Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
LPDDR3 192MX128 PLASTIC GREEN VF
|
pacchetto: - |
Azione4.896 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 256GBIT 169TFBGA
|
pacchetto: 169-TFBGA |
Azione2.592 |
|
FLASH | FLASH - NAND | 256Gb (32G x 8) | MMC | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 169-TFBGA | 169-TFBGA (14x18) |
||
Micron Technology Inc. |
IC SDRAM 2GBIT 167MHZ 60VFBGA
|
pacchetto: 60-VFBGA |
Azione111.024 |
|
DRAM | SDRAM - Mobile LPDDR | 2Gb (128M x 16) | Parallel | 166MHz | 15ns | 5.0ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 60-VFBGA | 60-VFBGA (10x10) |
||
Micron Technology Inc. |
IC FLASH 64GBIT 52VLGA
|
pacchetto: 52-VLGA |
Azione6.160 |
|
FLASH | FLASH - NAND | 64Gb (8G x 8) | Parallel | - | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 52-VLGA | 52-VLGA (18x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 7.5NS 165CABGA
|
pacchetto: 165-TBGA |
Azione2.624 |
|
SRAM | SRAM - Synchronous | 4.5Mb (128K x 36) | Parallel | - | - | 7.5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
Microchip Technology |
IC FLASH 2MBIT 70NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.848 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
IDT, Integrated Device Technology Inc |
IC SRAM 512KBIT 12NS 100TQFP
|
pacchetto: 100-LQFP |
Azione7.120 |
|
SRAM | SRAM - Dual Port, Synchronous | 512Kb (64K x 8) | Parallel | - | - | 12ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 100MHZ 165CABGA
|
pacchetto: 165-TBGA |
Azione7.664 |
|
SRAM | SRAM - Synchronous ZBT | 9Mb (256K x 36) | Parallel | 100MHz | - | 5ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 150MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione2.368 |
|
SRAM | SRAM - Synchronous | 9Mb (512K x 18) | Parallel | 150MHz | - | 3.8ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Alliance Memory, Inc. |
IC SRAM 2MBIT 12NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione6.496 |
|
SRAM | SRAM - Asynchronous | 2Mb (128K x 16) | Parallel | - | 12ns | 12ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Micron Technology Inc. |
IC FLASH 32MBIT 75MHZ 24TBGA
|
pacchetto: 24-TBGA |
Azione7.312 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI | 75MHz | 15ms, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-T-PBGA (6x8) |
||
Winbond Electronics |
IC FLASH 64MBIT SPI 8WSON
|
pacchetto: - |
Azione7.984 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | SPI | 133MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Microchip Technology |
IC EEPROM 4KBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.480 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Rohm Semiconductor |
IC EEPROM 8KBIT 400KHZ 8MSOP
|
pacchetto: 8-VSSOP, 8-MSOP (0.110", 2.80mm Width) |
Azione5.760 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 400kHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VSSOP, 8-MSOP (0.110", 2.80mm Width) | 8-MSOP |
||
Micron Technology Inc. |
IC SDRAM 4GBIT 933MHZ 78FBGA
|
pacchetto: 78-TFBGA |
Azione14.898 |
|
DRAM | SDRAM - DDR3L | 4Gb (1G x 4) | Parallel | 933MHz | - | 20ns | 1.283 V ~ 1.45 V | 0°C ~ 95°C (TC) | Surface Mount | 78-TFBGA | 78-FBGA (8x10.5) |
||
Winbond Electronics |
IC FLASH 128MBIT 104MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione92.094 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI | 104MHz | 5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 8M PARALLEL 48TFBGA
|
pacchetto: 48-TFBGA |
Azione3.296 |
|
SRAM | SRAM - Asynchronous | 8Mb (512K x 16) | Parallel | - | 10ns | 10ns | 2.4 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Winbond Electronics |
IC DRAM 2G PARALLEL 1066MHZ
|
pacchetto: 78-VFBGA |
Azione7.328 |
|
DRAM | SDRAM - DDR3 | 2Gb (128M x 16) | Parallel | 1066MHz | - | 20ns | 1.425 V ~ 1.575 V | 0°C ~ 95°C (TC) | Surface Mount | 78-VFBGA | 78-VFBGA (10.5x8) |
||
Cypress Semiconductor Corp |
IC FLASH 32M PARALLEL 56TSOP
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione3.424 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8, 2M x 16) | Parallel | - | 90ns | 90ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 64K PARALLEL 84PLCC
|
pacchetto: 84-LCC (J-Lead) |
Azione7.024 |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kb (4K x 16) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 84-LCC (J-Lead) | 84-PLCC (29.21x29.21) |
||
Micron Technology Inc. |
IC FLASH 256G MMC
|
pacchetto: - |
Azione7.216 |
|
FLASH | FLASH - NAND | 256Gb (32G x 8) | MMC | - | - | - | - | -25°C ~ 85°C (TA) | - | - | - |
||
Micron Technology Inc. |
RLDRAM 3 1.125G 64MX18 TBGA
|
pacchetto: - |
Azione7.568 |
|
DRAM | DRAM | 1.125Gb (64Mb x 18) | Parallel | 1067MHz | - | 7.5ns | 1.28 V ~ 1.42 V | 0°C ~ 95°C (TC) | - | - | - |
||
Cypress Semiconductor Corp |
IC FRAM 8MBIT 20MHZ 8GQFN
|
pacchetto: - |
Azione3.616 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC EEPROM 512KBIT I2C 8MSOP
|
pacchetto: - |
Azione900 |
|
EEPROM | EEPROM | 512Kbit | I2C | 3.4 MHz | 5ms | 400 ns | 1.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Silicon Motion, Inc. |
IC FLASH 512GBIT UFS3.1 153BGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (TLC) | 512Gbit | UFS3.1 | - | - | - | - | -40°C ~ 105°C | Surface Mount | 153-TBGA | 153-BGA (11.5x13) |
||
Everspin Technologies Inc. |
IC RAM 256KBIT SPI 40MHZ 8DFN
|
pacchetto: - |
Request a Quote |
|
RAM | MRAM (Magnetoresistive RAM) | 256Kbit | SPI | 40 MHz | - | 9 ns | 2.7V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-EP, Small Flag (5x6) |
||
Fairchild Semiconductor |
IC EEPROM 2KBIT I2C 100KHZ 8SOIC
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 2Kbit | I2C | 100 kHz | 15ms | 3.5 µs | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Micron Technology Inc. |
LPDDR5 16GBIT 16 315/315 TFBGA 1
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR5 | 16Gbit | Parallel | 4.266 GHz | - | - | 1.05V | -40°C ~ 95°C | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) |