Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Sensor Type | Sensing Temperature | Accuracy | Topology | Output Type | Output Alarm | Output Fan | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC TEMP SENSOR 2WIRE 8TDFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione6.176 |
|
Internal | - | ±1% | ADC, Multiplexer, Register Bank | I2C/SMBus | No | No | 1.7 V ~ 3.6 V | -20°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC TEMP SENSOR 2WIRE 3V 8-TDFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione6.528 |
|
Internal | -40°C ~ 125°C | ±3°C(Max) | ADC (Sigma Delta), Register Bank | I2C/SMBus | Yes | Yes | 3 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC TEMP SENSOR 2WIRE 3V 8-TDFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione4.624 |
|
Internal | -40°C ~ 125°C | ±3°C(Max) | ADC (Sigma Delta), Register Bank | I2C/SMBus | Yes | Yes | 3 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC TEMP SENSOR 2WIRE 3V 8-DFN
|
pacchetto: 8-VFDFN Exposed Pad |
Azione5.760 |
|
Internal | -40°C ~ 125°C | ±3°C(Max) | ADC (Sigma Delta), Register Bank | I2C/SMBus | Yes | Yes | 3 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x3) |
||
Microchip Technology |
IC MEMORY MOD TEMP SENSOR 8-DFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione39.396 |
|
Internal | -40°C ~ 125°C | ±3°C(Max) | ADC (Sigma Delta), Register Bank | I2C/SMBus | Yes | Yes | 3 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC MEMORY MOD TEMP SENSOR 8-DFN
|
pacchetto: 8-VFDFN Exposed Pad |
Azione417.360 |
|
Internal | -40°C ~ 125°C | ±3°C(Max) | ADC (Sigma Delta), Register Bank | I2C/SMBus | Yes | Yes | 3 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x3) |
||
Microchip Technology |
IC TEMP SENSOR 2WIRE 8-TDFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione5.424 |
|
Internal | -40°C ~ 125°C | ±3°C(Max) | ADC (Sigma Delta), Register Bank | I2C/SMBus | No | Yes | 3 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC TEMP SENSOR 2WIRE 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione4.128 |
|
Internal | -40°C ~ 125°C | ±3°C(Max) | ADC (Sigma Delta), Register Bank | I2C/SMBus | Yes | Yes | 3 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC TEMP SENSOR 2WIRE 8-TDFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione2.976 |
|
Internal | -40°C ~ 125°C | ±3°C(Max) | ADC (Sigma Delta), Register Bank | I2C/SMBus | Yes | Yes | 3 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC TEMP SENSOR 2WIRE 8-DFN
|
pacchetto: 8-VFDFN Exposed Pad |
Azione5.808 |
|
Internal | -40°C ~ 125°C | ±3°C(Max) | ADC (Sigma Delta), Register Bank | I2C/SMBus | Yes | Yes | 3 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x3) |
||
Microchip Technology |
IC MEMORY MOD TEMP SENSOR 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione7.200 |
|
Internal | -40°C ~ 125°C | ±3°C(Max) | ADC (Sigma Delta), Register Bank | I2C/SMBus | Yes | Yes | 3 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC MEMORY MOD TEMP SENSOR 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.136 |
|
Internal | -40°C ~ 125°C | ±3°C(Max) | ADC (Sigma Delta), Register Bank | I2C/SMBus | Yes | Yes | 3 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |