Prodotti Microchip Technology

DSC1001DL5-018.4320T

Microchip Technology

OSC MEMS 18.432MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 18.432MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±10ppm
• Operating Temperature: -40°C ~ 105°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

pacchetto: 4-SMD, No Lead

DSC1001DL1-025.2000T

Microchip Technology

OSC MEMS 25.2000MHZ LVCMOS SMD

• Type: MEMS (Silicon)
• Frequency: 25.2MHz
• Function: Standby (Power Down)
• Output: LVCMOS
• Voltage - Supply: 1.7 V ~ 3.6 V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 105°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

pacchetto: 4-SMD, No Lead

DSC6101CI2A-027.0000T

Microchip Technology

OSCILLATOR MEMS 27MHZ LVCMOS SMD

• Type: MEMS (Silicon)
• Frequency: 27MHz
• Function: Enable/Disable
• Output: CMOS
• Voltage - Supply: 1.71 V ~ 3.63 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 3mA (Typ)
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

pacchetto: 4-SMD, No Lead

MIC9130BM

Microchip Technology

IC CTRLR DC-DC PWM HV HS 16-SOIC

• Applications: Controller, Telecom
• Voltage - Input: 9 V ~ 18 V
• Number of Outputs: 1
• Voltage - Output: 4.7 V ~ 5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SOIC

pacchetto: 16-SOIC (0.154", 3.90mm Width)

TC1014-3.3VCT713

Microchip Technology

IC REG LINEAR 3.3V 50MA SOT23-5

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 6V
• Voltage - Output (Min/Fixed): 3.3V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.12V @ 50mA
• Current - Output: 50mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 80µA
• PSRR: 64dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: SOT-23-5

pacchetto: SC-74A, SOT-753

AT49F002ANT-55TI

Microchip Technology

IC FLASH 2MBIT 55NS 32TSOP

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH
• Memory Size: 2Mb (256K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 50µs
• Access Time: 55ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TC)
• Mounting Type: Surface Mount
• Package / Case: 32-TFSOP (0.724", 18.40mm Width)
• Supplier Device Package: 32-TSOP

pacchetto: 32-TFSOP (0.724", 18.40mm Width)

AT27C2048-12JC

Microchip Technology

IC OTP 2MBIT 120NS 44PLCC

• Memory Type: Non-Volatile
• Memory Format: EPROM
• Technology: EPROM - OTP
• Memory Size: 2Mb (128K x 16)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: -
• Access Time: 120ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TC)
• Mounting Type: Surface Mount
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

pacchetto: 44-LCC (J-Lead)

34VL02T/OT

Microchip Technology

IC EEPROM 2KBIT 400KHZ SOT23-6

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 2Kb (256 x 8)
• Memory Interface: I2C
• Clock Frequency: 400kHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: 900ns
• Voltage - Supply: 1.5 V ~ 3.6 V
• Operating Temperature: -20°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: SOT-23-6
• Supplier Device Package: SOT-23-6

pacchetto: SOT-23-6

MCP603-I/ST

Microchip Technology

IC OPAMP GP 2.8MHZ RRO 8TSSOP

• Amplifier Type: General Purpose
• Number of Circuits: 1
• Output Type: Rail-to-Rail
• Slew Rate: 2.3 V/µs
• Gain Bandwidth Product: 2.8MHz
• -3db Bandwidth: -
• Current - Input Bias: 1pA
• Voltage - Input Offset: 700µV
• Current - Supply: 230µA
• Current - Output / Channel: 22mA
• Voltage - Supply, Single/Dual (±): 2.7 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 8-TSSOP

pacchetto: 8-TSSOP (0.173", 4.40mm Width)

