Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC LINE INTERFACE/FRAMER BGA-272
|
pacchetto: 272-BGA |
Azione4.880 |
|
DS3 / E3, E3 / T3, HDLC / PPP | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 272-BGA | 272-BGA (27x27) |
||
Infineon Technologies |
IC LIU E1/T1/J1 144TQFP
|
pacchetto: 144-LQFP |
Azione2.944 |
|
E1, J1, SCI, SPI, T1 | 2 | 1.8V, 3.3V | - | 150mW | -40°C ~ 85°C | Surface Mount | 144-LQFP | PG-TQFP-144 |
||
Silicon Labs |
IC PROSLIC FXS DTMF -110V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione2.512 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Inphi Corporation |
IC SDH FRAMER MAPPER 1020UBGA
|
pacchetto: 1020-BGA |
Azione3.312 |
|
SPI-4.2 | - | - | - | - | - | Surface Mount | 1020-BGA | 1020-FCBGA (33x33) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 6CH 217BGA
|
pacchetto: 217-BBGA |
Azione2.496 |
|
LIU | 6 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 217-BBGA | 217-BGA (23x23) |
||
Exar Corporation |
IC LIU STS1/DS3/E3 SGL 44TQFP
|
pacchetto: 44-LQFP |
Azione4.784 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 125mA | - | -40°C ~ 85°C | Surface Mount | 44-LQFP | 44-TQFP (10x10) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 12P 484-BGA
|
pacchetto: 484-BGA |
Azione6.560 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-BGA (23x23) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144-CSBGA
|
pacchetto: 144-BGA, CSPBGA |
Azione4.304 |
|
LIU | 2 | 3.3V | 150mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Intersil |
IC SLIC RINGING 3.3V VOB 32-QFN
|
pacchetto: 32-VQFN Exposed Pad |
Azione7.088 |
|
- | 1 | 3.3V | - | 305mW | 0°C ~ 75°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (7x7) |
||
Silicon Labs |
IC ISOMODEM LINE-SIDE DAA 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione19.596 |
|
Parallel, SPI, UART | 1 | 3 V ~ 3.6 V | 8.5mA | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC MONO FEATURE PHONE 44SSOP
|
pacchetto: 44-SOP (0.291", 7.40mm Width) |
Azione5.488 |
|
- | 1 | - | - | 900mW | -25°C ~ 75°C | Surface Mount | 44-SOP (0.291", 7.40mm Width) | 44-SSO |
||
IXYS Integrated Circuits Division |
IC DAA W/HALF-WAVE RING 32-SOIC
|
pacchetto: 32-SOIC (0.295", 7.50mm Width) |
Azione96.624 |
|
- | 1 | 3 V ~ 5.5 V | 10mA | 1W | 0°C ~ 85°C | Surface Mount | 32-SOIC (0.295", 7.50mm Width) | 32-SOIC |
||
Microsemi Solutions Sdn Bhd. |
IC ETHERNET RGMII/RMII 68-QFN
|
pacchetto: - |
Azione5.760 |
|
- | - | - | - | - | - | - | - | - |
||
NXP |
IC C2K 650MHZ 8CH VOIP 625BGA
|
pacchetto: - |
Azione5.376 |
|
- | - | - | - | - | - | - | - | - |
||
Exar Corporation |
IC LIU T1/E1/J1 QUAD 128TQFP
|
pacchetto: 128-LQFP |
Azione2.000 |
|
LIU | 4 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 128-LQFP | 128-TQFP (14x20) |
||
Silicon Labs |
IC DAA FCC+ EMBEDDED 10SOIC
|
pacchetto: - |
Azione5.792 |
|
- | 1 | - | 9mA | - | 0°C ~ 70°C | Surface Mount | - | - |
||
Silicon Labs |
IC PROSLIC FXS DUAL -140V 50QFN
|
pacchetto: - |
Azione7.232 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Silicon Labs |
IC PROSLIC FXS FXO -136V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione6.048 |
|
- | - | - | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Silicon Labs |
IC PROSLIC FXS PCM DTMF 56QFN
|
pacchetto: - |
Azione6.816 |
|
3-Wire, PCM | 2 | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 44-TQFP
|
pacchetto: 44-TQFP |
Azione3.328 |
|
- | 1 | 4.75 V ~ 5.25 V | 1.6mA | - | -40°C ~ 110°C | Surface Mount | 44-TQFP | 44-TQFP (10x10) |
||
Silicon Labs |
IC PROSLIC FXS ISI -106V 36QFN
|
pacchetto: - |
Azione4.672 |
|
3-Wire | 1 | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
Microsemi Solutions Sdn Bhd. |
IC ETHERNET RGMII/RMII 48-QFN
|
pacchetto: - |
Azione8.736 |
|
RMII | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | - | 48-QFN (6x6) |
||
Microsemi Corporation |
74-PORT (185G) STS-1 CROSS-CONNE
|
pacchetto: - |
Azione6.672 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
ARROW 2XGE PB FREE
|
pacchetto: 896-BGA |
Azione7.136 |
|
GMII, SerDes | 2 | 1.8V | - | - | -40°C ~ 85°C | Surface Mount | 896-BGA | 896-FCBGA |
||
Microchip Technology |
IC ETHERNET PHY QUAD 138QFN
|
pacchetto: - |
Azione5.872 |
|
- | 2 | 2.5V | - | - | -40°C ~ 110°C | Surface Mount | - | 138-QFN (12x12) |
||
Broadcom Limited |
MULTI LAYER SWITCH--1588 ENABLED
|
pacchetto: - |
Azione4.848 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC DGTL TELEPHONE CIRCUIT 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione5.280 |
|
- | 1 | 4.75V ~ 5.25V | 400µA | - | -40°C ~ 85°C | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC RECEIVER DTMF 18DIP
|
pacchetto: 18-DIP (0.300", 7.62mm) |
Azione4.096 |
|
- | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Through Hole | 18-DIP (0.300", 7.62mm) | 18-PDIP |
||
Microchip Technology |
ARROW M8XFE
|
pacchetto: - |
Azione6.576 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC DGTL SWITCH ISO-CMOS 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione4.736 |
|
- | 1 | 4.75V ~ 5.25V | 6mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.57x16.57) |