Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC C1K 650MHZ VOIP 448BGA
|
pacchetto: - |
Azione2.160 |
|
- | - | - | - | - | - | - | - | - |
||
NXP |
IC C1K 650MHZ VOIP 484MAPBGA
|
pacchetto: - |
Azione4.016 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
IC SUBSCRIBER NETWRK DSIC 24DIP
|
pacchetto: - |
Azione4.496 |
|
- | 1 | 4.75 V ~ 5.25 V | 10mA | - | -40°C ~ 85°C | Through Hole | - | 24-PDIP |
||
Inphi Corporation |
IC ETH AGGREGATOR 4PORT 1369-BGA
|
pacchetto: 1369-BGA |
Azione7.072 |
|
Interlaken, XAUI | - | - | - | - | - | Surface Mount | 1369-BGA | 1369-BGA (37.5x37.5) |
||
Intersil |
IC SLIC UNIVERSAL LP 28-PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione5.264 |
|
- | 1 | 4.75 V ~ 5.25 V | 2.25mA | 1.5W | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Maxim Integrated |
IC TXRX LIU 256CSBGA
|
pacchetto: 256-LBGA, CSBGA |
Azione2.784 |
|
LIU | 16 | 3.135 V ~ 3.465 V | 500mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 16MLP
|
pacchetto: 16-VDFN Exposed Pad |
Azione7.584 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-VDFN Exposed Pad | 16-MLP (7x6) |
||
IXYS Integrated Circuits Division |
IC OPT-ISOLATED MULTIFUNC 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione25.200 |
|
- | 1 | - | - | 1W | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Maxim Integrated |
IC TRANSCEIVER T1 QUAD 5V 256BGA
|
pacchetto: 256-BGA |
Azione19.320 |
|
T1 | 4 | 5V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
Maxim Integrated |
IC TXRX E1 5V 100-LQFP
|
pacchetto: 100-LQFP |
Azione2.720 |
|
E1, HDLC, J1, T1 | 1 | 4.75 V ~ 5.25 V | 75mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Microsemi Corporation |
IC TDM SWITCH 512CH 144LBGA
|
pacchetto: 144-LBGA |
Azione6.704 |
|
- | 1 | 3 V ~ 3.6 V | 250mA | - | -40°C ~ 85°C | Surface Mount | 144-LBGA | 144-LBGA (13x13) |
||
IDT, Integrated Device Technology Inc |
IC LIU E1 8CH SHORT HAUL 160-BGA
|
pacchetto: 160-BGA |
Azione5.728 |
|
- | - | 3.13 V ~ 3.47 V | - | - | - | Surface Mount | 160-BGA | 160-PBGA (15x15) |
||
Microsemi Corporation |
IC CODEC/FILTER 4CH 20I/O 44TQFP
|
pacchetto: 44-TQFP |
Azione6.560 |
|
PCM | 4 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 44-TQFP | 44-TQFP (10x10) |
||
Silicon Labs |
IC PROSLIC FXS ISI -140V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione7.776 |
|
- | - | - | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Broadcom Limited |
TRAFFIC MGR PACKETPROC
|
pacchetto: - |
Azione6.160 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC ETHERNET RGMII/RMII 68QFN
|
pacchetto: 68-VFQFN Exposed Pad |
Azione14.586 |
|
RMII | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN (8x8) |
||
Broadcom Limited |
SWITCH
|
pacchetto: - |
Azione5.040 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
HDLIU# 32
|
pacchetto: - |
Azione4.368 |
|
E1, J1, T1 | - | - | - | - | - | - | - | - |
||
Texas Instruments |
DSP WIRED COMM.
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
TRANSCEIVER
|
pacchetto: - |
Request a Quote |
|
Serial | 4 | - | - | - | - | - | - | - |
||
Broadcom Limited |
BACKHAUL ACCESS SWITCH. BLOWN
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
TRANSCEIVER
|
pacchetto: - |
Request a Quote |
|
Ethernet | 1 | - | - | - | - | - | - | - |
||
Broadcom Limited |
63168V+6302+53124S VDSL
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
MaxLinear, Inc. |
IC
|
pacchetto: - |
Request a Quote |
|
- | 4 | 1.8V, 3.3V | - | - | - | Surface Mount | 56-VFQFN Exposed Pad | 56-VQFN (7x7) |
||
Harris Corporation |
SLIC
|
pacchetto: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -42V ~ -58V, 4.75V ~ 5.25V | - | 200 mW | -40°C ~ 85°C | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CERDIP |
||
Broadcom Limited |
BCM56684B1IFSBLG
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
QUAD-CHANNEL 10GBE SFI-TO-RXAUI
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
EIA/ITU 24V PABX SLIC WITH 25MA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |