Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
IC INTERFACE LIU LQFP
|
pacchetto: 48-LQFP |
Azione5.584 |
|
- | 1 | 3.3V, 5V | 70mA | - | -40°C ~ 85°C | Surface Mount | 48-LQFP | 48-TQFP (9x9) |
||
Exar Corporation |
PCM LINE DRIVER
|
pacchetto: - |
Azione7.600 |
|
- | - | - | - | - | - | - | - | - |
||
Silicon Labs |
IC PROSLIC FXS DUAL -110V 50QFN
|
pacchetto: - |
Azione2.912 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Silicon Labs |
IC PROSLIC FXS WIDEB -110V 60QFN
|
pacchetto: 60-WFQFN Exposed Pad |
Azione15.804 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 3.47 V | - | - | 0°C ~ 70°C | Surface Mount | 60-WFQFN Exposed Pad | 60-QFN (8x8) |
||
Maxim Integrated |
IC FRAMER ENHANCED T1 4X 128TQFP
|
pacchetto: 128-LQFP |
Azione6.208 |
|
Parallel/Serial | 4 | 2.97 V ~ 3.63 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 128-LQFP | 128-LQFP (14x20) |
||
Microchip Technology |
IC MONO FEATURE PHONE 44SSOP
|
pacchetto: 44-SOP (0.291", 7.40mm Width) |
Azione5.488 |
|
- | 1 | - | - | 900mW | -25°C ~ 75°C | Surface Mount | 44-SOP (0.291", 7.40mm Width) | 44-SSO |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 16MLP
|
pacchetto: 16-VDFN Exposed Pad |
Azione6.544 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-VDFN Exposed Pad | 16-MLP (7x6) |
||
Maxim Integrated |
IC TRANSCEIVER T1 40-DIP
|
pacchetto: 40-DIP (0.600", 15.24mm) |
Azione4.480 |
|
T1 | 1 | 4.5 V ~ 5.5 V | 3mA | - | 0°C ~ 70°C | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 12CH 420TBGA
|
pacchetto: 420-LBGA Exposed Pad |
Azione7.776 |
|
LIU | 12 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 420-LBGA Exposed Pad | 420-TBGA (35x35) |
||
Maxim Integrated |
IC TXRX E1 QUAD 100-LQFP
|
pacchetto: 100-LQFP |
Azione16.260 |
|
E1 | 4 | 3.14 V ~ 3.47 V | 230mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Microsemi Corporation |
IC TXRX SGL E1 W/LIU 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione4.160 |
|
- | 1 | 4.75 V ~ 5.25 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 68-LCC (J-Lead) | 68-PLCC |
||
Exar Corporation |
IC LIU/FRAMER TI/E1/J1 SGL 128LQ
|
pacchetto: 128-LQFP |
Azione3.456 |
|
- | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 128-LQFP | 128-LQFP (14x20) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/J1/E1 1CH 44-TQFP
|
pacchetto: 44-LQFP |
Azione4.144 |
|
LIU | - | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 44-LQFP | 44-TQFP |
||
Microsemi Corporation |
IC VOICE PROCESSOR VCP 128TQFP
|
pacchetto: 128-TQFP |
Azione50.196 |
|
2-Wire | - | - | - | - | - | Surface Mount | 128-TQFP | 128-TQFP |
||
Microsemi Corporation |
IC CODEC A-LAW CCITT PCM 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione12.216 |
|
PCM | 1 | 4.75 V ~ 5.25 V | 3mA | - | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microsemi Corporation |
IC SLIC 1CH 52DB LGBAL 32QFN
|
pacchetto: 32-VQFN Exposed Pad |
Azione14.160 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (8x8) |
||
Silicon Labs |
IC SLIC/CODEC PROGRAMMBL 38TSSOP
|
pacchetto: 38-TFSOP (0.173", 4.40mm Width) |
Azione158.628 |
|
PCM, SPI | 1 | 3.3V, 5V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
Linear Technology |
IC RING TONE GENERATOR 14-SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione4.720 |
|
- | 1 | - | - | - | 0°C ~ 125°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Silicon Labs |
IC VOICE DAA SYSTEM SIDE 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione116.796 |
|
GCI, PCM, SPI | 1 | 3 V ~ 3.6 V | 8.5mA | - | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microsemi Corporation |
IC RECEIVER DTMF 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione17.928 |
|
- | 1 | 4.75 V ~ 5.25 V | 3mA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microsemi Solutions Sdn Bhd. |
IC ETHERNET RGMII/RMII 48-QFN
|
pacchetto: - |
Azione7.752 |
|
RMII | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | - | 68-QFN (8x8) |
||
Microsemi Corporation |
IC TXRX DTMF 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione112.452 |
|
- | 1 | 4.75 V ~ 5.25 V | 7mA | - | -40°C ~ 85°C | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
||
Microchip Technology |
2P, DUAL-MEDIA, GE PHY, MACSEC 2
|
pacchetto: - |
Azione4.768 |
|
- | - | - | - | - | - | - | - | - |
||
Renesas Electronics America |
IC LINE DRIVER VDSL2 DIFF 16QFN
|
pacchetto: 16-TQFN Exposed Pad |
Azione7.328 |
|
- | 1 | ±4 V ~ 6.6 V, 8 V ~ 13.2 V | - | - | -40°C ~ 85°C | Surface Mount | 16-TQFN Exposed Pad | 16-QFN (4x4) |
||
Microchip Technology |
IC VOICE ECHO CANCELLER 208LBGA
|
pacchetto: 208-LBGA |
Azione6.096 |
|
- | 1 | 1.6V ~ 2V | 10mA | - | -40°C ~ 85°C | Surface Mount | 208-LBGA | 208-LBGA (17x17) |
||
Microchip Technology |
IC SLAC CODEC/FILTER 8CH 121BGA
|
pacchetto: 121-LFBGA |
Azione7.104 |
|
PCI | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 121-LFBGA | 121-LFBGA (10x10) |
||
Zarlink |
ZARLINK TELECOM CIRCUIT 1-FUNC
|
pacchetto: - |
Request a Quote |
|
- | - | 5V | 7mA | - | -40°C ~ 85°C | Surface Mount | 64-QFP | 64-QFP |
||
Infineon Technologies |
BIPOLAR SLIC
|
pacchetto: - |
Request a Quote |
|
2-Wire | 1 | -24V ~ -58V | - | - | 0°C ~ 70°C | Through Hole | 22-DIP | 22-DIP |