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Prodotti Microsemi Corporation - Integrato - System On Chip (SoC)

Record 761
Pagina  25/28
Immagine
Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
Core Processor
Flash Size
RAM Size
Peripherals
Connectivity
Speed
Primary Attributes
Operating Temperature
Package / Case
Supplier Device Package
A2F060M3E-1CS288I
Microsemi Corporation

IC FPGA 60K GATES 128KB 288-CSP

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 16KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART
  • Speed: 100MHz
  • Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 288-TFBGA, CSPBGA
  • Supplier Device Package: 288-CSP (11x11)
pacchetto: 288-TFBGA, CSPBGA
Azione5.024
ARM? Cortex?-M3
128KB
16KB
DMA, POR, WDT
EBI/EMI, I2C, SPI, UART/USART
100MHz
ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
-40°C ~ 100°C (TJ)
288-TFBGA, CSPBGA
288-CSP (11x11)
A2F200M3F-CSG288
Microsemi Corporation

IC FPGA 200K GATES 256KB 288-CSP

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 288-TFBGA, CSPBGA
  • Supplier Device Package: 288-CSP (11x11)
pacchetto: 288-TFBGA, CSPBGA
Azione7.792
ARM? Cortex?-M3
256KB
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops
0°C ~ 85°C (TJ)
288-TFBGA, CSPBGA
288-CSP (11x11)
A2F500M3G-CSG288I
Microsemi Corporation

IC FPGA 500K GATES 512KB 288-CSP

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 288-TFBGA, CSPBGA
  • Supplier Device Package: 288-CSP (11x11)
pacchetto: 288-TFBGA, CSPBGA
Azione5.952
ARM? Cortex?-M3
512KB
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
-40°C ~ 100°C (TJ)
288-TFBGA, CSPBGA
288-CSP (11x11)
A2F060M3E-CSG288I
Microsemi Corporation

IC FPGA 60K GATES 128KB 288-CSP

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 16KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 288-TFBGA, CSPBGA
  • Supplier Device Package: 288-CSP (11x11)
pacchetto: 288-TFBGA, CSPBGA
Azione7.328
ARM? Cortex?-M3
128KB
16KB
DMA, POR, WDT
EBI/EMI, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
-40°C ~ 100°C (TJ)
288-TFBGA, CSPBGA
288-CSP (11x11)
A2F060M3E-CS288I
Microsemi Corporation

IC FPGA 60K GATES 128KB 288-CSP

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 16KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 288-TFBGA, CSPBGA
  • Supplier Device Package: 288-CSP (11x11)
pacchetto: 288-TFBGA, CSPBGA
Azione5.760
ARM? Cortex?-M3
128KB
16KB
DMA, POR, WDT
EBI/EMI, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
-40°C ~ 100°C (TJ)
288-TFBGA, CSPBGA
288-CSP (11x11)
A2F500M3G-1CS288I
Microsemi Corporation

IC FPGA 500K GATES 512KB 288-CSP

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Speed: 100MHz
  • Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 288-TFBGA, CSPBGA
  • Supplier Device Package: 288-CSP (11x11)
pacchetto: 288-TFBGA, CSPBGA
Azione7.888
ARM? Cortex?-M3
512KB
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, SPI, UART/USART
100MHz
ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
-40°C ~ 100°C (TJ)
288-TFBGA, CSPBGA
288-CSP (11x11)
A2F200M3F-1FG256I
Microsemi Corporation

IC FPGA 200K GATES 256KB 256-BGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Speed: 100MHz
  • Primary Attributes: ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FPBGA (17x17)
pacchetto: 256-LBGA
Azione3.008
ARM? Cortex?-M3
256KB
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, SPI, UART/USART
100MHz
ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops
-40°C ~ 100°C (TJ)
256-LBGA
256-FPBGA (17x17)
A2F500M3G-1FG256I
Microsemi Corporation

IC FPGA 500K GATES 512KB 256-BGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Speed: 100MHz
  • Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FPBGA (17x17)
pacchetto: 256-LBGA
Azione3.936
ARM? Cortex?-M3
512KB
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, SPI, UART/USART
100MHz
ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
-40°C ~ 100°C (TJ)
256-LBGA
256-FPBGA (17x17)
A2F500M3G-FG256I
Microsemi Corporation

