Infineon Introduces AIROC CYW20820 Bluetooth and Bluetooth Low Energy System-on-Chip | Heisener Electronics
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Infineon Introduces AIROC CYW20820 Bluetooth and Bluetooth Low Energy System-on-Chip

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Data di Pubblicazione: 2022-06-20, Infineon Technologies

    Infineon Technologies AG will launch the AIROC CYW20820 Bluetooth and Bluetooth Low Energy System-on-Chip (SoC) to further expand its AIROC Bluetooth lineup. AIROC CYW20820 Bluetooth and Bluetooth Low Energy System-on-Chip, designed for IoT applications, complies with the Bluetooth 5.2 core specification. It supports home automation and a wide range of sensor application scenarios, including medical, home, security, industrial, lighting, Bluetooth mesh networking, and other IoT applications that require Bluetooth low energy or dual-mode Bluetooth connectivity.

     The AIROC CYW20820 Bluetooth and Bluetooth Low Energy SoC provides reliable connectivity with extremely low power consumption, while its built-in ARM® Cortex®-M4 microcontroller with floating-point unit enables high-performance computing. It is a highly integrated device with multiple digital interfaces, optimized memory subsystem and power amplifier, etc., and can provide up to 11.5 dBm transmit output in low power (LE) and basic rate (BR) modes power, thereby reducing the size of the device and the costs associated with deploying a Bluetooth solution.

     Infineon has also added three new modules, including onboard crystal oscillators, passive devices and the AIROC CYW20820 system-on-chip, further enriching its AIROC Bluetooth module offering. These highly integrated modules are globally certified to help customers bring IoT devices to market quickly. AIROC CYBT-243053-02, CYBT-253059-02 and CYBT-243068-02 modules are all supported by ModusToolbox™ software and tools, with code examples to help customers quickly develop Bluetooth applications.

     Sonal Chandrasekharan, Vice President of the Bluetooth Product Line at Infineon Technologies, said: "The AIROC CYW20820 Bluetooth, Bluetooth Low Energy system-on-chip and modules are a very important addition to our existing product portfolio. Together they provide a low-power cost-effective and scalable solutions. These certified AIROC modules from Infineon can be used in key aspects of the Bluetooth device design process to help customers bring their products to market quickly.”

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