Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ISSI, Integrated Silicon Solution Inc |
IC SRAM 4MBIT 45NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione3.664 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 45ns | 45ns | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP I |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 576MBIT 300MHZ 144BGA
|
pacchetto: 144-TFBGA |
Azione3.024 |
|
DRAM | DRAM | 576Mb (32M x 18) | Parallel | 300MHz | - | 20ns | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 144-TFBGA | 144-FCBGA (11x18.5) |
||
Micron Technology Inc. |
IC FLASH 36G MLC DDR
|
pacchetto: - |
Azione6.960 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC EEPROM 8KBIT 3MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.552 |
|
EEPROM | EEPROM | 8Kb (512 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Micron Technology Inc. |
IC FLASH 256MBIT 100NS 88SCSP
|
pacchetto: 88-VFBGA, CSPBGA |
Azione3.760 |
|
FLASH | FLASH - NOR | 256Mb (16M x 16) | Parallel | 52MHz | 100ns | 100ns | 1.7 V ~ 2 V | -40°C ~ 85°C (TC) | Surface Mount | 88-VFBGA, CSPBGA | 88-SCSP (11x8) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 16MBIT 100MHZ 50TSOP
|
pacchetto: 50-TSOP (0.400", 10.16mm Width) |
Azione4.576 |
|
DRAM | SDRAM | 16Mb (1M x 16) | Parallel | 100MHz | - | 7ns | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 50-TSOP (0.400", 10.16mm Width) | 50-TSOP II |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 143MHZ 86TSOP
|
pacchetto: 86-TFSOP (0.400", 10.16mm Width) |
Azione6.720 |
|
DRAM | SDRAM | 256Mb (8M x 32) | Parallel | 143MHz | - | 5.5ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 86-TFSOP (0.400", 10.16mm Width) | 86-TSOP II |
||
Cypress Semiconductor Corp |
IC SRAM 1MBIT 55NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione5.312 |
|
SRAM | SRAM - Asynchronous | 1Mb (64K x 16) | Parallel | - | 55ns | 55ns | 2.2 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Microchip Technology |
IC FLASH 2MBIT 55NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione2.672 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 50µs | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
NXP |
IC CAM 1MBIT 50MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione16.668 |
|
RAM | CAM | 1Mb (16K x 64) | Parallel | 50MHz | - | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
Microchip Technology |
IC OTP 2MBIT 120NS 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione5.712 |
|
EPROM | EPROM - OTP | 2Mb (128K x 16) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 450MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione3.888 |
|
SRAM | SRAM - Synchronous, QDR II+ | 72Mb (4M x 18) | Parallel | 450MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 36MBIT 333MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione6.432 |
|
SRAM | SRAM - Synchronous, QUADP | 36Mb (2M x 18) | Parallel | 333MHz | - | 8.4ns | 1.71 V ~ 1.89 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-LFBGA (15x17) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 7.5NS 100TQFP
|
pacchetto: 100-LQFP |
Azione6.688 |
|
SRAM | SRAM - Synchronous | 9Mb (512K x 18) | Parallel | 117MHz | - | 7.5ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 16KBIT 25NS 64TQFP
|
pacchetto: 64-LQFP |
Azione7.552 |
|
SRAM | SRAM - Dual Port, Asynchronous | 16Kb (2K x 8) | Parallel | - | 25ns | 25ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 8.5NS 165CABGA
|
pacchetto: 165-TBGA |
Azione5.696 |
|
SRAM | SRAM - Synchronous ZBT | 9Mb (512K x 18) | Parallel | - | - | 8.5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 512KBIT 10NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione2.544 |
|
SRAM | SRAM - Asynchronous | 512Kb (32K x 16) | Parallel | - | 10ns | 10ns | 2.4 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP2 |
||
Cypress Semiconductor Corp |
F-RAM MEMORY SERIAL
|
pacchetto: - |
Azione4.368 |
|
FRAM | FRAM (Ferroelectric RAM) | 16Kb (2K x 8) | I2C | 1MHz | - | - | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | - | - | - |
||
Winbond Electronics |
IC FLASH 1MBIT 104MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione4.432 |
|
FLASH | FLASH | 1Mb (128K x 8) | SPI | 104MHz | 800µs | - | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ SOT23-6
|
pacchetto: SOT-23-6 |
Azione36.000 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 1.5 V ~ 3.6 V | -20°C ~ 85°C (TA) | Surface Mount | SOT-23-6 | SOT-23-6 |
||
Microchip Technology |
IC EEPROM 2KBIT 2MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.368 |
|
EEPROM | EEPROM | 2Kb (128 x 16) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Winbond Electronics |
IC FLASH 128MBIT SPI/QUAD 8WSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 128Mbit | SPI - Quad I/O | 133 MHz | 3ms | 6 ns | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
||
Micron Technology Inc. |
IC FLASH 256GBIT MMC 153VFBGA
|
pacchetto: - |
Azione2.637 |
|
FLASH | FLASH - NAND | 256Gbit | MMC | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 153-VFBGA | 153-VFBGA (11.5x13) |
||
Macronix |
MEMORY
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 32Mbit | SPI - Quad I/O | 133 MHz | 50µs, 1.2ms | 6 ns | 2.65V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOP |
||
Micron Technology Inc. |
SPECIAL/CUSTOM LPDDR4
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Winbond Electronics |
IC FLASH 2MBIT SPI/QUAD 8SOIC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 2Mbit | SPI - Quad I/O | 104 MHz | 800µs | 8 ns | 2.3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Renesas Electronics Corporation |
IC RAM
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM | 64Kbit | Parallel | 25 MHz | 35ns | 35 ns | 4.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
||
Alliance Memory, Inc. |
DRAM DDR2, 512MB, 32M X 16, 1.8V
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR2 | 512Mbit | SSTL_18 | 400 MHz | 15ns | 400 ps | 1.7V ~ 1.9V | -40°C ~ 95°C (TC) | Surface Mount | 84-TFBGA | 84-FBGA (8x12.5) |