Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
IC CONFIG DEVICE
|
pacchetto: 88-LFBGA |
Azione6.560 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 88-LFBGA | 88-UBGA (11x8) |
||
Altera |
IC CONFIG DEVICE
|
pacchetto: 100-BQFP |
Azione6.976 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (14x20) |
||
Xilinx Inc. |
IC PROM SERIAL 10K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione12.600 |
|
100kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SERIAL 128K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione2.352 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER 50K C-TEMP 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.824 |
|
500kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER CONFIG 1M 3.3V 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.128 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FPGA 512K CONFIG MEM 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione2.928 |
|
512kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FPGA 256K CONFIG MEM 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.840 |
|
256Kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FPGA 2M CONFIG MEM 44TQFP
|
pacchetto: 44-TQFP |
Azione6.208 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-TQFP (10x10) |
||
Microchip Technology |
IC FLASH CONFIG 4M 32TQFP
|
pacchetto: 32-TQFP |
Azione6.832 |
|
4Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC FLASH CONFIG 4M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione5.008 |
|
4Mb | 2.97 V ~ 3.63 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 128K 8LAP
|
pacchetto: 8-TDFN |
Azione7.888 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 32-TQFP
|
pacchetto: 32-TQFP |
Azione3.328 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 512K 8LAP
|
pacchetto: 8-TDFN |
Azione4.320 |
|
512kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Xilinx Inc. |
IC PROM SRL CONFIG 256K 44-VQFP
|
pacchetto: 44-TQFP |
Azione4.640 |
|
256Kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione2.288 |
|
256Kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM PROG C-TEMP 3.3V 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione31.752 |
|
100kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM FPGA 256KB 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.232 |
|
256Kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM FPGA 128KB 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.712 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SER CNFIG PROM 128K 3.3V 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione96.888 |
|
128kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SER CFG PROM 128K 3.3V 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione36.792 |
|
128kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC CONFIG DEVICE 440KBIT 32TQFP
|
pacchetto: 32-TQFP |
Azione6.512 |
|
440kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 32-TQFP | 32-TQFP (7x7) |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 2M 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione112.068 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
IC PROM REPROGR 1MB 44-VQFP
|
pacchetto: 44-TQFP |
Azione61.440 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Microchip Technology |
IC CONFIG SEEPROM 512K 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.976 |
|
512kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC SRL CONFIG EEPROM 64K 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.920 |
|
64kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Altera |
IC CONFIG DEVICE 1.6MBIT 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione92.268 |
|
1.6Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Intel |
IC CONFIG DEVICE 88UBGA
|
pacchetto: 88-LFBGA |
Azione4.592 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 88-LFBGA | 88-UBGA (11x8) |
||
Intel |
IC CONFIG DEVICE 8MBIT 100QFP
|
pacchetto: 100-BQFP |
Azione5.904 |
|
8MB | 3 V ~ 3.6 V | -40°C ~ 85°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 1.6MBIT 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione28.524 |
|
1.6Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |