Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Data Rate | Input Type | Output Type | Number of Inputs | Number of Outputs | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
IC 1:4 DESERIALIZER 36TQFN
|
pacchetto: 36-WFQFN Exposed Pad |
Azione14.736 |
|
2.488Gbps | CML | LVDS | 1 | 4 | 3.3V | -40°C ~ 85°C (TA) | Surface Mount | 36-WFQFN Exposed Pad | 36-TQFN-EP (6x6) |
||
Maxim Integrated |
IC DESERIALIZER GMSL 3.12GBPS
|
pacchetto: 56-WFQFN Exposed Pad |
Azione24.000 |
|
3.12Gbps | CML | CMOS | 1 | 32 | 1.7 V ~ 1.9 V | -40°C ~ 105°C (TA) | Surface Mount | 56-WFQFN Exposed Pad | 56-TQFN (8x8) |
||
Maxim Integrated |
IC SERIALIZER PROG 48TSSOP
|
pacchetto: 48-TFSOP (0.240", 6.10mm Width) |
Azione4.240 |
|
1.785Gbps | LVCMOS, LVTTL | LVDS | 21 | 3 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | 48-TSSOP |
||
Maxim Integrated |
IC DESERIALIZER 21BIT 48TSSOP
|
pacchetto: 48-TFSOP (0.240", 6.10mm Width) |
Azione3.792 |
|
306Mbps | LVDS | LVCMOS, LVTTL | 3 | 21 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | 48-TSSOP |
||
Maxim Integrated |
IC PROG DC-BAL 21BIT SER 48TSSOP
|
pacchetto: 48-TFSOP (0.240", 6.10mm Width) |
Azione2.272 |
|
1.785Gbps | LVCMOS, LVTTL | LVDS | 21 | 3 | 3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | 48-TSSOP |
||
Maxim Integrated |
IC SERIALIZER LP 28-TQFN
|
pacchetto: 28-WFQFN Exposed Pad |
Azione2.752 |
|
220Mbps | LVCMOS | LCDS | 22 | 1 | 2.375 V ~ 3.465 V | -40°C ~ 90°C (TA) | Surface Mount | 28-WFQFN Exposed Pad | 28-TQFN (5x5) |
||
Maxim Integrated |
IC DESERIALZR 622MBPS TTL 28SSOP
|
pacchetto: 28-SSOP (0.209", 5.30mm Width) |
Azione59.220 |
|
622Mbps | PECL | TTL | 1 | 8 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
Texas Instruments |
IC DESERIALIZER X6 1:10 196LBGA
|
pacchetto: 196-LBGA |
Azione57.444 |
|
660Mbps | LVDS | LVTTL | 1 | 10 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 196-LBGA | 196-BGA (15x15) |
||
Maxim Integrated |
IC SERIALIZER GMSL CAMERA 56TQFN
|
pacchetto: 56-WFQFN Exposed Pad |
Azione4.640 |
|
1Mbps | - | - | - | - | 1.7 V ~ 1.9 V | -40°C ~ 105°C (TA) | Surface Mount | 56-WFQFN Exposed Pad | 56-TQFN (8x8) |
||
Maxim Integrated |
IC DESERIALIZER GMSL 3.12GBPS
|
pacchetto: 56-WFQFN Exposed Pad |
Azione21.288 |
|
3.12Gbps | CML | CMOS | 1 | 32 | 1.7 V ~ 1.9 V | -40°C ~ 105°C (TA) | Surface Mount | 56-WFQFN Exposed Pad | 56-TQFN (8x8) |
||
Texas Instruments |
IC XMITTER 48BIT LVDS 100-TQFP
|
pacchetto: 100-TQFP |
Azione6.080 |
|
5.38Gbps | CMOS/TTL | LVDS | 48 | 8 | 3 V ~ 3.6 V | -10°C ~ 70°C (TA) | Surface Mount | 100-TQFP | 100-TQFP (14x14) |
||
Texas Instruments |
IC DESERIALIZER 10BIT 49FBGA
|
pacchetto: 49-LFBGA |
Azione4.880 |
|
660Mbps | LVDS | LVCMOS, LVTTL | 1 | 10 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 49-LFBGA | 49-BGA (7x7) |
||
Texas Instruments |
IC DESERIAL LVDS 32BIT 64TQFP
|
pacchetto: 64-TQFP |
Azione5.840 |
|
2.72Gbps | Channel Link II (LVDS) | Channel Link II (LVCMOS) | 4 | 32 | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
Texas Instruments |
IC SER/DESER 5-50MHZ 24B 36WQFN
|
pacchetto: 36-WFQFN Exposed Pad |
Azione6.672 |
|
1.4Gbps | LVDS | CML | 5 | 1 | 1.71 V ~ 1.89 V, 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 36-WFQFN Exposed Pad | 36-WQFN (6x6) |
||
Texas Instruments |
IC SERIALIZER LVDS 24BIT 48WQFN
|
pacchetto: 48-WFQFN Exposed Pad |
Azione44.064 |
|
960Mbps | LVCMOS | FPD-Link, LVDS | 24 | 1 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-WFQFN Exposed Pad | 48-WQFN (7x7) |
||
Texas Instruments |
IC 8CH DGTL-IN SERIALZR 28HTSSOP
|
pacchetto: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad |
Azione5.376 |
|
1Mbps | Serial | Serial | 8 | 1 | 18 V ~ 30 V | -40°C ~ 85°C (TA) | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) Exposed Pad | 28-HTSSOP |
||
Maxim Integrated |
IC DESERIALIZER GMSL 3.12GBPS
|
pacchetto: 48-WFQFN Exposed Pad |
Azione7.328 |
|
3.12Gbps | CML | CML | 3 | 1 | 1.7 V ~ 1.9 V | -40°C ~ 105°C (TA) | Surface Mount | 48-WFQFN Exposed Pad | 48-TQFN (7x7) |
||
Texas Instruments |
IC SERIALIZER 48BIT 100-TQFP
|
pacchetto: 100-TQFP |
Azione6.704 |
|
5.38Gbps | LVDS | CMOS, TTL | 8 | 48 | 3 V ~ 3.6 V | -10°C ~ 70°C (TA) | Surface Mount | 100-TQFP | 100-TQFP (14x14) |
||
Texas Instruments |
IC DESERIALIZER 10-43MHZ 48WQFN
|
pacchetto: 48-WFQFN Exposed Pad |
Azione23.616 |
|
903Mbps | FPD-Link II, LVDS | LVCMOS | 1 | 21 | 1.71 V ~ 1.89 V, 3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 48-WFQFN Exposed Pad | 48-WQFN (7x7) |
||
Texas Instruments |
IC SER/DES 25-100MHZ FPD 48WQFN
|
pacchetto: 48-WFQFN Exposed Pad |
Azione23.376 |
|
1.4Gbps | FPD-Link III, LVDS | LVCMOS | 1 | 12 | 1.71 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 48-WFQFN Exposed Pad | 48-WQFN (7x7) |
||
CEL |
IC DESERIALIZER LVDS 56TSSOP
|
pacchetto: 56-TFSOP (0.240", 6.10mm Width) |
Azione7.944 |
|
3.1Gbps | LVDS | CMOS/TTL | 4 | 28 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.240", 6.10mm Width) | 56-TSSOP |
||
Texas Instruments |
IC SER/DES 10-100MHZ FPD 32WQFN
|
pacchetto: 32-WFQFN Exposed Pad |
Azione6.792 |
|
1.4Gbps | LVCMOS | FPD-Link III, LVDS | 12 | 1 | 1.71 V ~ 1.89 V, 3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 32-WFQFN Exposed Pad | 32-WQFN (5x5) |
||
Maxim Integrated |
IC DESERIALIZER
|
pacchetto: 64-TQFP Exposed Pad |
Azione5.376 |
|
2.488Gbps | PECL | LVDS | 1 | 16 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-TQFP Exposed Pad | 64-TQFP-EP (10x10) |
||
ON Semiconductor |
IC SERIALIZER/DESERIAL 48-TSSOP
|
pacchetto: 48-TFSOP (0.240", 6.10mm Width) |
Azione28.464 |
|
1.785Gbps | LVTTL | LVDS | 21 | 3 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | 48-TSSOP |
||
Maxim Integrated |
GMSL SERIALIZER FOR COAX & STP C
|
pacchetto: 56-WFQFN Exposed Pad |
Azione5.184 |
|
3.12Gbps | HDMI | Serial | 4 | 1 | 1.8V ~ 3.3V | -40°C ~ 105°C (TA) | Surface Mount | 56-WFQFN Exposed Pad | 56-TQFN-EP (8x8) |
||
CEL |
IC DESERIALIZER V-BY-ONE HS
|
pacchetto: 64-VFQFN Exposed Pad |
Azione7.312 |
|
4Gbps | V-by-One®HS | CMOS | 2 | 6 | 1.1V ~ 1.3V, 1.7V ~ 2V, 2V ~ 3V, 3V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Texas Instruments |
PROTOTYPE
|
pacchetto: - |
Request a Quote |
|
1.82Gbps | FPD-Link, LVDS | FPD-Link II, LVDS | 5 | 1 | 1.71V ~ 1.89V, 3V ~ 3.6V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-WQFN (6x6) |
||
Texas Instruments |
PROTOTYPE
|
pacchetto: - |
Request a Quote |
|
2.975Gbps | FPD-Link III, LVDS | LVCMOS | 1 | 24 | 1.71V ~ 1.89V, 3V ~ 3.6V | -40°C ~ 105°C | Surface Mount | 60-WFQFN Exposed Pad | 60-WQFN (9x9) |