Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Mounting Type | Connector/Contact Type | Number of Positions | Pitch | Termination | FFC, FCB Thickness | Height Above Board | Locking Feature | Cable End Type | Contact Material | Contact Finish | Housing Material | Actuator Material | Features | Voltage Rating | Operating Temperature | Material Flammability Rating |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
JAE Electronics |
CONN FPC TOP 31POS 0.30MM R/A
|
pacchetto: - |
Azione8.766 |
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Surface Mount, Right Angle | Contacts, Top | 31 | 0.012" (0.30mm) | Solder | 0.20mm | 0.047" (1.20mm) | Rotary Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 27POS 0.30MM R/A
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pacchetto: - |
Azione8.622 |
|
Surface Mount, Right Angle | Contacts, Bottom | 27 | 0.012" (0.30mm) | Solder | 0.12mm | 0.036" (0.90mm) | Flip Lock | Straight | Copper Alloy | Gold | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC 33POS 0.2MM
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pacchetto: - |
Azione2.736 |
|
Surface Mount, Right Angle | Contacts, Bottom | 33 | 0.079" (2.00mm) | Solder | 0.20mm | 0.047" (1.20mm) | Rotary Lock | Tapered | Copper Alloy | Gold | Synthetic Resin | Synthetic Resin | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 40POS 0.50MM R/A
|
pacchetto: - |
Azione6.138 |
|
Surface Mount, Right Angle | Contacts, Bottom | 40 | 0.020" (0.50mm) | Solder | 0.30mm | 0.057" (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 25POS 0.30MM R/A
|
pacchetto: - |
Azione7.632 |
|
Surface Mount, Right Angle | Contacts, Bottom | 25 | 0.012" (0.30mm) | Solder | 0.20mm | 0.075" (1.90mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 33POS 0.30MM R/A
|
pacchetto: - |
Azione5.256 |
|
Surface Mount, Right Angle | Contacts, Bottom | 33 | 0.012" (0.30mm) | Solder | 0.15mm | 0.047" (1.20mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 25POS 0.30MM R/A
|
pacchetto: - |
Azione4.248 |
|
Surface Mount, Right Angle | Contacts, Bottom | 25 | 0.012" (0.30mm) | Solder | 0.12mm | 0.036" (0.90mm) | Flip Lock | Straight | Copper Alloy | Gold | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC TOP 39POS 0.30MM R/A
|
pacchetto: - |
Azione8.874 |
|
Surface Mount, Right Angle | Contacts, Top | 39 | 0.012" (0.30mm) | Solder | 0.20mm | 0.047" (1.20mm) | Rotary Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC TOP 17POS 0.30MM R/A
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pacchetto: - |
Azione6.102 |
|
Surface Mount, Right Angle | Contacts, Top | 17 | 0.012" (0.30mm) | Solder | 0.20mm | 0.047" (1.20mm) | Rotary Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 29POS 0.30MM R/A
|
pacchetto: - |
Azione5.508 |
|
Surface Mount, Right Angle | Contacts, Bottom | 29 | 0.012" (0.30mm) | Solder | 0.15mm | 0.047" (1.20mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 26POS 0.50MM R/A
|
pacchetto: - |
Azione2.286 |
|
Surface Mount, Right Angle | Contacts, Bottom | 26 | 0.020" (0.50mm) | Solder | 0.30mm | 0.057" (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 36POS 0.50MM R/A
|
pacchetto: - |
Azione4.320 |
|
Surface Mount, Right Angle | Contacts, Bottom | 36 | 0.020" (0.50mm) | Solder | 0.30mm | 0.057" (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 50POS 0.50MM SMD
|
pacchetto: - |
Azione8.370 |
|
Board Edge, Cutout | Contacts, Bottom | 50 | 0.020" (0.50mm) | Solder | 0.30mm | - | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC TOP 23POS 0.30MM R/A
|
pacchetto: - |
Azione8.802 |
|
Surface Mount, Right Angle | Contacts, Top | 23 | 0.012" (0.30mm) | Solder | 0.20mm | 0.047" (1.20mm) | Rotary Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 27POS 0.30MM R/A
|
pacchetto: - |
Azione8.622 |
|
Surface Mount, Right Angle | Contacts, Bottom | 27 | 0.012" (0.30mm) | Solder | 0.15mm | 0.047" (1.20mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 25POS 0.30MM R/A
|
pacchetto: - |
Azione2.232 |
|
Surface Mount, Right Angle | Contacts, Bottom | 25 | 0.012" (0.30mm) | Solder | 0.15mm | 0.047" (1.20mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 57POS 0.30MM R/A
|
pacchetto: - |
Azione5.832 |
|
Surface Mount, Right Angle | Contacts, Bottom | 57 | 0.012" (0.30mm) | Solder | 0.15mm | 0.047" (1.20mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC TOP 33POS 0.30MM R/A
|
pacchetto: - |
Azione8.856 |
|
Surface Mount, Right Angle | Contacts, Top | 33 | 0.012" (0.30mm) | Solder | 0.20mm | 0.047" (1.20mm) | Rotary Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 59POS 0.30MM R/A
|
pacchetto: - |
Azione6.822 |
|
Surface Mount, Right Angle | Contacts, Bottom | 59 | 0.012" (0.30mm) | Solder | 0.15mm | 0.047" (1.20mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 17POS 0.30MM R/A
|
pacchetto: - |
Azione6.480 |
|
Surface Mount, Right Angle | Contacts, Bottom | 17 | 0.012" (0.30mm) | Solder | 0.12mm | 0.036" (0.90mm) | Flip Lock | Straight | Copper Alloy | Gold | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 51POS 0.30MM R/A
|
pacchetto: - |
Azione7.758 |
|
Surface Mount, Right Angle | Contacts, Bottom | 51 | 0.012" (0.30mm) | Solder | 0.15mm | 0.047" (1.20mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 53POS 0.30MM R/A
|
pacchetto: - |
Azione6.984 |
|
Surface Mount, Right Angle | Contacts, Bottom | 53 | 0.012" (0.30mm) | Solder | 0.15mm | 0.047" (1.20mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC TOP 31POS 0.30MM R/A
|
pacchetto: - |
Azione4.806 |
|
Surface Mount, Right Angle | Contacts, Top | 31 | 0.012" (0.30mm) | Solder | 0.20mm | 0.047" (1.20mm) | Rotary Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 21POS 0.30MM R/A
|
pacchetto: - |
Azione7.758 |
|
Surface Mount, Right Angle | Contacts, Bottom | 21 | 0.012" (0.30mm) | Solder | 0.15mm | 0.047" (1.20mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC TOP 45POS 0.30MM R/A
|
pacchetto: - |
Azione3.474 |
|
Surface Mount, Right Angle | Contacts, Top | 45 | 0.012" (0.30mm) | Solder | 0.20mm | 0.047" (1.20mm) | Rotary Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 17POS 0.30MM R/A
|
pacchetto: - |
Azione7.308 |
|
Surface Mount, Right Angle | Contacts, Bottom | 17 | 0.012" (0.30mm) | Solder | 0.15mm | 0.047" (1.20mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 45POS 0.30MM R/A
|
pacchetto: - |
Azione2.100 |
|
Surface Mount, Right Angle | Contacts, Bottom | 45 | 0.012" (0.30mm) | Solder | 0.15mm | 0.047" (1.20mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 20POS 0.50MM R/A
|
pacchetto: - |
Azione7.020 |
|
Surface Mount, Right Angle | Contacts, Bottom | 20 | 0.020" (0.50mm) | Solder | 0.30mm | 0.057" (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 39POS 0.30MM R/A
|
pacchetto: - |
Azione7.992 |
|
Surface Mount, Right Angle | Contacts, Bottom | 39 | 0.012" (0.30mm) | Solder | 0.15mm | 0.047" (1.20mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 15POS 0.30MM R/A
|
pacchetto: - |
Azione6.678 |
|
Surface Mount, Right Angle | Contacts, Bottom | 15 | 0.012" (0.30mm) | Solder | 0.12mm | 0.036" (0.90mm) | Flip Lock | Straight | Copper Alloy | Gold | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |