Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC ECHO CANCELLER AEC 36SSOP
|
pacchetto: 36-BSOP (0.295", 7.50mm Width) |
Azione3.712 |
|
Serial | 1 | 2.7 V ~ 3.6 V | 20mA | - | -40°C ~ 85°C | Surface Mount | 36-BSOP (0.295", 7.50mm Width) | 36-SSOP |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CHIPLE 32QFN
|
pacchetto: 32-VQFN Exposed Pad |
Azione3.056 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (8x8) |
||
Silicon Labs |
IC PROSLIC FXS DTMF -110V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione6.320 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Cirrus Logic Inc. |
IC LIU OCTAL E1 144LQFP
|
pacchetto: 144-LQFP |
Azione43.356 |
|
E1 | 8 | 3.135 V ~ 3.465 V | - | 1.04W | -40°C ~ 85°C | Surface Mount | 144-LQFP | 144-LQFP (20x20) |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK 196LBGA
|
pacchetto: 196-LBGA |
Azione5.904 |
|
LVTTL | 2 | 3.135 V ~ 3.465 V | 570mA | - | 0°C ~ 70°C | Surface Mount | 196-LBGA | 196-FBGA (15x15) |
||
Intersil |
IC SLIC RINGING LP HOME 28-PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.944 |
|
- | 1 | 5V | 5mA | 305mW | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Silicon Labs |
IC SLIC PROG DUAL-CH 64TQFP
|
pacchetto: 64-TQFP |
Azione5.136 |
|
ISDN | 2 | 3.13 V ~ 3.47 V | 28mA | 280mW | -40°C ~ 85°C | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 16MLP
|
pacchetto: 16-VDFN Exposed Pad |
Azione3.136 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-VDFN Exposed Pad | 16-MLP (7x6) |
||
IXYS Integrated Circuits Division |
IC OPT-ISOLATED MULTIFUNC 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione7.552 |
|
- | 1 | - | - | 1W | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
IXYS Integrated Circuits Division |
IC MOD DAA HALF-WAVE LOOP PCB
|
pacchetto: 18-DIP Module (0.850", 21.59mm), 11 Leads |
Azione7.088 |
|
- | 1 | 5V | 8mA | - | 0°C ~ 70°C | Through Hole | 18-DIP Module (0.850", 21.59mm), 11 Leads | 18-DIP |
||
Microsemi Corporation |
IC DIGITAL SWITCH 12K CH 272BGA
|
pacchetto: 272-BBGA |
Azione6.320 |
|
- | - | 1.71 V ~ 1.89 V | 240mA | - | -40°C ~ 85°C | Surface Mount | 272-BBGA | 272-PBGA (27x27) |
||
Microsemi Corporation |
IC TDM SWITCH 1K-CH ENH 256LQFP
|
pacchetto: 256-LQFP |
Azione2.096 |
|
- | 1 | 1.71 V ~ 1.89 V | 115mA | - | -45°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione2.768 |
|
- | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microsemi Corporation |
IC RECEIVER DTMF 50DB 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione3.936 |
|
Parallel | 1 | 4.75 V ~ 5.25 V | 3mA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microsemi Corporation |
IC SLIC 1CH UNIV 100V 40QFN
|
pacchetto: - |
Azione140.208 |
|
Serial | 1 | 3.3V | - | - | - | Surface Mount | - | 40-QFN |
||
Maxim Integrated |
IC TXRX T1/E1/J1 1-CHIP 100CSBGA
|
pacchetto: 100-LFBGA, CSPBGA |
Azione6.016 |
|
E1, HDLC, J1, T1 | 1 | 3.14 V ~ 3.47 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LFBGA, CSPBGA | 100-CSBGA (10x10) |
||
Microchip Technology |
IC VOIP IP PHONE ASSP 128QFP
|
pacchetto: 128-BFQFP |
Azione15.960 |
|
LCD | - | - | - | - | - | Surface Mount | 128-BFQFP | 128-PQFP (14x20) |
||
Microsemi Corporation |
IC VOICE PROCESSOR 100LQFP
|
pacchetto: 100-LQFP |
Azione18.660 |
|
I2S, SPI, UART | 2 | - | - | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Microchip Technology |
SINGLE 10G (R)XAUI PHY WITH PREM
|
pacchetto: - |
Azione4.416 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC ETHERNET SWITCH 672FCBGA
|
pacchetto: - |
Azione6.544 |
|
PCI | 1 | - | - | - | -40°C ~ 110°C | Surface Mount | - | 672-FCBGA (27x27) |
||
Microchip Technology |
IC SLIC 1CH 52DB LGBAL 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.440 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
IC VOICEPORT 2CH SLIC 150V 24QFN
|
pacchetto: 24-QFN |
Azione7.584 |
|
PCM | 2 | - | - | - | - | Surface Mount | 24-QFN | 24-QFN (6x6) |
||
Broadcom Limited |
IP PHONE CHIP
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
TRAFFIC MGR + PACKETPROC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
TRANSCEIVER
|
pacchetto: - |
Request a Quote |
|
Ethernet | 1 | - | - | - | - | - | - | - |
||
Broadcom Limited |
HIGH PERFORMANCE VDSL2/ADSL2 ROU
|
pacchetto: - |
Request a Quote |
|
ADSL, DSL | 1 | - | - | - | - | - | - | - |
||
Infineon Technologies |
ISDN CONTROLLER 8192KBPS 5V
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
LANTIQ PSB7531 TELECOMS IC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |