Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC SOC SHDSL 4CH 324-LBGA
|
pacchetto: 324-LBGA |
Azione2.640 |
|
HDLC, Parallel, Serial | 1 | 1.5V, 3.3V | - | 650mW | -40°C ~ 85°C | Surface Mount | 324-LBGA | PG-LBGA-324-2 |
||
Infineon Technologies |
IC CODEC W/TRANSCEIVER MQFP-44
|
pacchetto: 44-QFP |
Azione4.256 |
|
IOM-2, SCI, UPN | 1 | 3.3V, 5V | 27mA | - | - | Surface Mount | 44-QFP | P-MQFP-44 |
||
Infineon Technologies |
IC CONTROLR 32-CH HDLC 160-MQFP
|
pacchetto: 160-BQFP |
Azione2.160 |
|
HDLC, V.110, X.30 | - | 5V | 100mA | - | 0°C ~ 70°C | Surface Mount | 160-BQFP | P-MQFP-160 |
||
Maxim Integrated |
IC PLC MODEM OFDM BASED
|
pacchetto: 48-LQFP |
Azione3.552 |
|
UART | 1 | 2.7 V ~ 3.6 V | 7.4mA | - | -40°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
IXYS Integrated Circuits Division |
IC TELECOM SWITCH 170MA 8FLATPAK
|
pacchetto: 8-SMD, Gull Wing |
Azione7.984 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Surface Mount | 8-SMD, Gull Wing | 8-Flatpack |
||
Microsemi Corporation |
IC TDM SWITCH 1K-CH ENH 256BGA
|
pacchetto: 256-BGA |
Azione7.440 |
|
- | 1 | 1.71 V ~ 1.89 V | 115mA | - | -45°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/J1/E1 8CH 208-TQFP
|
pacchetto: 208-BFQFP |
Azione7.072 |
|
LIU | - | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 208-BFQFP | 208-PQFP (28x28) |
||
STMicroelectronics |
IC CTRLR SYSTEM7 33MHZ 52-PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione6.336 |
|
HDLC, SS7 | 1 | - | - | 500mW | 0°C ~ 70°C | Surface Mount | 52-LCC (J-Lead) | 52-PLCC |
||
Maxim Integrated |
IC CONTROLLER T1 5V 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione3.728 |
|
Parallel/Serial | - | 4.5 V ~ 5.5 V | 10mA | - | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
NXP |
IC SPEAKERPHONE CIRCUIT 42-SDIP
|
pacchetto: 42-SDIP (0.600", 15.24mm) |
Azione9.516 |
|
- | 1 | - | - | - | -20°C ~ 70°C | Through Hole | 42-SDIP (0.600", 15.24mm) | 42-PSDIP |
||
IXYS Integrated Circuits Division |
IC TRANSCEIVER MFC 2CHAN 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione6.080 |
|
- | 1 | 4.75 V ~ 5.25 V | 75mA | 1W | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC |
||
Maxim Integrated |
IC TXRX T1 1-CHIP 5V 100-BGA
|
pacchetto: 100-LFBGA, CSPBGA |
Azione3.200 |
|
E1, HDLC, J1, T1 | 1 | 4.75 V ~ 5.25 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LFBGA, CSPBGA | 100-CSBGA (10x10) |
||
Maxim Integrated |
IC TXRX T1/E1/J1 1-CHIP 100-LQFP
|
pacchetto: 100-LQFP |
Azione3.040 |
|
E1, HDLC, J1, T1 | 1 | 3.14 V ~ 3.47 V | 75mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Texas Instruments |
IC TONE DECODER CMOS 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione3.728 |
|
- | 1 | 2 V ~ 9 V | - | 500mW | -25°C ~ 100°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 3CH 120LQFP
|
pacchetto: 120-LQFP |
Azione9.876 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 350mA | - | -40°C ~ 85°C | Surface Mount | 120-LQFP | 120-LQFP (14x20) |
||
Maxim Integrated |
IC MODULATOR DRVR 10GBPS 24-TQFN
|
pacchetto: 24-WFQFN Exposed Pad |
Azione5.248 |
|
- | 1 | -5.5 V ~ -4.9 V | 140mA | - | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN (4x4) |
||
Microsemi Corporation |
IC DGTL SWITCH 2048X2048 100LQFP
|
pacchetto: 100-LQFP |
Azione5.920 |
|
- | 1 | 3 V ~ 3.6 V | 45mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.744 |
|
- | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Silicon Labs |
IC PROSLIC FXS PCM -106V 40QFN
|
pacchetto: - |
Azione6.960 |
|
3-Wire | 1 | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
Texas Instruments |
IC LINE DRIVE AMP DIFF 24VQFN
|
pacchetto: - |
Azione5.168 |
|
- | 1 | 10 V ~ 28 V | 21mA | - | -40°C ~ 85°C | - | - | - |
||
Microsemi Corporation |
84/63 CHAN T1/E1 VT1.5/VT2 MAPPE
|
pacchetto: - |
Azione2.528 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
12X1G + 2X10G (SERVAL-2) CE SWIT
|
pacchetto: - |
Azione4.944 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
pacchetto: - |
Azione3.280 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC TDM SWITCH 1K-CH ENH 256BGA
|
pacchetto: 256-BGA |
Azione4.800 |
|
- | 1 | 1.71V ~ 1.89V | 115mA | - | -45°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microchip Technology |
IC RECEIVER DTMF 16PAIR 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione2.320 |
|
- | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC TXRX DTMF 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione5.472 |
|
- | 1 | 4.75V ~ 5.25V | 7mA | - | -40°C ~ 85°C | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
||
Microchip Technology |
IC DIGITAL SWITCH 16K CH 256LQFP
|
pacchetto: 256-LQFP |
Azione7.536 |
|
- | 1 | 1.71V ~ 1.89V | 240mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
||
Microchip Technology |
IC SYNCHRONIZER T1/E1 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.032 |
|
- | 1 | 4.5V ~ 5.5V | 60mA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Microchip Technology |
UNIC SLIC 100V QFN
|
pacchetto: - |
Azione7.520 |
|
Serial | 1 | 3.3V | - | - | - | Surface Mount | - | 28-QFN (4x5) |
||
Microchip Technology |
HDLIU# 32
|
pacchetto: - |
Azione4.368 |
|
E1, J1, T1 | - | - | - | - | - | - | - | - |