.00mm)

-40°C ~ 85°C

G650-05369-01

OKdo

CORAL 2GB SOM

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

Azione15

-

5728-PJ-4AA-RI

Critical Link LLC

TEXAS INSTRUMENTS AM5728 SOM WIT

Module/Board Type: MPU, FPGA Core
Core Processor: ARM Cortex-A15
Co-Processor: Artix-7
Speed: 1.5GHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Edge Connector - 310, Board-to-Board (BTB) - 100
Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

Azione9

ARM Cortex-A15

Artix-7

1.5GHz

32MB

1GB

Edge Connector - 310, Board-to-Board (BTB) - 100

3.460" L x 2.730" W (87.88mm x 69.34mm)

0°C ~ 70°C

TE0713-03-82C46-A

Trenz Electronic GmbH

IC SOM ARTIX-7 FPGA DDR3

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

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-

TE0712-02-72C36-A

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: FPGA Core
Core Processor: Artix-7 A100T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

pacchetto: -

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Artix-7 A100T

-

200MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

ME-ZX1-35-1I-D10-R3

Enclustra FPGA Solutions

SOM ZYNQ 7Z035 1GB+0.25GB PL

Module/Board Type: FPGA Core
Core Processor: ARM® Dual-Core Cortex-A9
Co-Processor: Kintex-7
Speed: 800MHz
Flash Size: 512MB
RAM Size: 256MB, 1GB
Connector Type: 168 Pin
Size / Dimension: 2.520" L x 2.130" W (64.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

pacchetto: -

Azione60

ARM® Dual-Core Cortex-A9

Kintex-7

800MHz

512MB

256MB, 1GB

168 Pin

2.520" L x 2.130" W (64.00mm x 54.00mm)

-40°C ~ 85°C

TE0726-04-41I94-A

Trenz Electronic GmbH

IC MODULE ZYNQBERRY

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

pacchetto: -

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-

SPIDERSOM-S

ARIES Embedded

SoM MAX10 FPGA

Module/Board Type: FPGA Core
Core Processor: Max10
Co-Processor: -
Speed: -
Flash Size: 4MB
RAM Size: 8MB
Connector Type: Pin(s)
Size / Dimension: 2.760" L x 1.380" W (70.00mm x 35.00mm)
Operating Temperature: 0°C ~ 70°C

pacchetto: -

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Max10

-

4MB

8MB

Pin(s)

2.760" L x 1.380" W (70.00mm x 35.00mm)

0°C ~ 70°C