Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Mounting Type | Connector/Contact Type | Number of Positions | Pitch | Termination | FFC, FCB Thickness | Height Above Board | Locking Feature | Cable End Type | Contact Material | Contact Finish | Housing Material | Actuator Material | Features | Voltage Rating | Operating Temperature | Material Flammability Rating |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
JAE Electronics |
CONN FPC BOTTOM 50POS 0.50MM R/A
|
pacchetto: - |
Azione6.372 |
|
Surface Mount, Right Angle | Contacts, Bottom | 50 | 0.020" (0.50mm) | Solder | 0.30mm | 0.057" (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC TOP 39POS 0.30MM R/A
|
pacchetto: - |
Azione6.498 |
|
Surface Mount, Right Angle | Contacts, Top | 39 | 0.012" (0.30mm) | Solder | 0.20mm | 0.047" (1.20mm) | Rotary Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 10POS 0.50MM R/A
|
pacchetto: - |
Azione2.538 |
|
Surface Mount, Right Angle | Contacts, Bottom | 10 | 0.020" (0.50mm) | Solder | 0.30mm | 0.057" (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC 51POS 0.2MM
|
pacchetto: - |
Azione4.968 |
|
Surface Mount, Right Angle | Contacts, Bottom | 51 | 0.079" (2.00mm) | Solder | 0.20mm | 0.047" (1.20mm) | Rotary Lock | Tapered | Copper Alloy | Gold | Synthetic Resin | Synthetic Resin | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 68POS 0.50MM R/A
|
pacchetto: - |
Azione8.550 |
|
Surface Mount, Right Angle | Contacts, Bottom | 68 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Rotary Lock | Straight | Copper Alloy | Gold | Liquid Crystal Polymer (LCP) | Polyamide (PA), Nylon, Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | - |
||
JAE Electronics |
CONN FPC BOTTOM 41POS 0.20MM R/A
|
pacchetto: - |
Azione6.678 |
|
Surface Mount, Right Angle | Contacts, Bottom | 41 | 0.008" (0.20mm) | Solder | 0.15mm | 0.039" (1.00mm) | Flip Lock | Tabbed | Copper Alloy | Gold | Plastic | Plastic | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FFC 0.5MM 60POS
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pacchetto: - |
Azione6.066 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 60 | 0.020" (0.50mm) | Solder | 0.30mm | 0.083" (2.10mm) | Flip Lock | Notched | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention | - | -40°C ~ 85°C | - |
||
JAE Electronics |
CONN FPC BOTTOM 17POS 0.30MM R/A
|
pacchetto: - |
Azione2.142 |
|
Surface Mount, Right Angle | Contacts, Bottom | 17 | 0.012" (0.30mm) | Solder | 0.12mm | 0.036" (0.90mm) | Flip Lock | Straight | Copper Alloy | Gold | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 30POS 0.50MM SMD
|
pacchetto: - |
Azione4.248 |
|
Board Edge, Cutout | Contacts, Bottom | 30 | 0.020" (0.50mm) | Solder | 0.30mm | - | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 33POS 0.30MM R/A
|
pacchetto: - |
Azione3.978 |
|
Surface Mount, Right Angle | Contacts, Bottom | 33 | 0.012" (0.30mm) | Solder | 0.12mm | 0.036" (0.90mm) | Flip Lock | Straight | Copper Alloy | Gold | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC 45POS 0.2MM
|
pacchetto: - |
Azione4.158 |
|
Surface Mount, Right Angle | Contacts, Bottom | 45 | 0.079" (2.00mm) | Solder | 0.20mm | 0.047" (1.20mm) | Rotary Lock | Tapered | Copper Alloy | Gold | Synthetic Resin | Synthetic Resin | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 8POS 0.50MM SMD
|
pacchetto: - |
Azione8.640 |
|
Board Edge, Cutout | Contacts, Bottom | 8 | 0.020" (0.50mm) | Solder | 0.30mm | - | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC TOP 29POS 0.30MM R/A
|
pacchetto: - |
Azione5.022 |
|
Surface Mount, Right Angle | Contacts, Top | 29 | 0.012" (0.30mm) | Solder | 0.20mm | 0.047" (1.20mm) | Rotary Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC TOP 25POS 0.30MM R/A
|
pacchetto: - |
Azione5.454 |
|
Surface Mount, Right Angle | Contacts, Top | 25 | 0.012" (0.30mm) | Solder | 0.20mm | 0.047" (1.20mm) | Rotary Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 31POS 0.30MM R/A
|
pacchetto: - |
Azione3.240 |
|
Surface Mount, Right Angle | Contacts, Bottom | 31 | 0.012" (0.30mm) | Solder | 0.12mm | 0.036" (0.90mm) | Flip Lock | Straight | Copper Alloy | Gold | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 59POS 0.30MM R/A
|
pacchetto: - |
Azione2.376 |
|
Surface Mount, Right Angle | Contacts, Bottom | 59 | 0.012" (0.30mm) | Solder | 0.15mm | 0.047" (1.20mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 35POS 0.30MM R/A
|
pacchetto: - |
Azione2.376 |
|
Surface Mount, Right Angle | Contacts, Bottom | 35 | 0.012" (0.30mm) | Solder | 0.12mm | 0.036" (0.90mm) | Flip Lock | Straight | Copper Alloy | Gold | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 33POS 0.30MM R/A
|
pacchetto: - |
Azione2.520 |
|
Surface Mount, Right Angle | Contacts, Bottom | 33 | 0.012" (0.30mm) | Solder | 0.15mm | 0.047" (1.20mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 17POS 0.30MM R/A
|
pacchetto: - |
Azione8.676 |
|
Surface Mount, Right Angle | Contacts, Bottom | 17 | 0.012" (0.30mm) | Solder | 0.20mm | 0.075" (1.90mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 51POS 0.30MM R/A
|
pacchetto: - |
Azione8.946 |
|
Surface Mount, Right Angle | Contacts, Bottom | 51 | 0.012" (0.30mm) | Solder | 0.15mm | 0.047" (1.20mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 53POS 0.30MM R/A
|
pacchetto: - |
Azione6.858 |
|
Surface Mount, Right Angle | Contacts, Bottom | 53 | 0.012" (0.30mm) | Solder | 0.15mm | 0.047" (1.20mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC TOP 33POS 0.30MM R/A
|
pacchetto: - |
Azione6.318 |
|
Surface Mount, Right Angle | Contacts, Top | 33 | 0.012" (0.30mm) | Solder | 0.20mm | 0.047" (1.20mm) | Rotary Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 15POS 0.30MM R/A
|
pacchetto: - |
Azione7.272 |
|
Surface Mount, Right Angle | Contacts, Bottom | 15 | 0.012" (0.30mm) | Solder | 0.12mm | 0.036" (0.90mm) | Flip Lock | Straight | Copper Alloy | Gold | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC 39POS 0.2MM
|
pacchetto: - |
Azione8.784 |
|
Surface Mount, Right Angle | Contacts, Bottom | 39 | 0.079" (2.00mm) | Solder | 0.20mm | 0.047" (1.20mm) | Rotary Lock | Tapered | Copper Alloy | Gold | Synthetic Resin | Synthetic Resin | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 10POS 0.50MM SMD
|
pacchetto: - |
Azione8.406 |
|
Board Edge, Cutout | Contacts, Bottom | 10 | 0.020" (0.50mm) | Solder | 0.30mm | - | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 45POS 0.50MM R/A
|
pacchetto: - |
Azione7.884 |
|
Surface Mount, Right Angle | Contacts, Bottom | 45 | 0.020" (0.50mm) | Solder | 0.30mm | 0.057" (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 29POS 0.20MM R/A
|
pacchetto: - |
Azione4.680 |
|
Surface Mount, Right Angle | Contacts, Bottom | 29 | 0.008" (0.20mm) | Solder | 0.15mm | 0.039" (1.00mm) | Flip Lock | Tabbed | Copper Alloy | Gold | Plastic | Plastic | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 29POS 0.30MM R/A
|
pacchetto: - |
Azione3.400 |
|
Surface Mount, Right Angle | Contacts, Bottom | 29 | 0.012" (0.30mm) | Solder | 0.12mm | 0.036" (0.90mm) | Flip Lock | Straight | Copper Alloy | Gold | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 18POS 0.50MM R/A
|
pacchetto: - |
Azione3.132 |
|
Surface Mount, Right Angle | Contacts, Bottom | 18 | 0.020" (0.50mm) | Solder | 0.30mm | 0.057" (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 8POS 0.50MM R/A
|
pacchetto: - |
Azione4.554 |
|
Surface Mount, Right Angle | Contacts, Bottom | 8 | 0.020" (0.50mm) | Solder | 0.30mm | 0.057" (1.45mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |