Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
IC CONFIG DEVICE 88UBGA
|
pacchetto: 88-LFBGA |
Azione5.008 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 88-LFBGA | 88-UBGA (11x8) |
||
Altera |
IC CONFIG DEVICE 65KBIT 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione5.184 |
|
65kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC FPGA 256K CONFIG MEM 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.840 |
|
256Kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FPGA 1M CONFIG MEM 10MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.808 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FPGA 2M CONFIG MEM 44TQFP
|
pacchetto: 44-TQFP |
Azione7.680 |
|
2Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 44-TQFP | 44-TQFP (10x10) |
||
Xilinx Inc. |
IC PROM PROG C-TEMP 3.3V 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.480 |
|
400kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM SRL CONFG 4M LV 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione5.632 |
|
4Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC FLASH CONFIG 8M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione2.432 |
|
8Mb | 2.97 V ~ 3.63 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione4.144 |
|
2Mb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER 4MBIT 3.3V 44-VQFP
|
pacchetto: 44-TQFP |
Azione38.964 |
|
4Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM SER 4MBIT 3.3V 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione25.476 |
|
4Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER 5K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione127.392 |
|
150kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER 10K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione60.816 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 512K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione5.904 |
|
512kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFG EEPROM 256K 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.368 |
|
256Kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC SER CONFIG PROM 65K 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione3.568 |
|
64kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SERIAL CONFIG PROM 2M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione4.448 |
|
2Mb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SERIAL CONFIG PROM 64K 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione5.024 |
|
64kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC CONFIG DEVICE 1MBIT 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione92.508 |
|
1Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
XC18V02PCG44C0100
|
pacchetto: 44-LCC (J-Lead) |
Azione7.280 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC EEPROM SRL CONFG 2M LV 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.440 |
|
2Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC FLASH CONFIG 8M 8LAP
|
pacchetto: 8-TDFN |
Azione3.056 |
|
8Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC FLASH CONFIG 4M 32TQFP
|
pacchetto: 32-TQFP |
Azione4.352 |
|
4Mb | 2.97 V ~ 3.63 V | 0°C ~ 70°C | 32-TQFP | 32-TQFP (7x7) |
||
Altera |
IC CONFIG DEVICE 65KBIT 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.696 |
|
65kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH CONFIG 8M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione7.308 |
|
8Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Intel |
IC CONFIG DEVICE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.656 |
|
4MB | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Intel |
IC CONFIG DEVICE
|
pacchetto: 88-LFBGA |
Azione2.912 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 88-LFBGA | 88-UBGA (11x8) |
||
Intel |
IC CONFIG DEVICE 1MBIT 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.888 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Intel |
IC QUAD-SERIAL LOW VOLTAGE CONFI
|
pacchetto: 24-TBGA |
Azione6.960 |
|
512MB | 1.7 V ~ 2 V | -40°C ~ 85°C | 24-TBGA | 24-FBGA (6x8) |
||
Intel |
IC CONFIG DEVICE 1.6MBIT 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione6.304 |
|
1.6Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |