Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
IC CONFIG DEVICE 100QFP
|
pacchetto: 100-BQFP |
Azione5.712 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (14x20) |
||
Xilinx Inc. |
IC 3V SER CFG PROM 65K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.328 |
|
65kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 128K 8LAP
|
pacchetto: 8-TDFN |
Azione3.568 |
|
128kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione4.800 |
|
512kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 44-VQFP
|
pacchetto: 44-TQFP |
Azione5.968 |
|
2Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione16.584 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER 1MBIT 3.3V 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.288 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SER 50000 I-TEMP 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.968 |
|
500kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM PROG C-TEMP 3.3V 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione13.872 |
|
400kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SER 150K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione81.168 |
|
1.5Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 128K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione3.840 |
|
128kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER C-TEMP 128K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione4.496 |
|
128kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC SER CFG PROM 36K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.344 |
|
36kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Altera |
IC CONFIG DEVICE 100QFP
|
pacchetto: 100-BQFP |
Azione4.800 |
|
4MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (14x20) |
||
Altera |
IC CONFIG DEVICE 64MBIT 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione2.560 |
|
64Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Altera |
IC CONFIG DEVICE 65KBIT 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione47.136 |
|
65kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC MEM PROM 16MB 3.3V 44PIN
|
pacchetto: 44-CCC (J-Lead) |
Azione7.120 |
|
16Mb | 3 V ~ 3.6 V | -55°C ~ 125°C (TC) | 44-CCC (J-Lead) | 44-CCCP (16.51x16.51) |
||
Microchip Technology |
IC CONFIG SEEPROM 512K 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione3.616 |
|
512kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 1M 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione4.256 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC CONFIG DEVICE 1MBIT 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.175.152 |
|
1Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SRL CONFIG EEPROM 128K 8-LAP
|
pacchetto: 8-TDFN |
Azione6.080 |
|
128kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 64K LV 8LAP
|
pacchetto: 8-TDFN |
Azione7.248 |
|
64kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione18.018 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Intel |
IC CONFIG DEVICE 100QFP
|
pacchetto: 100-BQFP |
Azione2.272 |
|
8MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 440KBIT 32TQFP
|
pacchetto: 32-TQFP |
Azione5.904 |
|
440kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 32-TQFP | 32-TQFP (7x7) |
||
Intel |
IC CONFIG DEVICE 65KBIT 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.032 |
|
65kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Intel |
IC CONFIG DEVICE 16MBIT 100QFP
|
pacchetto: 100-BQFP |
Azione5.360 |
|
16Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 16MBIT 100QFP
|
pacchetto: 100-BQFP |
Azione6.096 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 400KBIT 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione17.040 |
|
440kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Intel |
IC CONFIG DEVICE 4MBIT 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione11.316 |
|
4MB | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |