Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Data Rate | Input Type | Output Type | Number of Inputs | Number of Outputs | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
IC DESERIALIZER GMSL 3.12GBPS
|
pacchetto: 56-WFQFN Exposed Pad |
Azione2.928 |
|
3.12Gbps | CML | LVCMOS | 1 | 32 | 1.7 V ~ 1.9 V | -40°C ~ 105°C (TA) | Surface Mount | 56-WFQFN Exposed Pad | 56-TQFN (8x8) |
||
Maxim Integrated |
IC SERIALIZER GMSL HDCP 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione6.624 |
|
2.5Gbps | CML | CMOS, LVCMOS | 1 | 24/32 | 1.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 64-TQFP Exposed Pad | 64-TQFP-EP (10x10) |
||
Maxim Integrated |
IC 21BIT DESERIALIZER 48-TSSOP
|
pacchetto: 48-TFSOP (0.240", 6.10mm Width) |
Azione6.160 |
|
306Mbps | LVDS | LVCMOS, LVTTL | 3 | 21 | 3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | 48-TSSOP |
||
Cypress Semiconductor Corp |
IC SERIALIZER HOTLINK II 256LBGA
|
pacchetto: 256-LBGA Exposed Pad |
Azione6.816 |
|
1.5Gbps | LVTTL | PECL | 40 | 8 | 3.3V | 0°C ~ 70°C (TA) | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Maxim Integrated |
IC 1:16 DESERIALIZER 64-TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione7.360 |
|
2.488Gbps | LVDS | LVDS | 1 | 16 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-TQFP Exposed Pad | 64-TQFP-EP (10x10) |
||
Texas Instruments |
IC SERIAL/DESERIAL 10:1 28-SSOP
|
pacchetto: 28-SSOP (0.209", 5.30mm Width) |
Azione205.368 |
|
660Mbps | LVDS | LVDS | 1 | 10 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
Fairchild/ON Semiconductor |
IC SERIALIZER/DESERIAL 42-BGA
|
pacchetto: 42-VFBGA |
Azione168.876 |
|
520Mbps | LVCMOS | LVCMOS | 22/1 | 1/22 | 1.65 V ~ 3.6 V | -30°C ~ 70°C (TA) | Surface Mount | 42-VFBGA | 42-USS-BGA (3.5x4.5) |
||
Texas Instruments |
IC DESERIALZR RANDOM LOCK 28SSOP
|
pacchetto: 28-SSOP (0.209", 5.30mm Width) |
Azione29.628 |
|
400Mbps | LVDS | LVTTL | 1 | 10 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
Maxim Integrated |
IC SERIALIZER GMSL COAX 56TQFN
|
pacchetto: 56-WFQFN Exposed Pad |
Azione3.792 |
|
- | HDMI | Serial | - | - | 1.8 V ~ 3.3 V | -40°C ~ 105°C (TA) | Surface Mount | 56-WFQFN Exposed Pad | 56-TQFN (8x8) |
||
Texas Instruments |
IC DESERIALIZER 48BIT 100-TQFP
|
pacchetto: 100-TQFP |
Azione3.440 |
|
5.38Gbps | LVDS | CMOS, TTL | 8 | 48 | 3 V ~ 3.6 V | -10°C ~ 70°C (TA) | Surface Mount | 100-TQFP | 100-TQFP (14x14) |
||
Texas Instruments |
IC SER/DESER 25-170 MHZ FPD 64WQ
|
pacchetto: 64-WFQFN Exposed Pad |
Azione3.504 |
|
3.36Gbps | FPD-Link III, LVDS | CSI-2, MIPI | 2 | 4 | 1.71 V ~ 1.89 V, 3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 64-WFQFN Exposed Pad | 64-WQFN (9x9) |
||
CEL |
IC SERIALIZER DUAL LVDS 48TQFP
|
pacchetto: 48-TQFP |
Azione6.608 |
|
- | CMOS/TTL | LVDS | 18 | 2 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TQFP | 48-TQFP (7x7) |
||
CEL |
IC SERIALIZER SNGL LVDS 64TQFP
|
pacchetto: 64-TQFP |
Azione41.940 |
|
1.12Gbps | LVCMOS | LVDS | 35 | 5 | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
Texas Instruments |
IC SERIAL/DESERIAL 24BIT 48-TQFP
|
pacchetto: 48-TQFP |
Azione4.224 |
|
840Mbps | LVCMOS | FPD-Link, LVDS | 24 | 1 | 3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 48-TQFP | 48-TQFP (7x7) |
||
Maxim Integrated |
IC DESERIALIZER LVDS 28-SSOP
|
pacchetto: 28-SSOP (0.209", 5.30mm Width) |
Azione6.192 |
|
450Mbps | LVDS | LVCMOS, LVTTL | 1 | 10 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
Maxim Integrated |
IC SERIALIZER LVDS 28-SSOP
|
pacchetto: 28-SSOP (0.209", 5.30mm Width) |
Azione6.468 |
|
660Mbps | LVCMOS, LVTTL | LVDS | 10 | 1 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
Maxim Integrated |
IC 1:4 DESERIALIZR W/LVDS 24SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione14.400 |
|
622Mbps | PECL | LVDS | 1 | 4 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Maxim Integrated |
IC DESERIALZR 622MBPS TTL 28SSOP
|
pacchetto: 28-SSOP (0.209", 5.30mm Width) |
Azione24.000 |
|
622Mbps | PECL | TTL | 1 | 8 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
Texas Instruments |
IC SERIAL/DESERIAL 10:1 32-VQFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.024 |
|
660Mbps | LVTTL | LVDS | 10 | 1 | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-VQFN (5x5) |
||
Maxim Integrated |
IC SERIALIZER GMSL LVDS 48TQFP
|
pacchetto: 48-TQFP Exposed Pad |
Azione30.108 |
|
2.5Gbs | LVDS | CML | 5 | 1 | 1.8V, 3.3V | -40°C ~ 105°C (TA) | Surface Mount | 48-TQFP Exposed Pad | 48-TQFP-EP (7x7) |
||
Texas Instruments |
IC SER/DES 10-100MHZ FPD 48WQFN
|
pacchetto: 48-WFQFN Exposed Pad |
Azione6.396 |
|
1.4Gbps | FPD-Link III, LVDS | LVCMOS | 1 | 12 | 1.71 V ~ 1.89 V, 3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 48-WFQFN Exposed Pad | 48-WQFN (7x7) |
||
Texas Instruments |
IC SERIALIZR FPD LINKLLL 40WQFN
|
pacchetto: 40-WFQFN Exposed Pad |
Azione61.896 |
|
2.975Gbps | FPD-Link, LVDS | FPD-Link III, LVDS | 13 | 1 | 3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 40-WFQFN Exposed Pad | 40-WQFN (6x6) |
||
Microsemi Corporation |
IC SERDES 10BIT DUAL-SPD 64QFP
|
pacchetto: 64-QFP |
Azione7.152 |
|
2.52Gbps | SSTL (Stub-Series Terminated Logic) | Differential | 10/1 | 1/10 | 3.3V | 0°C ~ 70°C (TA) | Surface Mount | 64-QFP | 64-PQFP (14x14) |
||
Maxim Integrated |
INTEGRATED CIRCUIT
|
pacchetto: - |
Azione5.952 |
|
- | - | - | - | - | - | - | - | - | - |
||
Texas Instruments |
INTERFACE IC MISC
|
pacchetto: 64-WFQFN Exposed Pad |
Azione7.008 |
|
3.36Gbps | FPD-Link II, LVDS | CSI-2, MIPI | 2 | 4 | 1.14V ~ 1.26V, 3V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 64-WFQFN Exposed Pad | 64-WQFN (9x9) |
||
Texas Instruments |
PROTOTYPE
|
pacchetto: - |
Request a Quote |
|
- | FPD-Link III, LVDS | LVDS | 1 | 5 | 1.71V ~ 1.89V, 3V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 48-WFQFN Exposed Pad | 48-WQFN (7x7) |
||
Texas Instruments |
IC
|
pacchetto: - |
Request a Quote |
|
7.55Gbps | V3Link | CSI-2, MIPI | 4 | 5 | - | -20°C ~ 85°C | Surface Mount | 88-VFQFN Exposed Pad | 88-VQFNP (12x12) |
||
Texas Instruments |
PROTOTYPE
|
pacchetto: - |
Request a Quote |
|
960Mbps | LVDS | LVCMOS | 1 | 24 | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 48-WFQFN Exposed Pad | 48-WQFN (7x7) |