Pagina 24 - Prodotti Microsemi Corporation - Integrato - System On Chip (SoC)

Numero di parte	Produttore	Descrizione	pacchetto	Azione	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Package / Case	Supplier Device Package
A2F200M3F-FGG484I	Microsemi Corporation	IC FPGA 200K GATES 256KB 256-BGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	pacchetto: 484-BGA	Azione4.096	ARM? Cortex?-M3	256KB	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	80MHz	ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops	-40°C ~ 100°C (TJ)	484-BGA	484-FPBGA (23x23)
A2F200M3F-FG484I	Microsemi Corporation	IC FPGA 200K GATES 256KB 484-BGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	pacchetto: 484-BGA	Azione5.040	ARM? Cortex?-M3	256KB	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	80MHz	ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops	-40°C ~ 100°C (TJ)	484-BGA	484-FPBGA (23x23)
A2F060M3E-1TQG144	Microsemi Corporation	IC FPGA 60K GATES 128KB 144-TQFP Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I2C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	pacchetto: 144-LQFP	Azione3.392	ARM? Cortex?-M3	128KB	16KB	DMA, POR, WDT	EBI/EMI, I2C, SPI, UART/USART	100MHz	ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops	0°C ~ 85°C (TJ)	144-LQFP	144-TQFP (20x20)
A2F060M3E-1TQG144I	Microsemi Corporation	IC FPGA 60K GATES 128KB 144-TQFP Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I2C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	pacchetto: 144-LQFP	Azione3.152	ARM? Cortex?-M3	128KB	16KB	DMA, POR, WDT	EBI/EMI, I2C, SPI, UART/USART	100MHz	ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops	-40°C ~ 100°C (TJ)	144-LQFP	144-TQFP (20x20)
A2F060M3E-1TQ144I	Microsemi Corporation	IC FPGA 60K GATES 128KB 144-TQFP Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I2C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	pacchetto: 144-LQFP	Azione7.120	ARM? Cortex?-M3	128KB	16KB	DMA, POR, WDT	EBI/EMI, I2C, SPI, UART/USART	100MHz	ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops	-40°C ~ 100°C (TJ)	144-LQFP	144-TQFP (20x20)
A2F500M3G-PQG208	Microsemi Corporation	IC FPGA 500K GATES 512KB 208QFP Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: Ethernet, I2C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	pacchetto: 208-BFQFP	Azione3.952	ARM? Cortex?-M3	512KB	64KB	DMA, POR, WDT	Ethernet, I2C, SPI, UART/USART	80MHz	ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops	0°C ~ 85°C (TJ)	208-BFQFP	208-PQFP (28x28)
A2F200M3F-1PQG208I	Microsemi Corporation	IC FPGA 200K GATES 256KB 208QFP Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	pacchetto: 208-BFQFP	Azione2.992	ARM? Cortex?-M3	256KB	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	100MHz	ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops	-40°C ~ 100°C (TJ)	208-BFQFP	208-PQFP (28x28)
A2F200M3F-PQG208I	Microsemi Corporation	IC FPGA 200K GATES 256KB 208QFP Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	pacchetto: 208-BFQFP	Azione3.712	ARM? Cortex?-M3	256KB	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	80MHz	ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops	-40°C ~ 100°C (TJ)	208-BFQFP	208-PQFP (28x28)
A2F500M3G-1PQG208I	Microsemi Corporation	IC FPGA 500K GATES 512KB 208QFP Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: Ethernet, I2C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	pacchetto: 208-BFQFP	Azione2.528	ARM? Cortex?-M3	512KB	64KB	DMA, POR, WDT	Ethernet, I2C, SPI, UART/USART	100MHz	ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops	-40°C ~ 100°C (TJ)	208-BFQFP	208-PQFP (28x28)
A2F500M3G-1PQG208	Microsemi Corporation	IC FPGA 500K GATES 512KB 208QFP Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: Ethernet, I2C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	pacchetto: 208-BFQFP	Azione7.360	ARM? Cortex?-M3	512KB	64KB	DMA, POR, WDT	Ethernet, I2C, SPI, UART/USART	100MHz	ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops	0°C ~ 85°C (TJ)	208-BFQFP	208-PQFP (28x28)
A2F500M3G-PQG208I	Microsemi Corporation	IC FPGA 500K GATES 512KB 208QFP Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: Ethernet, I2C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	pacchetto: 208-BFQFP	Azione4.544	ARM? Cortex?-M3	512KB	64KB	DMA, POR, WDT	Ethernet, I2C, SPI, UART/USART	80MHz	ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops	-40°C ~ 100°C (TJ)	208-BFQFP	208-PQFP (28x28)
A2F500M3G-FGG256	Microsemi Corporation	IC FPGA 512K FLASH 256FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	pacchetto: 256-LBGA	Azione3.024	ARM? Cortex?-M3	512KB	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	80MHz	ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops	0°C ~ 85°C (TJ)	256-LBGA	256-FBGA (17x17)
A2F500M3G-1FGG256	Microsemi Corporation	IC FPGA 512K FLASH 256FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	pacchetto: 256-LBGA	Azione4.848	ARM? Cortex?-M3	512KB	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	100MHz	ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops	0°C ~ 85°C (TJ)	256-LBGA	256-FBGA (17x17)
A2F200M3F-FGG256	Microsemi Corporation	IC FPGA 256K FLASH 256FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	pacchetto: 256-LBGA	Azione3.664	ARM? Cortex?-M3	256KB	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	80MHz	ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops	0°C ~ 85°C (TJ)	256-LBGA	256-FBGA (17x17)
A2F200M3F-1FGG484	Microsemi Corporation	IC FPGA 256K FLASH 484FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	pacchetto: 484-BGA	Azione5.792	ARM? Cortex?-M3	256KB	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	100MHz	ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops	0°C ~ 85°C (TJ)	484-BGA	484-FPBGA (23x23)
A2F200M3F-1FGG256	Microsemi Corporation	IC FPGA 256K FLASH 256FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	pacchetto: 256-LBGA	Azione2.144	ARM? Cortex?-M3	256KB	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	100MHz	ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops	0°C ~ 85°C (TJ)	256-LBGA	256-FBGA (17x17)
A2F500M3G-1FGG484M	Microsemi Corporation	IC FPGA 500K GATES 512KB 484FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	pacchetto: 484-BGA	Azione2.144	ARM? Cortex?-M3	512KB	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	100MHz	ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops	-55°C ~ 125°C (TJ)	484-BGA	484-FPBGA (23x23)
A2F500M3G-1FG484M	Microsemi Corporation	IC FPGA 500K GATES 512KB 484FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	pacchetto: 484-BGA	Azione5.088	ARM? Cortex?-M3	512KB	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	100MHz	ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops	-55°C ~ 125°C (TJ)	484-BGA	484-FPBGA (23x23)
A2F500M3G-1FGG256M	Microsemi Corporation	IC FPGA 500K GATES 512KB 256FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	pacchetto: 256-LBGA	Azione6.384	ARM? Cortex?-M3	512KB	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	100MHz	ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops	-55°C ~ 125°C (TJ)	256-LBGA	256-FBGA (17x17)
A2F500M3G-FGG484M	Microsemi Corporation	IC FPGA 500K GATES 512KB 484FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	pacchetto: 484-BGA	Azione2.944	ARM? Cortex?-M3	512KB	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	80MHz	ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops	-55°C ~ 125°C (TJ)	484-BGA	484-FPBGA (23x23)
A2F500M3G-FG484M	Microsemi Corporation	IC FPGA 500K GATES 512KB 484FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	pacchetto: 484-BGA	Azione2.160	ARM? Cortex?-M3	512KB	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	80MHz	ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops	-55°C ~ 125°C (TJ)	484-BGA	484-FPBGA (23x23)
M2S090TS-1FGG484M	Microsemi Corporation	IC FPGA SOC 90K LUTS 484FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	pacchetto: 484-BGA	Azione5.984	ARM? Cortex?-M3	512KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	-55°C ~ 125°C (TJ)	484-BGA	484-FPBGA (23x23)
M2S090TS-1FG484M	Microsemi Corporation	IC FPGA SOC 90K LUTS 484FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	pacchetto: 484-BGA	Azione6.736	ARM? Cortex?-M3	512KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	-55°C ~ 125°C (TJ)	484-BGA	484-FPBGA (23x23)
M2S090T-1FGG484M	Microsemi Corporation	IC FPGA SOC 90K LUTS 484FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	pacchetto: 484-BGA	Azione3.040	ARM? Cortex?-M3	512KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	-55°C ~ 125°C (TJ)	484-BGA	484-FPBGA (23x23)
M2S090T-1FG484M	Microsemi Corporation	IC FPGA SOC 90K LUTS 484FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	pacchetto: 484-BGA	Azione6.896	ARM? Cortex?-M3	512KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	-55°C ~ 125°C (TJ)	484-BGA	484-FPBGA (23x23)
M2S150TS-1FCSG536I	Microsemi Corporation	IC FPGA SOC 150K LUTS Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 536-LFBGA Supplier Device Package: 536-BGA (16x16)	pacchetto: 536-LFBGA	Azione4.032	ARM? Cortex?-M3	512KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 150K Logic Modules	-40°C ~ 100°C (TJ)	536-LFBGA	536-BGA (16x16)
M2S150TS-1FCS536I	Microsemi Corporation	IC FPGA SOC 150K LUTS Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 536-LFBGA Supplier Device Package: 536-BGA (16x16)	pacchetto: 536-LFBGA	Azione5.872	ARM? Cortex?-M3	512KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 150K Logic Modules	-40°C ~ 100°C (TJ)	536-LFBGA	536-BGA (16x16)
M2S150TS-1FCG1152I	Microsemi Corporation	IC FPGA SOC 150K LUTS 1152FCBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	pacchetto: 1152-BBGA, FCBGA	Azione5.728	ARM? Cortex?-M3	512KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 150K Logic Modules	-40°C ~ 100°C (TJ)	1152-BBGA, FCBGA	1152-FCBGA (35x35)

