Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Mounting Type | Connector/Contact Type | Number of Positions | Pitch | Termination | FFC, FCB Thickness | Height Above Board | Locking Feature | Cable End Type | Contact Material | Contact Finish | Housing Material | Actuator Material | Features | Voltage Rating | Operating Temperature | Material Flammability Rating |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
JAE Electronics |
CONN FPC BOTTOM 16POS 0.50MM R/A
|
pacchetto: - |
Azione3.132 |
|
Surface Mount, Right Angle | Contacts, Bottom | 16 | 0.020" (0.50mm) | Solder | 0.30mm | 0.057" (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 64POS 0.50MM R/A
|
pacchetto: - |
Azione4.392 |
|
Surface Mount, Right Angle | Contacts, Bottom | 64 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Rotary Lock | Straight | Copper Alloy | Gold | Liquid Crystal Polymer (LCP) | Polyamide (PA), Nylon, Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | - |
||
JAE Electronics |
CONN FPC BOTTOM 15POS 0.50MM R/A
|
pacchetto: - |
Azione6.840 |
|
Surface Mount, Right Angle | Contacts, Bottom | 15 | 0.020" (0.50mm) | Solder | 0.30mm | 0.057" (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 15POS 0.30MM R/A
|
pacchetto: - |
Azione7.596 |
|
Surface Mount, Right Angle | Contacts, Bottom | 15 | 0.012" (0.30mm) | Solder | 0.15mm | 0.047" (1.20mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 45POS 0.30MM R/A
|
pacchetto: - |
Azione5.706 |
|
Surface Mount, Right Angle | Contacts, Bottom | 45 | 0.012" (0.30mm) | Solder | 0.20mm | 0.075" (1.90mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC TOP 23POS 0.30MM R/A
|
pacchetto: - |
Azione7.056 |
|
Surface Mount, Right Angle | Contacts, Top | 23 | 0.012" (0.30mm) | Solder | 0.20mm | 0.047" (1.20mm) | Rotary Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 29POS 0.30MM R/A
|
pacchetto: - |
Azione3.294 |
|
Surface Mount, Right Angle | Contacts, Bottom | 29 | 0.012" (0.30mm) | Solder | 0.15mm | 0.047" (1.20mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 27POS 0.30MM R/A
|
pacchetto: - |
Azione3.510 |
|
Surface Mount, Right Angle | Contacts, Bottom | 27 | 0.012" (0.30mm) | Solder | 0.15mm | 0.047" (1.20mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 25POS 0.30MM R/A
|
pacchetto: - |
Azione2.088 |
|
Surface Mount, Right Angle | Contacts, Bottom | 25 | 0.012" (0.30mm) | Solder | 0.15mm | 0.047" (1.20mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 18POS 0.50MM R/A
|
pacchetto: - |
Azione3.384 |
|
Surface Mount, Right Angle | Contacts, Bottom | 18 | 0.020" (0.50mm) | Solder | 0.30mm | 0.057" (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 60POS 0.50MM R/A
|
pacchetto: - |
Azione7.668 |
|
Surface Mount, Right Angle | Contacts, Bottom | 60 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Rotary Lock | Straight | Copper Alloy | Gold | Liquid Crystal Polymer (LCP) | Polyamide (PA), Nylon, Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | - |
||
JAE Electronics |
CONN FPC BOTTOM 6POS 0.50MM R/A
|
pacchetto: - |
Azione5.058 |
|
Surface Mount, Right Angle | Contacts, Bottom | 6 | 0.020" (0.50mm) | Solder | 0.30mm | 0.057" (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 81POS 0.20MM R/A
|
pacchetto: - |
Azione5.220 |
|
Surface Mount, Right Angle | Contacts, Bottom | 81 | 0.008" (0.20mm) | Solder | 0.15mm | 0.039" (1.00mm) | Flip Lock | Tabbed | Copper Alloy | Gold | Plastic | Plastic | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 21POS 0.30MM R/A
|
pacchetto: - |
Azione3.042 |
|
Surface Mount, Right Angle | Contacts, Bottom | 21 | 0.012" (0.30mm) | Solder | 0.15mm | 0.047" (1.20mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 17POS 0.30MM R/A
|
pacchetto: - |
Azione8.892 |
|
Surface Mount, Right Angle | Contacts, Bottom | 17 | 0.012" (0.30mm) | Solder | 0.15mm | 0.047" (1.20mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 15POS 0.30MM R/A
|
pacchetto: - |
Azione5.292 |
|
Surface Mount, Right Angle | Contacts, Bottom | 15 | 0.012" (0.30mm) | Solder | 0.15mm | 0.047" (1.20mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 8POS 0.50MM SMD
