Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Exar Corporation |
IC LIU LH/SH T1/E1 SGL 64SQFP
|
pacchetto: 64-LQFP |
Azione3.872 |
|
LIU | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-TQFP (10x10) |
||
Microsemi Corporation |
IC DIGITAL SWITCH 16K CH 272BGA
|
pacchetto: 272-BBGA |
Azione5.376 |
|
- | 1 | 1.71 V ~ 1.89 V | 240mA | - | -40°C ~ 85°C | Surface Mount | 272-BBGA | 272-PBGA (27x27) |
||
Microsemi Corporation |
IC TDM SWITCH 1K-CH ENH 256BGA
|
pacchetto: 256-BGA |
Azione6.336 |
|
- | 1 | 1.71 V ~ 1.89 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-PBGA (17x17) |
||
Maxim Integrated |
IC 8CH DS3/3 FRAMER 349-BGA
|
pacchetto: 349-BGA Exposed Pad |
Azione5.728 |
|
LIU | - | 3.135 V ~ 3.465 V | 640mA | - | -40°C ~ 85°C | Surface Mount | 349-BGA Exposed Pad | 349-HCBGA (27x27) |
||
Maxim Integrated |
IC TXRX DS3/E3 100-CSBGA
|
pacchetto: 100-LBGA, CSBGA |
Azione4.336 |
|
DS3, E3 | 1 | 3.135 V ~ 3.465 V | 120mA | - | -40°C ~ 85°C | Surface Mount | 100-LBGA, CSBGA | 100-CSBGA (11x11) |
||
Microchip Technology |
IC MONO FEATURE PHONE 44SSOP
|
pacchetto: 44-SOP (0.291", 7.40mm Width) |
Azione4.272 |
|
- | 1 | - | - | 900mW | -25°C ~ 75°C | Surface Mount | 44-SOP (0.291", 7.40mm Width) | 44-SSO |
||
Maxim Integrated |
IC RECEIVE LINE INTERFACE 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione2.384 |
|
T1 | 1 | 4.75 V ~ 5.25 V | 18mA | - | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Maxim Integrated |
IC TXRX E1 1-CHIP 3.3V 100-LQFP
|
pacchetto: 100-LQFP |
Azione36.624 |
|
E1, HDLC | 1 | 3.14 V ~ 3.47 V | 75mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Maxim Integrated |
IC TXRX E1 QUAD 100-LQFP
|
pacchetto: 100-LQFP |
Azione16.260 |
|
E1 | 4 | 3.14 V ~ 3.47 V | 230mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/E1 8CH SHORT 144-TQFP
|
pacchetto: 144-LQFP |
Azione7.120 |
|
LIU | - | 3.13 V ~ 3.47 V | 55mA | - | -40°C ~ 85°C | Surface Mount | 144-LQFP | 144-TQFP (20x20) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 1CH 52TQFP
|
pacchetto: 52-LQFP |
Azione4.992 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 120mA | - | -40°C ~ 85°C | Surface Mount | 52-LQFP | 52-TQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC LINE INTERFC UNIT 4CH 128TQFP
|
pacchetto: 128-LQFP |
Azione2.224 |
|
LIU | - | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 128-LQFP | 128-TQFP (14x20) |
||
IDT, Integrated Device Technology Inc |
IC TXRX T1/J1/E1 2CHAN 100TQFP
|
pacchetto: 100-LQFP |
Azione6.256 |
|
SPI | 2 | 3 V ~ 3.6 V | - | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
IDT, Integrated Device Technology Inc |
IC LIU E1 4CH SHORT HAUL 160-BGA
|
pacchetto: 160-BGA |
Azione3.488 |
|
LIU | - | 3.13 V ~ 3.47 V | 40mA | - | -40°C ~ 85°C | Surface Mount | 160-BGA | 160-PBGA (15x15) |
||
Silicon Labs |
IC DAA FCC+ EMBEDDED 10SOIC
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione7.360 |
|
- | 1 | - | 9mA | - | 0°C ~ 70°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP |
||
Silicon Labs |
IC PROSLIC FXS DTMF -110V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione7.456 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 150MA 8SMD
|
pacchetto: 8-SMD, Gull Wing |
Azione4.384 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Surface Mount | 8-SMD, Gull Wing | 8-SMD |
||
Intersil |
IC LINE DRIVER VDSL2 DIFF 16QFN
|
pacchetto: 16-TQFN Exposed Pad |
Azione5.760 |
|
- | 1 | ±4 V ~ 6.6 V, 8 V ~ 13.2 V | - | - | -40°C ~ 85°C | Surface Mount | 16-TQFN Exposed Pad | 16-QFN (4x4) |
||
Microsemi Corporation |
IC RECEIVER DTMF 18DIP
|
pacchetto: 18-DIP (0.300", 7.62mm) |
Azione584.736 |
|
- | 1 | 4.75 V ~ 5.25 V | 3mA | - | -40°C ~ 85°C | Through Hole | 18-DIP (0.300", 7.62mm) | 18-PDIP |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SWITC 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.708 |
|
- | 2 | 3 V ~ 3.6 V | 4.5mA | - | -40°C ~ 110°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
STMicroelectronics |
IC TXRX S-FSK PWR LINE 48VFQFPN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione100.320 |
|
UART | 1 | 8 V ~ 18 V | 500µA | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-VFQFPN (7x7) |
||
Broadcom Limited |
SWITCH FABRIC
|
pacchetto: - |
Azione2.864 |
|
- | - | - | - | - | - | - | - | - |
||
Renesas Electronics America |
IC SLIC UNIVERSAL LP 32-PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.972 |
|
- | 1 | 4.75 V ~ 5.25 V | 2.25mA | 1.4W | -40°C ~ 85°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Renesas Electronics America |
IC VDSL2 LINE DVR AMP 10HMSOP
|
pacchetto: 10-VFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad |
Azione15.516 |
|
- | 2 | 4.5 V ~ 12 V | 6mA | - | -40°C ~ 85°C | Surface Mount | 10-VFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad | 10-HMSOP |
||
Microchip Technology |
SONET/SDH TRANSPORT FRAMER/AGGRE
|
pacchetto: - |
Azione2.960 |
|
SFI-4 | - | 1.2V | - | - | - | Surface Mount | - | 1292-FCBGA |
||
Microchip Technology |
IC VOICE ECHO CANCEL 365MCMBGA
|
pacchetto: 365-BBGA |
Azione2.368 |
|
- | 1 | 3V ~ 3.6V | 65µA | - | -40°C ~ 85°C | Surface Mount | 365-BBGA | 365-BGA (27x27) |
||
Microchip Technology |
IC DIGITAL SWITCH 12K CH 272BGA
|
pacchetto: 272-BBGA |
Azione7.616 |
|
- | - | 1.71V ~ 1.89V | 240mA | - | -40°C ~ 85°C | Surface Mount | 272-BBGA | 272-PBGA (27x27) |
||
Microchip Technology |
IC DGTL SWITCH 2048X2048 100MQFP
|
pacchetto: 100-BQFP |
Azione7.760 |
|
- | 1 | 4.75V ~ 5.25V | 170mA | - | -40°C ~ 85°C | Surface Mount | 100-BQFP | 100-MQFP (14x20) |
||
Microchip Technology |
IC SYNCHRONIZER T1/E1 48SSOP
|
pacchetto: 48-SSOP (0.295", 7.50mm Width) |
Azione5.808 |
|
- | 1 | 3V ~ 3.6V | 50mA | - | -40°C ~ 85°C | Surface Mount | 48-SSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Microchip Technology |
IC SLIC 2CH UNIV 100V 48QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione5.392 |
|
4-Wire | 2 | 3.135V ~ 3.465V | 25mA | - | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |