Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC VOICE ECHO CANCEL 208LBGA
|
pacchetto: 208-LBGA |
Azione6.352 |
|
- | 1 | 1.6 V ~ 2 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 208-LBGA | 208-LBGA (17x17) |
||
Microsemi Corporation |
IC CODEC 2CH VOSLIC 46DB 44TQFP
|
pacchetto: - |
Azione38.004 |
|
2-Wire | 2 | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144TE-CSBGA
|
pacchetto: 144-BGA, CSPBGA |
Azione6.272 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 290mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Silicon Labs |
IC PROSLIC FXS DUAL -110V 50QFN
|
pacchetto: - |
Azione2.704 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 3CH 128LQFP
|
pacchetto: 128-LQFP |
Azione4.944 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 410mA | - | -40°C ~ 85°C | Surface Mount | 128-LQFP | 128-LQFP (14x20) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 SGL 44TQFP
|
pacchetto: 44-LQFP |
Azione54.336 |
|
LIU | 1 | 4.75 V ~ 5.25 V | 180mA | - | -40°C ~ 85°C | Surface Mount | 44-LQFP | 44-TQFP (10x10) |
||
Exar Corporation |
IC LIU/FRAMER TI/E1/J1 SGL 128LQ
|
pacchetto: 128-LQFP |
Azione7.616 |
|
- | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 128-LQFP | 128-LQFP (14x20) |
||
Cypress Semiconductor Corp |
IC RECLOCKER HOTLINK II 256LBGA
|
pacchetto: 256-LBGA Exposed Pad |
Azione6.512 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 900mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK 100-LBGA
|
pacchetto: 100-LBGA |
Azione34.224 |
|
LVTTL | - | 3.135 V ~ 3.465 V | 390mA | - | 0°C ~ 70°C | Surface Mount | 100-LBGA | 100-TBGA (11x11) |
||
Microchip Technology |
IC UNVRSL PHONE CIRCUIT 44SSOP
|
pacchetto: 44-SOP (0.291", 7.40mm Width) |
Azione176.520 |
|
- | 1 | - | 3.8mA | 900mW | -25°C ~ 75°C | Surface Mount | 44-SOP (0.291", 7.40mm Width) | 44-SSO |
||
Maxim Integrated |
IC TXRX T1 1-CHIP 3.3V 100-LQFP
|
pacchetto: 100-LQFP |
Azione26.208 |
|
HDLC, T1 | 1 | 3.14 V ~ 3.47 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 2CH 100TQFP
|
pacchetto: 100-LQFP |
Azione5.440 |
|
LIU | 2 | 3.135 V ~ 3.465 V | 260mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IXYS Integrated Circuits Division |
IC TRANSCEIVER MF 2CH 144-TQFP
|
pacchetto: - |
Azione5.296 |
|
- | - | - | - | - | - | - | - | - |
||
Maxim Integrated |
IC T1/E1/J1 64KCC ELEMENT 64LQFP
|
pacchetto: 64-LQFP |
Azione65.220 |
|
64KCC, E1, T1 | 1 | 3.14 V ~ 3.47 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-LQFP (10x10) |
||
Maxim Integrated |
IC TESTER BIT ERROR 3.3V 32-TQFP
|
pacchetto: 32-TQFP |
Azione5.984 |
|
T1 | 1 | 3 V ~ 3.6 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microsemi Corporation |
IC CODEC U-LAW PCM 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione3.920 |
|
PCM | 1 | 4.75 V ~ 5.25 V | 3mA | - | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microsemi Corporation |
IC SLIC 2CH 53DB 44TQFP
|
pacchetto: 44-TQFP Exposed Pad |
Azione501.816 |
|
2-Wire | 2 | 4.75 V ~ 5.25 V | - | - | -40°C ~ 85°C | Surface Mount | 44-TQFP Exposed Pad | 44-TQFP-EP (10x10) |
||
Microsemi Corporation |
IC SLIC 1CH 52DB LGBAL 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione140.160 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Silicon Labs |
IC PROSLIC FXS ISI -106V 48QFN
|
pacchetto: - |
Azione6.128 |
|
3-Wire, PCM | 2 | 3.3V | - | - | 0°C ~ 70°C | - | - | - |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 28-SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione5.776 |
|
TTL | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Silicon Labs |
IC PROSLIC FXS ISI -140V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione3.520 |
|
- | - | - | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Microsemi Corporation |
IC TRACKING BATT 150V 2CH 64QFN
|
pacchetto: 64-VFQFN Exposed Pad |
Azione139.812 |
|
PCM | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Microsemi Corporation |
IC RECEIVER DTMF 18SOIC
|
pacchetto: 18-SOIC (0.295", 7.50mm Width) |
Azione245.796 |
|
- | 1 | 4.75 V ~ 5.25 V | 3mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
Microsemi Solutions Sdn Bhd. |
IC ETHERNET RGMII/RMII 68QFN
|
pacchetto: - |
Azione10.032 |
|
RMII | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | - | 68-QFN (8x8) |
||
Microchip Technology |
SINGLE 10G (R)XAUI PHY WITH PREM
|
pacchetto: - |
Azione4.416 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
EIGHT CHANNEL COMBINED T1/E1/J1
|
pacchetto: - |
Azione5.936 |
|
E1, J1, SPI, T1 | 8 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | - | 256-CABGA (17x17) |
||
Microchip Technology |
IC SLIC 2CH 58 DB LG BAL 44PLCC
|
pacchetto: - |
Azione6.112 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC VOICE LINE VCPNG 72CH 128TQFP
|
pacchetto: 128-TQFP |
Azione5.744 |
|
2-Wire | - | - | - | - | - | Surface Mount | 128-TQFP | 128-TQFP |
||
Microchip Technology |
2CH 120V ABS MISLIC PCM, 53QFN,
|
pacchetto: - |
Azione5.136 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC ETHERNET RGMII/RMII 48-QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione9.912 |
|
RMII | 1 | - | - | - | - | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (6x6) |