Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
POWER INTEGRATED CIRCUIT
|
pacchetto: - |
Azione6.192 |
|
- | - | - | - | - | - |
||
Cymbet Corporation |
IC ENERCHIP EP UNIV HARV 38SOIC
|
pacchetto: 38-TSSOP (0.240", 6.10mm Width) |
Azione2.880 |
|
- | 2.5 V ~ 3.6 V | -20°C ~ 70°C | Surface Mount | 38-TSSOP (0.240", 6.10mm Width) | 38-TSSOP |
||
Maxim Integrated |
IC DCDC CONV STPDN LDO 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
Azione7.344 |
|
- | 3.7 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) Exposed Pad | 20-TSSOP-EP |
||
Texas Instruments |
IC POWER MGMT 48WQFN
|
pacchetto: 48-WFQFN Exposed Pad |
Azione2.352 |
|
- | 2.5 V ~ 6 V | -40°C ~ 85°C | Surface Mount | 48-WFQFN Exposed Pad | 48-WQFN (6x6) |
||
Texas Instruments |
IC PWR MGMT 4 LDO TXRX 139-BGA
|
pacchetto: 139-LFBGA |
Azione6.384 |
|
300µA | 2.7 V ~ 4.5 V | -40°C ~ 85°C | Surface Mount | 139-LFBGA | 139-NFBGA (10x10) |
||
NXP |
IC SYSTEM BASIS CHIP LIN 32-SOIC
|
pacchetto: 32-SOIC (0.295", 7.50mm Width) |
Azione24.000 |
|
5mA | 5.5 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 32-SOIC (0.295", 7.50mm Width) | 32-SOIC |
||
Infineon Technologies |
ENGINECONTR
|
pacchetto: 24-LSSOP (0.154", 3.90mm Width) Exposed Pad |
Azione6.480 |
|
- | 6 V ~ 18 V | -40°C ~ 150°C | Surface Mount | 24-LSSOP (0.154", 3.90mm Width) Exposed Pad | PG-SSOP-24 |
||
Linear Technology |
IC USB POWER MANAGER 28-QFN
|
pacchetto: 28-WFQFN Exposed Pad |
Azione2.096 |
|
- | 4.35 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-WFQFN Exposed Pad | 28-QFN (4x5) |
||
Linear Technology |
IC CONV DC/DC PWR MANAGER 12DFN
|
pacchetto: 12-WFDFN Exposed Pad |
Azione2.800 |
|
3mA | 20mV ~ 500mV | -40°C ~ 125°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (4x3) |
||
Maxim Integrated |
IC LDO/SWITCH ADJ DUAL 16TQFN
|
pacchetto: 16-WQFN Exposed Pad |
Azione6.656 |
|
2.1mA | 4.5 V ~ 28 V | -40°C ~ 105°C | Surface Mount | 16-WQFN Exposed Pad | 16-TQFN (4x4) |
||
NXP |
IC SYSTEM BASIS CHIP LIN 32-LQFP
|
pacchetto: 32-LQFP |
Azione4.688 |
|
4.5mA | 5.5 V ~ 27 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
IC SYSTEM BASIS CHIP 32LQFP
|
pacchetto: 32-LQFP |
Azione56.088 |
|
4.5mA | 5.5 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Diodes Incorporated |
HEATER CONTROLLER PDIP-8
|
pacchetto: - |
Azione7.920 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
HEATER CONTROLLER SO-8
|
pacchetto: - |
Azione5.184 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
IRON CONTROLLER SO-8
|
pacchetto: - |
Azione5.600 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
HEATER CONTROLLER SO-8
|
pacchetto: - |
Azione7.760 |
|
- | - | - | - | - | - |
||
Microchip Technology |
IC ULTRASOUND DRIVER 80VQFN
|
pacchetto: 80-VFQFN Exposed Pad |
Azione6.384 |
|
- | 4.75 V ~ 5.25 V | -40°C ~ 125°C | Surface Mount | 80-VFQFN Exposed Pad | 80-QFN (11x11) |
||
Cypress Semiconductor Corp |
IC REG BUCK ENERGY HARVEST 40QFN
|
pacchetto: 40-VFQFN Exposed Pad |
Azione5.248 |
|
32µA | 3 V ~ 5 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (6x6) |
||
Texas Instruments |
IC PD CTLR USB TYPE-C 8WSON
|
pacchetto: 8-WFDFN Exposed Pad |
Azione6.240 |
|
330µA | 3.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-WFDFN Exposed Pad | 8-WSON (2x2) |
||
STMicroelectronics |
IC CTLR DDR2/3 MEM PS 24VFQFPN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione43.740 |
|
800µA | 4.5 V ~ 36 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-VFQFPN (4x4) |
||
NXP |
FS6500
|
pacchetto: 48-LQFP Exposed Pad |
Azione2.944 |
|
- | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC WIRELESS PWR RECEIVER 36-WLCS
|
pacchetto: - |
Azione5.072 |
|
- | - | 0°C ~ 85°C | - | - | - |
||
Infineon Technologies |
IC CTRL XPHASE 40QFN
|
pacchetto: - |
Azione4.928 |
|
- | - | - | - | - | - |
||
Maxim Integrated |
60V, 6A ADJUSTABLE OVP + OCP PRO
|
pacchetto: 20-WQFN Exposed Pad |
Azione6.300 |
|
1.26mA | 5.5 V ~ 60 V | -40°C ~ 125°C | Surface Mount | 20-WQFN Exposed Pad | 20-TQFN-EP (5x5) |
||
Analog Devices Inc. |
IC ACTIVE BIAS CONTROLLER 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione4.448 |
|
7.5mA | 4 V ~ 12 V | -55°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-SMT (3x3) |
||
Rohm Semiconductor |
POWER SUPPLY IC SERIES FOR TFT-L
|
pacchetto: 24-VFQFN Exposed Pad |
Azione24.666 |
|
- | - | - | Surface Mount | 24-VFQFN Exposed Pad | VQFN020V4040 |
||
Maxim Integrated |
INTEGRATED CIRCUIT
|
pacchetto: - |
Azione7.872 |
|
- | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC WIRELESS
|
pacchetto: - |
Azione5.184 |
|
- | - | -40°C ~ 85°C | - | - | - |
||
Diodes Incorporated |
HEATER CONTROLLER DIP-8
|
pacchetto: - |
Azione6.736 |
|
- | 4 V ~ 5.5 V | -20°C ~ 85°C (TA) | - | - | - |
||
Diodes Incorporated |
HEATER CONTROLLER DIP-8
|
pacchetto: - |
Azione4.496 |
|
- | 3.5 V ~ 5.5 V | -20°C ~ 85°C (TA) | - | - | - |