IC FPGA 500K GATES 512KB 256-BGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FPBGA (17x17)
pacchetto: 256-LBGA
Azione4.624
ARM? Cortex?-M3
512KB
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
-40°C ~ 100°C (TJ)
256-LBGA
256-FPBGA (17x17)
A2F500M3G-FGG256I
Microsemi Corporation

IC FPGA 500K GATES 512KB 256-BGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FBGA (17x17)
pacchetto: 256-LBGA
Azione3.936
ARM? Cortex?-M3
512KB
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
-40°C ~ 100°C (TJ)
256-LBGA
256-FBGA (17x17)
A2F200M3F-1FGG256I
Microsemi Corporation

IC FPGA 200K GATES 256KB 256-BGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Speed: 100MHz
  • Primary Attributes: ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FBGA (17x17)
pacchetto: 256-LBGA
Azione4.176
ARM? Cortex?-M3
256KB
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, SPI, UART/USART
100MHz
ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops
-40°C ~ 100°C (TJ)
256-LBGA
256-FBGA (17x17)
A2F200M3F-1FG256
Microsemi Corporation

IC FPGA 200K GATES 256KB 256-BGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Speed: 100MHz
  • Primary Attributes: ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FPBGA (17x17)
pacchetto: 256-LBGA
Azione4.032
ARM? Cortex?-M3
256KB
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, SPI, UART/USART
100MHz
ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops
0°C ~ 85°C (TJ)
256-LBGA
256-FPBGA (17x17)
A2F200M3F-FG256I
Microsemi Corporation

IC FPGA 200K GATES 256KB 256-BGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FPBGA (17x17)
pacchetto: 256-LBGA
Azione5.424
ARM? Cortex?-M3
256KB
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops
-40°C ~ 100°C (TJ)
256-LBGA
256-FPBGA (17x17)
A2F200M3F-FG256
Microsemi Corporation

IC FPGA 200K GATES 256KB 256-BGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FPBGA (17x17)
pacchetto: 256-LBGA
Azione3.296
ARM? Cortex?-M3
256KB
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops
0°C ~ 85°C (TJ)
256-LBGA
256-FPBGA (17x17)
A2F500M3G-1FGG256I
Microsemi Corporation

IC FPGA 500K GATES 512KB 256-BGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Speed: 100MHz
  • Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FBGA (17x17)
pacchetto: 256-LBGA
Azione3.712
ARM? Cortex?-M3
512KB
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, SPI, UART/USART
100MHz
ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
-40°C ~ 100°C (TJ)
256-LBGA
256-FBGA (17x17)
A2F060M3E-1FG256
Microsemi Corporation

IC FPGA 60K GATES 128KB 256FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 16KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART
  • Speed: 100MHz
  • Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FPBGA (17x17)
pacchetto: 256-LBGA
Azione3.296
ARM? Cortex?-M3
128KB
16KB
DMA, POR, WDT
EBI/EMI, I2C, SPI, UART/USART
100MHz
ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
0°C ~ 85°C (TJ)
256-LBGA
256-FPBGA (17x17)
A2F060M3E-FGG256
Microsemi Corporation

IC FPGA 60K GATES 128KB 256FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 16KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FBGA (17x17)
pacchetto: 256-LBGA
Azione3.136
ARM? Cortex?-M3
128KB
16KB
DMA, POR, WDT
EBI/EMI, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
0°C ~ 85°C (TJ)
256-LBGA
256-FBGA (17x17)
A2F060M3E-FG256
Microsemi Corporation

IC FPGA 60K GATES 128KB 256FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 16KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FPBGA (17x17)
pacchetto: 256-LBGA
Azione7.808
ARM? Cortex?-M3
128KB
16KB
DMA, POR, WDT
EBI/EMI, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
0°C ~ 85°C (TJ)
256-LBGA
256-FPBGA (17x17)
A2F060M3E-FG256I
Microsemi Corporation

IC FPGA 60K GATES 128KB 256FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 16KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FPBGA (17x17)
pacchetto: 256-LBGA
Azione2.576
ARM? Cortex?-M3
128KB
16KB
DMA, POR, WDT
EBI/EMI, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
-40°C ~ 100°C (TJ)
256-LBGA
256-FPBGA (17x17)
A2F060M3E-1FGG256I
Microsemi Corporation

IC FPGA 60K GATES 128KB 256FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 16KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART
  • Speed: 100MHz
  • Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FBGA (17x17)
pacchetto: 256-LBGA
Azione7.296
ARM? Cortex?-M3
128KB
16KB
DMA, POR, WDT
EBI/EMI, I2C, SPI, UART/USART
100MHz
ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
-40°C ~ 100°C (TJ)
256-LBGA
256-FBGA (17x17)
A2F060M3E-FGG256I
Microsemi Corporation

IC FPGA 60K GATES 128KB 256FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 16KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FBGA (17x17)
pacchetto: 256-LBGA
Azione5.408
ARM? Cortex?-M3
128KB
16KB
DMA, POR, WDT
EBI/EMI, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
-40°C ~ 100°C (TJ)
256-LBGA
256-FBGA (17x17)
A2F060M3E-1FG256I
Microsemi Corporation

IC FPGA 60K GATES 128KB 256FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 16KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART
  • Speed: 100MHz
  • Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FPBGA (17x17)
pacchetto: 256-LBGA
Azione2.528
ARM? Cortex?-M3
128KB
16KB
DMA, POR, WDT
EBI/EMI, I2C, SPI, UART/USART
100MHz
ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
-40°C ~ 100°C (TJ)
256-LBGA
256-FPBGA (17x17)
A2F060M3E-1FGG256
Microsemi Corporation

IC FPGA 60K GATES 128KB 256FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 16KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART
  • Speed: 100MHz
  • Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FBGA (17x17)
pacchetto: 256-LBGA
Azione4.848
ARM? Cortex?-M3
128KB
16KB
DMA, POR, WDT
EBI/EMI, I2C, SPI, UART/USART
100MHz
ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
0°C ~ 85°C (TJ)
256-LBGA
256-FBGA (17x17)
A2F060M3E-TQ144I
Microsemi Corporation

IC FPGA 60K GATES 128KB 144-TQFP

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 16KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
pacchetto: 144-LQFP
Azione7.104
ARM? Cortex?-M3
128KB
16KB
DMA, POR, WDT
EBI/EMI, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
-40°C ~ 100°C (TJ)
144-LQFP
144-TQFP (20x20)
A2F060M3E-1TQ144
Microsemi Corporation

IC FPGA 60K GATES 128KB 144-TQFP

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 16KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART
  • Speed: 100MHz
  • Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
pacchetto: 144-LQFP
Azione6.336
ARM? Cortex?-M3
128KB
16KB
DMA, POR, WDT
EBI/EMI, I2C, SPI, UART/USART
100MHz
ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
0°C ~ 85°C (TJ)
144-LQFP
144-TQFP (20x20)
A2F060M3E-TQG144I
Microsemi Corporation

IC FPGA 60K GATES 128KB 144-TQFP

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 16KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
pacchetto: 144-LQFP
Azione5.536
ARM? Cortex?-M3
128KB
16KB
DMA, POR, WDT
EBI/EMI, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
-40°C ~ 100°C (TJ)
144-LQFP
144-TQFP (20x20)
A2F060M3E-TQ144
Microsemi Corporation

IC FPGA 60K GATES 128KB 144-TQFP

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 16KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
pacchetto: 144-LQFP
Azione2.224
ARM? Cortex?-M3
128KB
16KB
DMA, POR, WDT
EBI/EMI, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
0°C ~ 85°C (TJ)
144-LQFP
144-TQFP (20x20)
A2F060M3E-TQG144
Microsemi Corporation

IC FPGA 60K GATES 128KB 144-TQFP

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 16KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART
  • Speed: 80MHz
  • Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
pacchetto: 144-LQFP
Azione6.272
ARM? Cortex?-M3
128KB
16KB
DMA, POR, WDT
EBI/EMI, I2C, SPI, UART/USART
80MHz
ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
0°C ~ 85°C (TJ)
144-LQFP
144-TQFP (20x20)