MCP6H01T-E/MNY

Microchip Technology

IC OPAMP GP 1.2MHZ RRO 8TDFN

• Amplifier Type: General Purpose
• Number of Circuits: 1
• Output Type: Rail-to-Rail
• Slew Rate: 0.8 V/µs
• Gain Bandwidth Product: 1.2MHz
• -3db Bandwidth: -
• Current - Input Bias: 10pA
• Voltage - Input Offset: 700µV
• Current - Supply: 135µA
• Current - Output / Channel: 50mA
• Voltage - Supply, Single/Dual (±): 3.5 V ~ 16 V, ±1.75 V ~ 8 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-WFDFN Exposed Pad
• Supplier Device Package: 8-TDFN (2x3)

pacchetto: 8-WFDFN Exposed Pad

AT32UC3L032-AUT

Microchip Technology

IC MCU 32BIT 32KB FLASH 48TQFP

• Core Processor: AVR
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 36
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.62 V ~ 3.6 V
• Data Converters: A/D 9x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-TQFP
• Supplier Device Package: 48-TQFP (7x7)

pacchetto: 48-TQFP

PIC18LF25K22-E/SO

Microchip Technology

IC MCU 8BIT 32KB FLASH 28SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number of I/O: 24
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 1.5K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 19x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

pacchetto: 28-SOIC (0.295", 7.50mm Width)

PIC32MX174F256BT-I/MM

Microchip Technology

IC MCU 32BIT 256KB FLASH

• Core Processor: MIPS32? M4K?
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: I2C, IrDA, LIN, PMP, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
• Number of I/O: 21
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 3.6 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-VQFN Exposed Pad
• Supplier Device Package: 28-QFN (6x6)

pacchetto: 28-VQFN Exposed Pad

PIC32MX695F512H-80V/MR

Microchip Technology

IC MCU 32BIT 512KB FLASH 64QFN

• Core Processor: MIPS32? M4K?
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: Ethernet, I2C, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN (9x9)

pacchetto: 64-VFQFN Exposed Pad

AT97SC3205-H3M4500B

Microchip Technology

PRODFF IND SPI TPM 4X4 32VQFN

• Applications: Trusted Platform Module (TPM)
• Core Processor: AVR
• Program Memory Type: -
• Controller Series: -
• RAM Size: -
• Interface: SPI
• Number of I/O: 4
• Voltage - Supply: 3.3V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-VQFN (4x4)

pacchetto: 32-VFQFN Exposed Pad

SY10H646LJC-TR

Microchip Technology

IC CLK BUFFER 2:8 160MHZ 28PLCC

• Type: Fanout Buffer (Distribution), Multiplexer
• Number of Circuits: 1
• Ratio - Input:Output: 2:8
• Differential - Input:Output: Yes/Yes
• Input: PECL, TTL
• Output: TTL
• Frequency - Max: 160MHz
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-LCC (J-Lead)
• Supplier Device Package: 28-PLCC (11.51x11.51)

pacchetto: 28-LCC (J-Lead)

MCP1316T-29EE/OTVAO

Microchip Technology

ACTIVE LOW P-P, WDI, MR

• Type: Simple Reset/Power-On Reset
• Number of Voltages Monitored: 1
• Output: Push-Pull, Totem Pole
• Reset: Active Low
• Reset Timeout: 20 ms Minimum
• Voltage - Threshold: 2.9V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: SOT-23-5

pacchetto: SC-74A, SOT-753

1N4469E3-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 15 V
• Tolerance: ±5%
• Power - Max: 1.5 W
• Impedance (Max) (Zzt): 9 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 12 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AL, DO-41, Axial
• Supplier Device Package: DO-41

pacchetto: -

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UTR3360

Microchip Technology

DIODE GEN PURP 600V 3A B AXIAL

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 600 V
• Current - Average Rectified (Io): 3A
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 3 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 400 ns
• Current - Reverse Leakage @ Vr: 5 µA @ 600 V
• Capacitance @ Vr, F: 160pF @ 0V, 1MHz
• Mounting Type: Through Hole
• Package / Case: B, Axial
• Supplier Device Package: B, Axial
• Operating Temperature - Junction: -65°C ~ 175°C

pacchetto: -

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JAN1N4496US-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 200 V
• Tolerance: ±5%
• Power - Max: 1.5 W
• Impedance (Max) (Zzt): 1500 Ohms
• Current - Reverse Leakage @ Vr: 250 nA @ 160 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, A
• Supplier Device Package: D-5A

pacchetto: -

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JANTXV1N3021DUR-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 11 V
• Tolerance: ±1%
• Power - Max: 1 W
• Impedance (Max) (Zzt): 8 Ohms
• Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
• Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
• Operating Temperature: -55°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AB, MELF (Glass)
• Supplier Device Package: DO-213AB (MELF, LL41)

pacchetto: -

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JANTXV1N3827DUR-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 5.6 V
• Tolerance: ±1%
• Power - Max: 1 W
• Impedance (Max) (Zzt): 5 Ohms
• Current - Reverse Leakage @ Vr: 3 µA @ 2 V
• Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AB, MELF (Glass)
• Supplier Device Package: DO-213AB (MELF, LL41)

pacchetto: -

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JANTXV1N4978C

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 68 V
• Tolerance: ±2%
• Power - Max: 5 W
• Impedance (Max) (Zzt): 50 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 51.7 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: E, Axial
• Supplier Device Package: E, Axial

pacchetto: -

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JAN2N6690

Microchip Technology

TRANS NPN 400V 100UA TO61

• Transistor Type: NPN
• Current - Collector (Ic) (Max): 100 µA
• Voltage - Collector Emitter Breakdown (Max): 400 V
• Vce Saturation (Max) @ Ib, Ic: 5V @ 5A, 15A
• Current - Collector Cutoff (Max): 100µA
• DC Current Gain (hFE) (Min) @ Ic, Vce: 15 @ 1A, 3V
• Power - Max: 3 W
• Frequency - Transition: -
• Operating Temperature: -65°C ~ 200°C (TA)
• Mounting Type: Stud Mount
• Package / Case: TO-211MA, TO-210AC, TO-61-4, Stud
• Supplier Device Package: TO-61

pacchetto: -

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R36120

Microchip Technology

DIODE GEN PURP 1.2KV 70A DO5

• Diode Type: Standard, Reverse Polarity
• Voltage - DC Reverse (Vr) (Max): 1200 V
• Current - Average Rectified (Io): 70A
• Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 A
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 5 µs
• Current - Reverse Leakage @ Vr: 25 µA @ 1200 V
• Capacitance @ Vr, F: -
• Mounting Type: Stud Mount
• Package / Case: DO-203AB, DO-5, Stud
• Supplier Device Package: DO-5 (DO-203AB)
• Operating Temperature - Junction: -55°C ~ 175°C

pacchetto: -

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JANTX1N5969C

Microchip Technology

DIODE ZENER 6.2V 5W E AXIAL

• Voltage - Zener (Nom) (Vz): 6.2 V
• Tolerance: ±2%
• Power - Max: 5 W
• Impedance (Max) (Zzt): 1 Ohms
• Current - Reverse Leakage @ Vr: 1 mA @ 4.74 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: E, Axial
• Supplier Device Package: E, Axial

pacchetto: -

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PIC18F46Q84T-I-PT

Microchip Technology

IC MCU 8BIT 64KB FLASH 44TQFP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 36
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 24x12b; D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

pacchetto: -

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MV31026-150A-TR

Microchip Technology

GAAS TVAR NON HERMETIC EPSM SMT

• Capacitance @ Vr, F: 10pF @ 4V, 1MHz
• Capacitance Ratio: 13.1
• Capacitance Ratio Condition: C2/C20
• Voltage - Peak Reverse (Max): 22 V
• Diode Type: Single
• Q @ Vr, F: 1500 @ 4V, 50MHz
• Operating Temperature: -55°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Chip

pacchetto: -

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