A2F200M3F-FGG484I

Microsemi Corporation

IC FPGA 200K GATES 256KB 256-BGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)

pacchetto: 484-BGA

Azione4.096

ARM? Cortex?-M3

256KB

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

80MHz

ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops

-40°C ~ 100°C (TJ)

484-BGA

484-FPBGA (23x23)

A2F200M3F-FG484I

Microsemi Corporation

IC FPGA 200K GATES 256KB 484-BGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)

pacchetto: 484-BGA

Azione5.040

ARM? Cortex?-M3

256KB

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

80MHz

ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops

-40°C ~ 100°C (TJ)

484-BGA

484-FPBGA (23x23)

A2F060M3E-1TQG144

Microsemi Corporation

IC FPGA 60K GATES 128KB 144-TQFP

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 128KB
RAM Size: 16KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Speed: 100MHz
Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

pacchetto: 144-LQFP

Azione3.392

ARM? Cortex?-M3

128KB

16KB

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

100MHz

ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops

0°C ~ 85°C (TJ)

144-LQFP

144-TQFP (20x20)

A2F060M3E-1TQG144I

Microsemi Corporation

IC FPGA 60K GATES 128KB 144-TQFP

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 128KB
RAM Size: 16KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Speed: 100MHz
Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

pacchetto: 144-LQFP

Azione3.152

ARM? Cortex?-M3

128KB

16KB

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

100MHz

ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops

-40°C ~ 100°C (TJ)

144-LQFP

144-TQFP (20x20)

A2F060M3E-1TQ144I

Microsemi Corporation

IC FPGA 60K GATES 128KB 144-TQFP

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 128KB
RAM Size: 16KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Speed: 100MHz
Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

pacchetto: 144-LQFP

Azione7.120

ARM? Cortex?-M3

128KB

16KB

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

100MHz

ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops

-40°C ~ 100°C (TJ)

144-LQFP

144-TQFP (20x20)

A2F500M3G-PQG208

Microsemi Corporation

IC FPGA 500K GATES 512KB 208QFP

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: Ethernet, I2C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

pacchetto: 208-BFQFP

Azione3.952

ARM? Cortex?-M3

512KB

64KB

DMA, POR, WDT

Ethernet, I2C, SPI, UART/USART

80MHz

ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops

0°C ~ 85°C (TJ)

208-BFQFP

208-PQFP (28x28)

A2F200M3F-1PQG208I

Microsemi Corporation

IC FPGA 200K GATES 256KB 208QFP

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Speed: 100MHz
Primary Attributes: ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

pacchetto: 208-BFQFP

Azione2.992

ARM? Cortex?-M3

256KB

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

100MHz

ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops

-40°C ~ 100°C (TJ)

208-BFQFP

208-PQFP (28x28)

A2F200M3F-PQG208I

Microsemi Corporation

IC FPGA 200K GATES 256KB 208QFP

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

pacchetto: 208-BFQFP

Azione3.712

ARM? Cortex?-M3

256KB

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

80MHz

ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops

-40°C ~ 100°C (TJ)

208-BFQFP

208-PQFP (28x28)

A2F500M3G-1PQG208I

Microsemi Corporation

IC FPGA 500K GATES 512KB 208QFP

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: Ethernet, I2C, SPI, UART/USART
Speed: 100MHz
Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

pacchetto: 208-BFQFP

Azione2.528

ARM? Cortex?-M3

512KB

64KB

DMA, POR, WDT

Ethernet, I2C, SPI, UART/USART

100MHz

ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops

-40°C ~ 100°C (TJ)

208-BFQFP

208-PQFP (28x28)

A2F500M3G-1PQG208

Microsemi Corporation

IC FPGA 500K GATES 512KB 208QFP

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: Ethernet, I2C, SPI, UART/USART
Speed: 100MHz
Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

pacchetto: 208-BFQFP

Azione7.360

ARM? Cortex?-M3

512KB

64KB

DMA, POR, WDT

Ethernet, I2C, SPI, UART/USART

100MHz

ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops

0°C ~ 85°C (TJ)

208-BFQFP

208-PQFP (28x28)

A2F500M3G-PQG208I

Microsemi Corporation

IC FPGA 500K GATES 512KB 208QFP

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: Ethernet, I2C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

pacchetto: 208-BFQFP

Azione4.544

ARM? Cortex?-M3

512KB

64KB

DMA, POR, WDT

Ethernet, I2C, SPI, UART/USART

80MHz

ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops

-40°C ~ 100°C (TJ)

208-BFQFP

208-PQFP (28x28)

A2F500M3G-FGG256

Microsemi Corporation

IC FPGA 512K FLASH 256FBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)

pacchetto: 256-LBGA

Azione3.024

ARM? Cortex?-M3

512KB

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

80MHz

ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops

0°C ~ 85°C (TJ)

256-LBGA

256-FBGA (17x17)

A2F500M3G-1FGG256

Microsemi Corporation

IC FPGA 512K FLASH 256FBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Speed: 100MHz
Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)

pacchetto: 256-LBGA

Azione4.848

ARM? Cortex?-M3

512KB

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

100MHz

ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops

0°C ~ 85°C (TJ)

256-LBGA

256-FBGA (17x17)

A2F200M3F-FGG256

Microsemi Corporation

IC FPGA 256K FLASH 256FBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)

pacchetto: 256-LBGA

Azione3.664

ARM? Cortex?-M3

256KB

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

80MHz

ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops

0°C ~ 85°C (TJ)

256-LBGA

256-FBGA (17x17)

A2F200M3F-1FGG484

Microsemi Corporation

IC FPGA 256K FLASH 484FBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Speed: 100MHz
Primary Attributes: ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)

pacchetto: 484-BGA

Azione5.792

ARM? Cortex?-M3

256KB

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

100MHz

ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops

0°C ~ 85°C (TJ)

484-BGA

484-FPBGA (23x23)

A2F200M3F-1FGG256

Microsemi Corporation

IC FPGA 256K FLASH 256FBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Speed: 100MHz
Primary Attributes: ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)

pacchetto: 256-LBGA

Azione2.144

ARM? Cortex?-M3

256KB

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

100MHz

ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops

0°C ~ 85°C (TJ)

256-LBGA

256-FBGA (17x17)

A2F500M3G-1FGG484M

Microsemi Corporation

IC FPGA 500K GATES 512KB 484FBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Speed: 100MHz
Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature: -55°C ~ 125°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)

pacchetto: 484-BGA

Azione2.144

ARM? Cortex?-M3

512KB

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

100MHz

ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops

-55°C ~ 125°C (TJ)

484-BGA

484-FPBGA (23x23)

A2F500M3G-1FG484M

Microsemi Corporation

IC FPGA 500K GATES 512KB 484FBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Speed: 100MHz
Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature: -55°C ~ 125°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)

pacchetto: 484-BGA

Azione5.088

ARM? Cortex?-M3

512KB

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

100MHz

ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops

-55°C ~ 125°C (TJ)

484-BGA

484-FPBGA (23x23)

A2F500M3G-1FGG256M

Microsemi Corporation

IC FPGA 500K GATES 512KB 256FBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Speed: 100MHz
Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature: -55°C ~ 125°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)

pacchetto: 256-LBGA

Azione6.384

ARM? Cortex?-M3

512KB

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

100MHz

ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops

-55°C ~ 125°C (TJ)

256-LBGA

256-FBGA (17x17)

A2F500M3G-FGG484M

Microsemi Corporation

IC FPGA 500K GATES 512KB 484FBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature: -55°C ~ 125°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)

pacchetto: 484-BGA

Azione2.944

ARM? Cortex?-M3

512KB

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

80MHz

ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops

-55°C ~ 125°C (TJ)

484-BGA

484-FPBGA (23x23)

A2F500M3G-FG484M

Microsemi Corporation

IC FPGA 500K GATES 512KB 484FBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature: -55°C ~ 125°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)

pacchetto: 484-BGA

Azione2.160

ARM? Cortex?-M3

512KB

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

80MHz

ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops

-55°C ~ 125°C (TJ)

484-BGA

484-FPBGA (23x23)

M2S090TS-1FGG484M

Microsemi Corporation

IC FPGA SOC 90K LUTS 484FBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: -55°C ~ 125°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)

pacchetto: 484-BGA

Azione5.984

ARM? Cortex?-M3

512KB

64KB

DDR, PCIe, SERDES

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 90K Logic Modules

-55°C ~ 125°C (TJ)

484-BGA

484-FPBGA (23x23)

M2S090TS-1FG484M

Microsemi Corporation

IC FPGA SOC 90K LUTS 484FBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: -55°C ~ 125°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)

pacchetto: 484-BGA

Azione6.736

ARM? Cortex?-M3

512KB

64KB

DDR, PCIe, SERDES

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 90K Logic Modules

-55°C ~ 125°C (TJ)

484-BGA

484-FPBGA (23x23)

M2S090T-1FGG484M

Microsemi Corporation

IC FPGA SOC 90K LUTS 484FBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: -55°C ~ 125°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)

pacchetto: 484-BGA

Azione3.040

ARM? Cortex?-M3

512KB

64KB

DDR, PCIe, SERDES

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 90K Logic Modules

-55°C ~ 125°C (TJ)

484-BGA

484-FPBGA (23x23)

M2S090T-1FG484M

Microsemi Corporation

IC FPGA SOC 90K LUTS 484FBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 90K Logic Modules
Operating Temperature: -55°C ~ 125°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)

pacchetto: 484-BGA

Azione6.896

ARM? Cortex?-M3

512KB

64KB

DDR, PCIe, SERDES

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 90K Logic Modules

-55°C ~ 125°C (TJ)

484-BGA

484-FPBGA (23x23)

M2S150TS-1FCSG536I

Microsemi Corporation

IC FPGA SOC 150K LUTS

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 150K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 536-LFBGA
Supplier Device Package: 536-BGA (16x16)

pacchetto: 536-LFBGA

Azione4.032

ARM? Cortex?-M3

512KB

64KB

DDR, PCIe, SERDES

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 150K Logic Modules

-40°C ~ 100°C (TJ)

536-LFBGA

536-BGA (16x16)

M2S150TS-1FCS536I

Microsemi Corporation

IC FPGA SOC 150K LUTS

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 150K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 536-LFBGA
Supplier Device Package: 536-BGA (16x16)

pacchetto: 536-LFBGA

Azione5.872

ARM? Cortex?-M3

512KB

64KB

DDR, PCIe, SERDES

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 150K Logic Modules

-40°C ~ 100°C (TJ)

536-LFBGA

536-BGA (16x16)

M2S150TS-1FCG1152I

Microsemi Corporation

IC FPGA SOC 150K LUTS 1152FCBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 150K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FCBGA (35x35)

pacchetto: 1152-BBGA, FCBGA

Azione5.728

ARM? Cortex?-M3

512KB

64KB

DDR, PCIe, SERDES

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 150K Logic Modules

-40°C ~ 100°C (TJ)

1152-BBGA, FCBGA

1152-FCBGA (35x35)