|
pacchetto: - |
Azione8.028 |
|
Board Edge, Cutout | Contacts, Bottom | 8 | 0.020" (0.50mm) | Solder | 0.30mm | - | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FFC 0.5MM 51POS
|
pacchetto: - |
Azione5.706 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 51 | 0.020" (0.50mm) | Solder | 0.30mm | 0.083" (2.10mm) | Flip Lock | Notched | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention | - | -40°C ~ 85°C | - |
||
JAE Electronics |
CONN FPC BOTTOM 50POS 0.50MM R/A
|
pacchetto: - |
Azione7.740 |
|
Surface Mount, Right Angle | Contacts, Bottom | 13 | 0.012" (0.30mm) | Solder | 0.20mm | 0.036" (0.90mm) | Flip Lock | Tabbed or Tapered | Phosphor Bronze | Gold | Plastic | Plastic | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | - |
||
JAE Electronics |
CONN FFC 0.5MM 41POS
|
pacchetto: - |
Azione6.858 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 41 | 0.020" (0.50mm) | Solder | 0.30mm | 0.083" (2.10mm) | Flip Lock | Notched | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention | - | -40°C ~ 85°C | - |
||
JAE Electronics |
CONN FPC BOTTOM 61POS 0.30MM R/A
|
pacchetto: - |
Azione7.254 |
|
Surface Mount, Right Angle | Contacts, Bottom | 61 | 0.012" (0.30mm) | Solder | 0.20mm | 0.036" (0.90mm) | Flip Lock | Tabbed or Tapered | Phosphor Bronze | Gold | Plastic | Plastic | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | - |
||
JAE Electronics |
CONN FPC 41POS 0.20MM R/A
|
pacchetto: - |
Azione7.218 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 41 | 0.008" (0.20mm) | Solder | 0.20mm | 0.032" (0.81mm) | Flip Lock, Backlock | Tabbed or Tapered | Phosphor Bronze | Gold | Plastic | Plastic | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | - |
||
JAE Electronics |
CONN FPC BOTTOM 51POS 0.30MM R/A
|
pacchetto: - |
Azione5.220 |
|
Surface Mount, Right Angle | Contacts, Bottom | 51 | 0.012" (0.30mm) | Solder | 0.20mm | 0.036" (0.90mm) | Flip Lock | Tabbed or Tapered | Phosphor Bronze | Gold | Plastic | Plastic | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | - |
||
JAE Electronics |
CONN FPC BOTTOM 30POS 0.50MM R/A
|
pacchetto: - |
Azione2.016 |
|
Surface Mount, Right Angle | Contacts, Bottom | 30 | 0.020" (0.50mm) | Solder | 0.30mm | 0.057" (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BTM 33POS 0.3MM SMD R/A
|
pacchetto: - |
Azione4.626 |
|
Surface Mount, Right Angle | Contacts, Bottom | 33 | 0.012" (0.30mm) | Solder | 0.20mm | 0.035" (0.88mm) | Flip Lock | Tabbed or Tapered | Phosphor Bronze | Gold | Plastic | Plastic | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | - |
||
JAE Electronics |
CONN FPC BTM 41POS 0.3MM SMD R/A
|
pacchetto: - |
Azione2.016 |
|
Surface Mount, Right Angle | Contacts, Bottom | 41 | 0.012" (0.30mm) | Solder | 0.20mm | 0.035" (0.88mm) | Flip Lock | Tabbed or Tapered | Phosphor Bronze | Gold | Plastic | Plastic | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | - |
||
JAE Electronics |
CONN FPC BOTTOM 24POS 0.50MM R/A
|
pacchetto: - |
Azione4.194 |
|
Surface Mount, Right Angle | Contacts, Bottom | 24 | 0.020" (0.50mm) | Solder | 0.30mm | 0.057" (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 21POS 0.30MM R/A
|
pacchetto: - |
Azione8.478 |
|
Surface Mount, Right Angle | Contacts, Bottom | 21 | 0.012" (0.30mm) | Solder | 0.12mm | 0.047" (1.20mm) | Flip Lock | Straight | Copper Alloy | Gold | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BTM 31POS 0.3MM SMD R/A
|
pacchetto: - |
Azione8.424 |
|
Surface Mount, Right Angle | Contacts, Bottom | 31 | 0.012" (0.30mm) | Solder | 0.20mm | 0.035" (0.88mm) | Flip Lock | Tabbed or Tapered | Phosphor Bronze | Gold | Plastic | Plastic | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | - |
||
JAE Electronics |
CONN FPC BOTTOM 41POS 0.30MM R/A
|
pacchetto: - |
Azione7.848 |
|
Surface Mount, Right Angle | Contacts, Bottom | 41 | 0.012" (0.30mm) | Solder | 0.20mm | 0.036" (0.90mm) | Flip Lock | Tabbed or Tapered | Phosphor Bronze | Gold | Plastic | Plastic | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | - |