Prodotti NXP

BFR31,235

NXP

JFET N-CH 10MA 250MW SOT23

• FET Type: N-Channel
• Voltage - Breakdown (V(BR)GSS): -
• Drain to Source Voltage (Vdss): 25V
• Current - Drain (Idss) @ Vds (Vgs=0): 1mA @ 10V
• Current Drain (Id) - Max: 10mA
• Voltage - Cutoff (VGS off) @ Id: 2.5V @ 0.5nA
• Input Capacitance (Ciss) (Max) @ Vds: 4pF @ 10V
• Resistance - RDS(On): -
• Power - Max: 250mW
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SOT-23 (TO-236AB)

pacchetto: TO-236-3, SC-59, SOT-23-3

NX3008NBKT,115

NXP

MOSFET N-CH 30V SC-75

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 30V
• Current - Continuous Drain (Id) @ 25°C: 350mA (Ta)
• Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
• Vgs(th) (Max) @ Id: 1.1V @ 250µA
• Gate Charge (Qg) (Max) @ Vgs: 0.68nC @ 4.5V
• Input Capacitance (Ciss) (Max) @ Vds: 50pF @ 15V
• Vgs (Max): ±8V
• FET Feature: -
• Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
• Rds On (Max) @ Id, Vgs: 1.4 Ohm @ 350mA, 4.5V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: SC-75
• Package / Case: SC-75, SOT-416

pacchetto: SC-75, SOT-416

BUK962R1-40E,118

NXP

MOSFET N-CH 40V 120A D2PAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 40V
• Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
• Vgs(th) (Max) @ Id: 2.1V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 87.8nC @ 5V
• Input Capacitance (Ciss) (Max) @ Vds: 13160pF @ 25V
• Vgs (Max): ±10V
• FET Feature: -
• Power Dissipation (Max): 293W (Tc)
• Rds On (Max) @ Id, Vgs: 1.8 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: D2PAK
• Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

pacchetto: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

BLF6G24-180PN,112

NXP

TRANSISTOR PWR LDMOS SOT539A

• Transistor Type: LDMOS
• Frequency: 2GHz ~ 2.2GHz
• Gain: 17.5dB
• Voltage - Test: -
• Current Rating: -
• Noise Figure: -
• Current - Test: -
• Power - Output: 50W
• Voltage - Rated: -
• Package / Case: SOT539A
• Supplier Device Package: SOT539A

pacchetto: SOT539A

MRFE6S9060NR1

NXP

FET RF 66V 880MHZ TO270-2

• Transistor Type: LDMOS
• Frequency: 880MHz
• Gain: 21.1dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 450mA
• Power - Output: 14W
• Voltage - Rated: 66V
• Package / Case: TO-270AA
• Supplier Device Package: TO-270-2

pacchetto: TO-270AA

MCM69C432TQ20

NXP

IC CAM 1MBIT 50MHZ 100TQFP

• Memory Type: Volatile
• Memory Format: RAM
• Technology: CAM
• Memory Size: 1Mb (16K x 64)
• Memory Interface: Parallel
• Clock Frequency: 50MHz
• Write Cycle Time - Word, Page: -
• Access Time: -
• Voltage - Supply: 3.135 V ~ 3.465 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-TQFP (14x20)

pacchetto: 100-LQFP

SSTUB32865ET/G,518

NXP

IC REG BUFFER 28BIT 160TFBGA

• Logic Type: 1:2 Registered Buffer with Parity
• Supply Voltage: 1.7 V ~ 2 V
• Number of Bits: 28
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 160-TFBGA
• Supplier Device Package: 160-TFBGA (9x13)

pacchetto: 160-TFBGA

N74F640D,602

NXP

IC TRANSCVR 3ST 8BIT INV 20SOIC

• Logic Type: Buffer, Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 3mA, 24mA; 15mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SO

pacchetto: 20-SOIC (0.295", 7.50mm Width)

TDA8024T/C1,118

NXP

IC SMART CARD INTERFACE 28-SOIC

• Applications: -
• Interface: Analog
• Voltage - Supply: 2.7 V ~ 6.5 V
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SO
• Mounting Type: Surface Mount

pacchetto: 28-SOIC (0.295", 7.50mm Width)

MPC745CPX350LE

NXP

IC MPU MPC7XX 350MHZ 255FCBGA

• Core Processor: PowerPC
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 350MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 255-BBGA, FCBGA
• Supplier Device Package: 255-FCPBGA (21x21)

pacchetto: 255-BBGA, FCBGA

KMPC8347ECVRAGDB

NXP

IC MPU MPC83XX 266MHZ 620BGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 620-BBGA Exposed Pad
• Supplier Device Package: 620-PBGA (29x29)

pacchetto: 620-BBGA Exposed Pad

MPC880CZP66

NXP

IC MPU MPC8XX 66MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (2), 10/100 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 100°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

pacchetto: 357-BBGA

MCIMX6Q4AVT10AC

NXP

IC MPU I.MX6Q 1.0GHZ 624FCBGA

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 4 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (1)
• SATA: SATA 3Gbps (1)
• USB: USB 2.0 + PHY (4)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 624-FBGA, FCBGA
• Supplier Device Package: 624-FCBGA (21x21)

pacchetto: 624-FBGA, FCBGA

MC9S12GC96VPBE

NXP

IC MCU 16BIT 96KB FLASH 52LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 52-LQFP
• Supplier Device Package: 52-LQFP (10x10)

pacchetto: 52-LQFP

P89LPC9321FN,112

NXP

IC MCU 8BIT 8KB FLASH 28DIP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 18MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 26
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 768 x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.600", 15.24mm)
• Supplier Device Package: 28-DIP

pacchetto: 28-DIP (0.600", 15.24mm)

MC9S12DT256MFUE

NXP

IC MCU 16BIT 256KB FLASH 80QFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 59
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

pacchetto: 80-QFP

TFF11092HN/N1

NXP

IC FREQUENCY GENERATOR 24HVQFN

• PLL: Yes
• Main Purpose: Ku band VSAT applications
• Input: Clock
• Output: Clock
• Number of Circuits: 1
• Ratio - Input:Output: 1:4
• Differential - Input:Output: Yes/No
• Frequency - Max: 9.22GHz
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-HVQFN (4x4)

pacchetto: 24-VFQFN Exposed Pad

MPX2202ASX

NXP

SENSOR ABS PRESS 29PSI MAX

• Pressure Type: Absolute
• Operating Pressure: 29.01 PSI (200 kPa)
• Output Type: Wheatstone Bridge
• Output: 0 mV ~ 40 mV (10V)
• Accuracy: -
• Voltage - Supply: 10 V ~ 16 V
• Port Size: Male - 0.19" (4.93mm) Tube
• Port Style: Barbed
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 58.02 PSI (400 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 4-SIP Module
• Supplier Device Package: -

pacchetto: 4-SIP Module

HT2DC20S20/F/RSP

NXP

RFID HITAG STICK TRANSP 125KHZ

• Style: Encapsulated
• Technology: Passive
• Frequency: 125kHz
• Memory Type: Read/Write
• Writable Memory: 256b (User)
• Standards: ISO 11784, ISO 11785
• Operating Temperature: -40°C ~ 85°C
• Size / Dimension: 11.90mm x 5.90mm x 2.90mm

pacchetto: -

BGA7351,115

NXP

IC AMP VGA 32-HVQFN

• Frequency: 50MHz ~ 500MHz
• P1dB: 15.8dBm
• Gain: 21.5dB
• Noise Figure: 6dB
• RF Type: General Purpose
• Voltage - Supply: 4.75 V ~ 5.25 V
• Current - Supply: 280mA
• Test Frequency: 250MHz
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

pacchetto: 32-VFQFN Exposed Pad

MKV30F64VLF10

NXP

KINETIS KV30: 100MHZ CORTEX-M4F

• Core Processor: ARM® Cortex®-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: DMA, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 2x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

pacchetto: 48-LQFP

S912ZVMC12F2VKH

NXP

IC MCU 16BIT FLASH

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 31
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
• Data Converters: A/D 9x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP Exposed Pad
• Supplier Device Package: 64-LQFP-EP (10x10)

pacchetto: 64-LQFP Exposed Pad

S9S08RNA16W2MTJR

NXP

8-BIT MCU S08 CORE 16KB FLASH

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

pacchetto: 20-TSSOP (0.173", 4.40mm Width)

SPC5634MF1MLU80

NXP

IC MCU 32BIT 1.5MB FLASH 176LQFP

• Core Processor: e200z3
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 114
• Program Memory Size: 1.5MB (1.5M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 94K x 8
• Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
• Data Converters: A/D 34x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 176-LQFP
• Supplier Device Package: 176-LQFP (24x24)

pacchetto: 176-LQFP

FS32K146HFT0MMHR

NXP

IC MCU 32BIT 1MB FLASH 100MAPBGA

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit Single-Core
• Speed: 80MHz
• Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 89
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 24x12b SAR; D/A1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LFBGA
• Supplier Device Package: 100-MAPBGA (11x11)

pacchetto: -

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FC32K146HFT0MLLT

NXP

S32K144 32-BIT MCU, ARM CORTEX-M

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

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TJA1442AT-0Z

NXP

IC TRANSCEIVER HALF 1/1 8SO

• Type: Transceiver
• Protocol: CANbus
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 50 mV
• Data Rate: 5Mbps
• Voltage - Supply: 4.5V ~ 5.5V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

pacchetto: -

MFS2621AMBA0ADR2

NXP

AUTO SBC

• Applications: -
• Current - Supply: 30µA
• Voltage - Supply: 3.2V ~ 40V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

pacchetto: -

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